JP5049717B2 - 多層配線基板 - Google Patents

多層配線基板 Download PDF

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Publication number
JP5049717B2
JP5049717B2 JP2007244878A JP2007244878A JP5049717B2 JP 5049717 B2 JP5049717 B2 JP 5049717B2 JP 2007244878 A JP2007244878 A JP 2007244878A JP 2007244878 A JP2007244878 A JP 2007244878A JP 5049717 B2 JP5049717 B2 JP 5049717B2
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Japan
Prior art keywords
wiring board
multilayer wiring
ground plane
plane
layer
Prior art date
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Application number
JP2007244878A
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English (en)
Japanese (ja)
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JP2009076721A5 (https=
JP2009076721A (ja
Inventor
章夫 堀内
徳孝 松下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2007244878A priority Critical patent/JP5049717B2/ja
Publication of JP2009076721A publication Critical patent/JP2009076721A/ja
Publication of JP2009076721A5 publication Critical patent/JP2009076721A5/ja
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Publication of JP5049717B2 publication Critical patent/JP5049717B2/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
JP2007244878A 2007-09-21 2007-09-21 多層配線基板 Active JP5049717B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007244878A JP5049717B2 (ja) 2007-09-21 2007-09-21 多層配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007244878A JP5049717B2 (ja) 2007-09-21 2007-09-21 多層配線基板

Publications (3)

Publication Number Publication Date
JP2009076721A JP2009076721A (ja) 2009-04-09
JP2009076721A5 JP2009076721A5 (https=) 2010-09-30
JP5049717B2 true JP5049717B2 (ja) 2012-10-17

Family

ID=40611411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007244878A Active JP5049717B2 (ja) 2007-09-21 2007-09-21 多層配線基板

Country Status (1)

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JP (1) JP5049717B2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5129783B2 (ja) * 2009-06-02 2013-01-30 日本特殊陶業株式会社 補強材付き配線基板及びその製造方法
JP2011124549A (ja) * 2009-11-11 2011-06-23 Canon Inc 半導体装置
JP5696549B2 (ja) 2011-03-22 2015-04-08 富士通セミコンダクター株式会社 配線基板
US9818682B2 (en) * 2014-12-03 2017-11-14 International Business Machines Corporation Laminate substrates having radial cut metallic planes
JP6105773B2 (ja) * 2016-02-19 2017-03-29 ルネサスエレクトロニクス株式会社 半導体装置
JP6613991B2 (ja) 2016-03-30 2019-12-04 富士通株式会社 配線基板の製造方法
JP7005186B2 (ja) * 2017-06-28 2022-01-21 京セラ株式会社 電子素子実装用基板、電子装置および電子モジュール

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000114676A (ja) * 1998-10-05 2000-04-21 Hitachi Media Electoronics Co Ltd 高周波モジュール
JP2001015638A (ja) * 1999-06-30 2001-01-19 Mitsumi Electric Co Ltd Ｉｃパッケージの基板
JP2001237505A (ja) * 2000-02-22 2001-08-31 Oki Electric Ind Co Ltd 多層プリント回路基板
JP2002111145A (ja) * 2000-09-29 2002-04-12 Kyocera Corp 回路基板
JP2003110203A (ja) * 2001-09-28 2003-04-11 Kyocera Corp 多数個取り配線基板およびその製造方法
JP2006114623A (ja) * 2004-10-13 2006-04-27 Nec Toppan Circuit Solutions Inc 基板モジュール及び印刷配線板並びにこれを用いた電子装置
JP4566046B2 (ja) * 2005-03-30 2010-10-20 京セラ株式会社 多数個取り配線基板

Also Published As

Publication number Publication date
JP2009076721A (ja) 2009-04-09

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