JP5038631B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP5038631B2
JP5038631B2 JP2006027436A JP2006027436A JP5038631B2 JP 5038631 B2 JP5038631 B2 JP 5038631B2 JP 2006027436 A JP2006027436 A JP 2006027436A JP 2006027436 A JP2006027436 A JP 2006027436A JP 5038631 B2 JP5038631 B2 JP 5038631B2
Authority
JP
Japan
Prior art keywords
light emitting
emitting device
light
emitting element
phosphor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006027436A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007208136A5 (enExample
JP2007208136A (ja
Inventor
秀明 坂口
昌宏 春原
直幸 小泉
晶紀 白石
裕一 田口
啓 村山
光敏 東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2006027436A priority Critical patent/JP5038631B2/ja
Publication of JP2007208136A publication Critical patent/JP2007208136A/ja
Publication of JP2007208136A5 publication Critical patent/JP2007208136A5/ja
Application granted granted Critical
Publication of JP5038631B2 publication Critical patent/JP5038631B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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  • Led Device Packages (AREA)
JP2006027436A 2006-02-03 2006-02-03 発光装置 Expired - Fee Related JP5038631B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006027436A JP5038631B2 (ja) 2006-02-03 2006-02-03 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006027436A JP5038631B2 (ja) 2006-02-03 2006-02-03 発光装置

Publications (3)

Publication Number Publication Date
JP2007208136A JP2007208136A (ja) 2007-08-16
JP2007208136A5 JP2007208136A5 (enExample) 2009-02-12
JP5038631B2 true JP5038631B2 (ja) 2012-10-03

Family

ID=38487311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006027436A Expired - Fee Related JP5038631B2 (ja) 2006-02-03 2006-02-03 発光装置

Country Status (1)

Country Link
JP (1) JP5038631B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101468696B1 (ko) * 2007-12-31 2014-12-08 서울반도체 주식회사 발광 소자
DE102008057174A1 (de) * 2008-11-13 2010-05-20 Osram Opto Semiconductors Gmbh Oberflächenmontierbare Vorrichtung
KR101573888B1 (ko) * 2009-03-31 2015-12-04 서울반도체 주식회사 측면 발광 다이오드 패키지
JP2012142410A (ja) 2010-12-28 2012-07-26 Rohm Co Ltd 発光素子ユニットおよびその製造方法、発光素子パッケージならびに照明装置
KR101939333B1 (ko) * 2011-10-07 2019-01-16 서울바이오시스 주식회사 발광 다이오드 패키지
JP6118575B2 (ja) * 2013-02-12 2017-04-19 日亜化学工業株式会社 発光装置
KR102189129B1 (ko) * 2014-06-02 2020-12-09 엘지이노텍 주식회사 발광 소자 모듈
JP6755090B2 (ja) 2014-12-11 2020-09-16 シチズン電子株式会社 発光装置及び発光装置の製造方法
JP2017130588A (ja) * 2016-01-21 2017-07-27 旭化成株式会社 紫外線発光装置
JP6279702B2 (ja) * 2016-12-26 2018-02-14 ローム株式会社 発光素子パッケージおよび照明装置
US20190334066A1 (en) * 2017-09-12 2019-10-31 Lg Innotek Co., Ltd. Light emitting device package

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002141559A (ja) * 2000-10-31 2002-05-17 Sanken Electric Co Ltd 発光半導体チップ組立体及び発光半導体リードフレーム
JP2002252372A (ja) * 2001-02-26 2002-09-06 Nichia Chem Ind Ltd 発光ダイオード
JP4072084B2 (ja) * 2003-03-24 2008-04-02 京セラ株式会社 発光素子収納用パッケージおよび発光装置
WO2005018008A1 (ja) * 2003-08-19 2005-02-24 Nichia Corporation 半導体素子
JP2005150484A (ja) * 2003-11-18 2005-06-09 Nichia Chem Ind Ltd 半導体発光素子用被膜及びその製造方法並びに半導体発光装置
JP4516337B2 (ja) * 2004-03-25 2010-08-04 シチズン電子株式会社 半導体発光装置

Also Published As

Publication number Publication date
JP2007208136A (ja) 2007-08-16

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