JP5033630B2 - 焼結体研磨部を持つ工具およびその製造方法 - Google Patents

焼結体研磨部を持つ工具およびその製造方法 Download PDF

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Publication number
JP5033630B2
JP5033630B2 JP2007532202A JP2007532202A JP5033630B2 JP 5033630 B2 JP5033630 B2 JP 5033630B2 JP 2007532202 A JP2007532202 A JP 2007532202A JP 2007532202 A JP2007532202 A JP 2007532202A JP 5033630 B2 JP5033630 B2 JP 5033630B2
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Japan
Prior art keywords
polishing
tool according
superabrasive
sintered body
polishing tool
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Expired - Fee Related
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JP2007532202A
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English (en)
Japanese (ja)
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JPWO2007023949A1 (ja
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博 石塚
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/21—Circular sheet or circular blank
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/2457—Parallel ribs and/or grooves
    • Y10T428/24579—Parallel ribs and/or grooves with particulate matter
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2007532202A 2005-08-25 2006-08-25 焼結体研磨部を持つ工具およびその製造方法 Expired - Fee Related JP5033630B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007532202A JP5033630B2 (ja) 2005-08-25 2006-08-25 焼結体研磨部を持つ工具およびその製造方法

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2005243529 2005-08-25
JP2005243529 2005-08-25
JP2006209236 2006-07-31
JP2006209236 2006-07-31
PCT/JP2006/316737 WO2007023949A1 (ja) 2005-08-25 2006-08-25 焼結体研磨部を持つ工具およびその製造方法
JP2007532202A JP5033630B2 (ja) 2005-08-25 2006-08-25 焼結体研磨部を持つ工具およびその製造方法

Publications (2)

Publication Number Publication Date
JPWO2007023949A1 JPWO2007023949A1 (ja) 2009-03-05
JP5033630B2 true JP5033630B2 (ja) 2012-09-26

Family

ID=37771687

Family Applications (1)

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JP2007532202A Expired - Fee Related JP5033630B2 (ja) 2005-08-25 2006-08-25 焼結体研磨部を持つ工具およびその製造方法

Country Status (12)

Country Link
US (1) US20090215366A1 (zh)
EP (1) EP1944125B1 (zh)
JP (1) JP5033630B2 (zh)
KR (1) KR101293461B1 (zh)
CN (2) CN101693353A (zh)
AU (1) AU2006282293B2 (zh)
BR (1) BRPI0615020A2 (zh)
CA (1) CA2620407A1 (zh)
IL (1) IL189314A (zh)
RU (1) RU2430827C2 (zh)
TW (1) TWI406736B (zh)
WO (1) WO2007023949A1 (zh)

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JP2009113133A (ja) * 2007-11-05 2009-05-28 Hiroshi Ishizuka Ｃｍｐパッド・コンディショナー
CN102858496B (zh) * 2010-04-27 2016-04-27 3M创新有限公司 陶瓷成形磨粒及其制备方法以及包含陶瓷成形磨粒的磨具制品
US20120171935A1 (en) * 2010-12-20 2012-07-05 Diamond Innovations, Inc. CMP PAD Conditioning Tool
JP5809880B2 (ja) * 2011-08-25 2015-11-11 新日鉄住金マテリアルズ株式会社 研磨布用ドレッサー
WO2013102177A1 (en) 2011-12-30 2013-07-04 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particle and method of forming same
SG11201500802TA (en) * 2012-08-02 2015-04-29 3M Innovative Properties Co Abrasive articles with precisely shaped features and method of making thereof
CN102862121B (zh) * 2012-09-17 2015-05-20 上海华力微电子有限公司 一种cmp研磨垫修整结构
EP2835220B1 (de) * 2013-08-07 2019-09-11 Reishauer AG Abrichtwerkzeug sowie ein Verfahren zu dessen Herstellung
JP5976228B2 (ja) * 2013-08-26 2016-08-23 株式会社東京精密 ダイシングブレード
KR20160071416A (ko) * 2013-10-18 2016-06-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 코팅된 연마 용품 및 그의 제조 방법
CN106463379B (zh) * 2014-03-21 2019-08-06 恩特格里斯公司 具有细长切割边缘的化学机械平坦化垫调节器
TWI609742B (zh) * 2015-04-20 2018-01-01 中國砂輪企業股份有限公司 研磨工具
CN108698202B (zh) * 2016-02-22 2021-06-04 联合材料公司 磨料工具
CN106078516B (zh) * 2016-06-21 2018-09-04 大连理工大学 一种cmp抛光垫修整器
EP3621771A1 (en) 2017-05-12 2020-03-18 3M Innovative Properties Company Tetrahedral abrasive particles in abrasive articles
CN111372728B (zh) 2017-11-21 2022-08-09 3M创新有限公司 涂覆研磨盘及其制备和使用方法
EP3713712B1 (en) 2017-11-21 2023-05-31 3M Innovative Properties Company Coated abrasive disc and methods of making and using the same
WO2019102329A1 (en) * 2017-11-21 2019-05-31 3M Innovative Properties Company Coated abrasive disc and methods of making and using the same
KR102026250B1 (ko) 2018-02-05 2019-09-27 에스케이실트론 주식회사 웨이퍼 연마 장치용 연마 패드 및 그의 제조방법
WO2019208640A1 (ja) * 2018-04-27 2019-10-31 住友電気工業株式会社 多結晶砥粒およびそれを備えた研削ホイール
TWI735795B (zh) * 2018-08-24 2021-08-11 宋健民 拋光墊修整器及化學機械平坦化的方法
KR102440315B1 (ko) * 2020-05-11 2022-09-06 한국생산기술연구원 패턴구조를 갖는 화학기계적 연마용 패드 및 이의 제조방법
CN112677062B (zh) * 2019-10-18 2022-12-09 江苏韦尔博新材料科技有限公司 一种打磨钢材磨盘的专用磨粒地貌、其金刚石磨盘与制备方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09254042A (ja) * 1996-03-15 1997-09-30 Symtec:Kk 溝切り用砥石およびその製造方法
JPH1071559A (ja) * 1996-05-23 1998-03-17 Asahi Daiyamondo Kogyo Kk ドレッサ及びその製造方法
JPH10138120A (ja) * 1996-10-31 1998-05-26 Kyocera Corp ドレッシング用治具
JP2000190200A (ja) * 1998-12-25 2000-07-11 Mitsubishi Materials Silicon Corp 研磨布のシ―ズニング治具
JP2000326318A (ja) * 1999-03-18 2000-11-28 Denso Corp ハニカム構造体成形用金型及びその製造方法
JP2001088028A (ja) * 1999-09-17 2001-04-03 Koremura Toishi Seisakusho:Kk ロータリードレッサー
US6524523B1 (en) * 1999-11-16 2003-02-25 Asia Ic Mic-Process, Inc. Method for forming dresser of chemical mechanical polishing pad
JP2003511255A (ja) * 1999-10-12 2003-03-25 フナテック カンパニー リミテッド 研磨パッド用コンディショナーおよびその製造方法

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JPS58199776A (ja) * 1982-05-12 1983-11-21 住友電気工業株式会社 工具用ダイヤモンド焼結体及びその製造方法
JPS6184303A (ja) * 1984-09-28 1986-04-28 Ishizuka Kenkyusho:Kk 複合焼結体の製造法
JP2601284B2 (ja) * 1987-09-01 1997-04-16 株式会社石塚研究所 焼結ダイヤモンド複合体、及びその製造方法
US4925457B1 (en) * 1989-01-30 1995-09-26 Ultimate Abrasive Syst Inc Method for making an abrasive tool
US5049165B1 (en) * 1989-01-30 1995-09-26 Ultimate Abrasive Syst Inc Composite material
US4954139A (en) * 1989-03-31 1990-09-04 The General Electric Company Method for producing polycrystalline compact tool blanks with flat carbide support/diamond or CBN interfaces
JPH08243927A (ja) * 1995-03-02 1996-09-24 Fuji Xerox Co Ltd 研削工具とその製造方法及び研削装置
US5560754A (en) * 1995-06-13 1996-10-01 General Electric Company Reduction of stresses in the polycrystalline abrasive layer of a composite compact with in situ bonded carbide/carbide support
US6054183A (en) * 1997-07-10 2000-04-25 Zimmer; Jerry W. Method for making CVD diamond coated substrate for polishing pad conditioning head
US6027659A (en) * 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
JPH11267902A (ja) * 1998-03-23 1999-10-05 Hiroshi Hashimoto 超微細切刃付き工具及び超微細切刃付き加工具
US6439986B1 (en) * 1999-10-12 2002-08-27 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same
JP2001347454A (ja) * 2000-06-09 2001-12-18 Koremura Toishi Seisakusho:Kk ドレッサーとその製造方法
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Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09254042A (ja) * 1996-03-15 1997-09-30 Symtec:Kk 溝切り用砥石およびその製造方法
JPH1071559A (ja) * 1996-05-23 1998-03-17 Asahi Daiyamondo Kogyo Kk ドレッサ及びその製造方法
JPH10138120A (ja) * 1996-10-31 1998-05-26 Kyocera Corp ドレッシング用治具
JP2000190200A (ja) * 1998-12-25 2000-07-11 Mitsubishi Materials Silicon Corp 研磨布のシ―ズニング治具
JP2000326318A (ja) * 1999-03-18 2000-11-28 Denso Corp ハニカム構造体成形用金型及びその製造方法
JP2001088028A (ja) * 1999-09-17 2001-04-03 Koremura Toishi Seisakusho:Kk ロータリードレッサー
JP2003511255A (ja) * 1999-10-12 2003-03-25 フナテック カンパニー リミテッド 研磨パッド用コンディショナーおよびその製造方法
US6524523B1 (en) * 1999-11-16 2003-02-25 Asia Ic Mic-Process, Inc. Method for forming dresser of chemical mechanical polishing pad

Also Published As

Publication number Publication date
IL189314A0 (en) 2008-06-05
TWI406736B (zh) 2013-09-01
EP1944125A1 (en) 2008-07-16
AU2006282293B2 (en) 2011-06-23
CN101247923B (zh) 2010-12-08
BRPI0615020A2 (pt) 2009-08-04
KR101293461B1 (ko) 2013-08-07
EP1944125B1 (en) 2012-01-25
TW200714416A (en) 2007-04-16
WO2007023949A1 (ja) 2007-03-01
RU2430827C2 (ru) 2011-10-10
CN101693353A (zh) 2010-04-14
IL189314A (en) 2013-01-31
RU2008110905A (ru) 2009-09-27
AU2006282293A1 (en) 2007-03-01
US20090215366A1 (en) 2009-08-27
JPWO2007023949A1 (ja) 2009-03-05
EP1944125A4 (en) 2009-12-16
CN101247923A (zh) 2008-08-20
KR20080037693A (ko) 2008-04-30
CA2620407A1 (en) 2007-03-01

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