AU2006282293B2 - Tool with sintered body polishing surface and method of manufacturing the same - Google Patents

Tool with sintered body polishing surface and method of manufacturing the same Download PDF

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Publication number
AU2006282293B2
AU2006282293B2 AU2006282293A AU2006282293A AU2006282293B2 AU 2006282293 B2 AU2006282293 B2 AU 2006282293B2 AU 2006282293 A AU2006282293 A AU 2006282293A AU 2006282293 A AU2006282293 A AU 2006282293A AU 2006282293 B2 AU2006282293 B2 AU 2006282293B2
Authority
AU
Australia
Prior art keywords
abrasive
tool
units
abrasive tool
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU2006282293A
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English (en)
Other versions
AU2006282293A1 (en
Inventor
Hiroshi Ishizuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU2006282293A1 publication Critical patent/AU2006282293A1/en
Application granted granted Critical
Publication of AU2006282293B2 publication Critical patent/AU2006282293B2/en
Ceased legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/21—Circular sheet or circular blank
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/2457—Parallel ribs and/or grooves
    • Y10T428/24579—Parallel ribs and/or grooves with particulate matter
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AU2006282293A 2005-08-25 2006-08-25 Tool with sintered body polishing surface and method of manufacturing the same Ceased AU2006282293B2 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2005-243529 2005-08-25
JP2005243529 2005-08-25
JP2006-209236 2006-07-31
JP2006209236 2006-07-31
PCT/JP2006/316737 WO2007023949A1 (ja) 2005-08-25 2006-08-25 焼結体研磨部を持つ工具およびその製造方法

Publications (2)

Publication Number Publication Date
AU2006282293A1 AU2006282293A1 (en) 2007-03-01
AU2006282293B2 true AU2006282293B2 (en) 2011-06-23

Family

ID=37771687

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2006282293A Ceased AU2006282293B2 (en) 2005-08-25 2006-08-25 Tool with sintered body polishing surface and method of manufacturing the same

Country Status (12)

Country Link
US (1) US20090215366A1 (zh)
EP (1) EP1944125B1 (zh)
JP (1) JP5033630B2 (zh)
KR (1) KR101293461B1 (zh)
CN (2) CN101247923B (zh)
AU (1) AU2006282293B2 (zh)
BR (1) BRPI0615020A2 (zh)
CA (1) CA2620407A1 (zh)
IL (1) IL189314A (zh)
RU (1) RU2430827C2 (zh)
TW (1) TWI406736B (zh)
WO (1) WO2007023949A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009113133A (ja) * 2007-11-05 2009-05-28 Hiroshi Ishizuka Ｃｍｐパッド・コンディショナー
CN102858496B (zh) * 2010-04-27 2016-04-27 3M创新有限公司 陶瓷成形磨粒及其制备方法以及包含陶瓷成形磨粒的磨具制品
US20120171935A1 (en) * 2010-12-20 2012-07-05 Diamond Innovations, Inc. CMP PAD Conditioning Tool
JP5809880B2 (ja) * 2011-08-25 2015-11-11 新日鉄住金マテリアルズ株式会社 研磨布用ドレッサー
CN109054745A (zh) 2011-12-30 2018-12-21 圣戈本陶瓷及塑料股份有限公司 成形磨粒及其形成方法
KR102089383B1 (ko) * 2012-08-02 2020-03-16 쓰리엠 이노베이티브 프로퍼티즈 컴파니 정밀하게 형상화된 특징부를 갖는 연마 물품 및 그의 제조 방법
CN102862121B (zh) * 2012-09-17 2015-05-20 上海华力微电子有限公司 一种cmp研磨垫修整结构
EP2835220B1 (de) * 2013-08-07 2019-09-11 Reishauer AG Abrichtwerkzeug sowie ein Verfahren zu dessen Herstellung
JP5976228B2 (ja) * 2013-08-26 2016-08-23 株式会社東京精密 ダイシングブレード
KR20160071416A (ko) * 2013-10-18 2016-06-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 코팅된 연마 용품 및 그의 제조 방법
CN106463379B (zh) * 2014-03-21 2019-08-06 恩特格里斯公司 具有细长切割边缘的化学机械平坦化垫调节器
TWI609742B (zh) * 2015-04-20 2018-01-01 中國砂輪企業股份有限公司 研磨工具
WO2017145491A1 (ja) 2016-02-22 2017-08-31 株式会社アライドマテリアル 砥粒工具
CN106078516B (zh) * 2016-06-21 2018-09-04 大连理工大学 一种cmp抛光垫修整器
CN110650819B (zh) 2017-05-12 2022-08-09 3M创新有限公司 磨料制品中的四面体磨料颗粒
EP3713714B1 (en) 2017-11-21 2022-04-13 3M Innovative Properties Company Coated abrasive disc and methods of making and using the same
JP6899490B2 (ja) 2017-11-21 2021-07-07 スリーエム イノベイティブ プロパティズ カンパニー 被覆研磨ディスク並びにその製造方法及び使用方法
WO2019102329A1 (en) * 2017-11-21 2019-05-31 3M Innovative Properties Company Coated abrasive disc and methods of making and using the same
KR102026250B1 (ko) * 2018-02-05 2019-09-27 에스케이실트론 주식회사 웨이퍼 연마 장치용 연마 패드 및 그의 제조방법
JP6918217B2 (ja) * 2018-04-27 2021-08-11 住友電気工業株式会社 多結晶砥粒およびそれを備えた研削ホイール
TWI735795B (zh) * 2018-08-24 2021-08-11 宋健民 拋光墊修整器及化學機械平坦化的方法
KR102440315B1 (ko) * 2020-05-11 2022-09-06 한국생산기술연구원 패턴구조를 갖는 화학기계적 연마용 패드 및 이의 제조방법
CN112677062B (zh) * 2019-10-18 2022-12-09 江苏韦尔博新材料科技有限公司 一种打磨钢材磨盘的专用磨粒地貌、其金刚石磨盘与制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58199776A (ja) * 1982-05-12 1983-11-21 住友電気工業株式会社 工具用ダイヤモンド焼結体及びその製造方法
JPH08243927A (ja) * 1995-03-02 1996-09-24 Fuji Xerox Co Ltd 研削工具とその製造方法及び研削装置
JPH1071559A (ja) * 1996-05-23 1998-03-17 Asahi Daiyamondo Kogyo Kk ドレッサ及びその製造方法
JP2001347454A (ja) * 2000-06-09 2001-12-18 Koremura Toishi Seisakusho:Kk ドレッサーとその製造方法
JP2003511255A (ja) * 1999-10-12 2003-03-25 フナテック カンパニー リミテッド 研磨パッド用コンディショナーおよびその製造方法

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JPS5739106A (en) * 1980-08-14 1982-03-04 Hiroshi Ishizuka Production of diamond ultrahard alloy composite
JPS6184303A (ja) * 1984-09-28 1986-04-28 Ishizuka Kenkyusho:Kk 複合焼結体の製造法
JP2601284B2 (ja) * 1987-09-01 1997-04-16 株式会社石塚研究所 焼結ダイヤモンド複合体、及びその製造方法
US4925457B1 (en) * 1989-01-30 1995-09-26 Ultimate Abrasive Syst Inc Method for making an abrasive tool
US5049165B1 (en) * 1989-01-30 1995-09-26 Ultimate Abrasive Syst Inc Composite material
US4954139A (en) * 1989-03-31 1990-09-04 The General Electric Company Method for producing polycrystalline compact tool blanks with flat carbide support/diamond or CBN interfaces
US5560754A (en) * 1995-06-13 1996-10-01 General Electric Company Reduction of stresses in the polycrystalline abrasive layer of a composite compact with in situ bonded carbide/carbide support
JPH09254042A (ja) * 1996-03-15 1997-09-30 Symtec:Kk 溝切り用砥石およびその製造方法
JPH10138120A (ja) * 1996-10-31 1998-05-26 Kyocera Corp ドレッシング用治具
US6054183A (en) * 1997-07-10 2000-04-25 Zimmer; Jerry W. Method for making CVD diamond coated substrate for polishing pad conditioning head
US6027659A (en) * 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
JPH11267902A (ja) * 1998-03-23 1999-10-05 Hiroshi Hashimoto 超微細切刃付き工具及び超微細切刃付き加工具
JP2000190200A (ja) * 1998-12-25 2000-07-11 Mitsubishi Materials Silicon Corp 研磨布のシ―ズニング治具
JP4332980B2 (ja) * 1999-03-18 2009-09-16 株式会社デンソー ハニカム構造体成形用金型の製造方法
JP2001088028A (ja) * 1999-09-17 2001-04-03 Koremura Toishi Seisakusho:Kk ロータリードレッサー
TW467802B (en) * 1999-10-12 2001-12-11 Hunatech Co Ltd Conditioner for polishing pad and method for manufacturing the same
TW436375B (en) * 1999-11-16 2001-05-28 Asia Ic Mic Process Inc Formation method for dresser of chemical mechanical polishing pad
US20060258276A1 (en) * 2005-05-16 2006-11-16 Chien-Min Sung Superhard cutters and associated methods
US20070060026A1 (en) * 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58199776A (ja) * 1982-05-12 1983-11-21 住友電気工業株式会社 工具用ダイヤモンド焼結体及びその製造方法
JPH08243927A (ja) * 1995-03-02 1996-09-24 Fuji Xerox Co Ltd 研削工具とその製造方法及び研削装置
JPH1071559A (ja) * 1996-05-23 1998-03-17 Asahi Daiyamondo Kogyo Kk ドレッサ及びその製造方法
JP2003511255A (ja) * 1999-10-12 2003-03-25 フナテック カンパニー リミテッド 研磨パッド用コンディショナーおよびその製造方法
JP2001347454A (ja) * 2000-06-09 2001-12-18 Koremura Toishi Seisakusho:Kk ドレッサーとその製造方法

Also Published As

Publication number Publication date
EP1944125A1 (en) 2008-07-16
KR20080037693A (ko) 2008-04-30
TWI406736B (zh) 2013-09-01
CA2620407A1 (en) 2007-03-01
JPWO2007023949A1 (ja) 2009-03-05
IL189314A (en) 2013-01-31
RU2430827C2 (ru) 2011-10-10
EP1944125B1 (en) 2012-01-25
RU2008110905A (ru) 2009-09-27
BRPI0615020A2 (pt) 2009-08-04
KR101293461B1 (ko) 2013-08-07
US20090215366A1 (en) 2009-08-27
JP5033630B2 (ja) 2012-09-26
TW200714416A (en) 2007-04-16
EP1944125A4 (en) 2009-12-16
CN101247923A (zh) 2008-08-20
IL189314A0 (en) 2008-06-05
WO2007023949A1 (ja) 2007-03-01
AU2006282293A1 (en) 2007-03-01
CN101247923B (zh) 2010-12-08
CN101693353A (zh) 2010-04-14

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Date Code Title Description
FGA Letters patent sealed or granted (standard patent)
MK14 Patent ceased section 143(a) (annual fees not paid) or expired