EP1944125B1 - Tool with sintered body polishing surface and method of manufacturing the same - Google Patents

Tool with sintered body polishing surface and method of manufacturing the same Download PDF

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Publication number
EP1944125B1
EP1944125B1 EP06796810A EP06796810A EP1944125B1 EP 1944125 B1 EP1944125 B1 EP 1944125B1 EP 06796810 A EP06796810 A EP 06796810A EP 06796810 A EP06796810 A EP 06796810A EP 1944125 B1 EP1944125 B1 EP 1944125B1
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EP
European Patent Office
Prior art keywords
abrasive
tool
units
grooves
abrasive tool
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EP06796810A
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German (de)
English (en)
French (fr)
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EP1944125A1 (en
EP1944125A4 (en
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Hiroshi Ishizuka
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Individual
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Publication of EP1944125A4 publication Critical patent/EP1944125A4/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/21—Circular sheet or circular blank
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/2457—Parallel ribs and/or grooves
    • Y10T428/24579—Parallel ribs and/or grooves with particulate matter
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet

Definitions

  • the present invention relates to a tool having an abrasive part of sintered superabrasive and a method for the manufacture of the same. More particularly, the invention relates to an abrasive tool for the conditioning of chemical-mechanical polishing (CMP) pads, which are commonly composed of hard urethane.
  • CMP chemical-mechanical polishing
  • the tool also can be effectively used for processing various semiconductor materials to achieve an efficient and high planarity performance.
  • This invention further relates to an effective method for the manufacture of such tool.
  • CMP has been used as an effective technique for planarizing interlayer insulation films and wafers of metal such as silicon.
  • polishing pads are employed, which is commonly made of hard urethane foam and which needs to be frequently conditioned on the surface in order to secure a high degree of planarity and wafer polishing rate.
  • Pad conditioning has been conventionally practiced with a tool in which diamond particles are fixed to a base plate by electrodeposition.
  • Electrodeposition conditioning tools are known, that comprise such a rotating abrasive tool, for example, that the circular surface of tool has a hollow central region with no abrasive particles thereon. There are further outer circular regions: in the first, next to the central region, smaller superabrasive particles are fixed by electrodeposition on several spaced rows of projections that are in the shape of partial sphere, and in the second, superabrasive particles are electrodeposited with metal on several ring-formed projections (Patent Document 1). Since the superabrasive particles are fixed to the base plate only with nickel metal deposit that physically rests over, their retention is not always enough to give an acceptable tool life, with some particles becoming loosened during a process.
  • abrasive tool whose abrasive material layer comprises particles of diamonds or the like, which are resin-bonded to the rotating circular top flat surface of the tool; the layer is sectioned with radial and concentric slits (Patent Document 2).
  • Patent Document 2 abrasive material layer comprises particles of diamonds or the like, which are resin-bonded to the rotating circular top flat surface of the tool; the layer is sectioned with radial and concentric slits.
  • Electrodeposition bonding technique cannot always achieve a sufficient tool life, either.
  • a dresser that comprises a thin film of polycrystalline diamond deposited by chemical vapor deposition on the projections of a base metal working surface (Patent Document 3).
  • An abrasive tool that is used as a CMP pad dresser is known from WO 2006/124792 A2 (& EP 1 879 719 A0 ; state of the art in accordance with Article 54(3) EPC).
  • This abrasive tool comprises an abrasive part that comprises a plurality of abrasive units and is composed of sintered superabrasive particles that are joined integrally and to a backing, wherein the abrasive units are arranged in said abrasive part along groups of linear grooves formed by wire electrical discharge machining and have upper ends arranged on an equal level.
  • the document is however silent about using cemented carbide as the backing material.
  • abrasive tools can only have a deposit of abrasive particles with the tops or upper ends not in a uniform but varying level because of the fluctuating particle sizes that those individual particles employed on the base plate (base metal) have.
  • Such feature causes a problem that a part alone of particles that is most protruding from the base plate (base metal) comes to be used in the conditioning process, and the partial excessive loading may cause a severe damage to the particles, eventually even leading to a premature termination of the tool life.
  • planarization of silicon or like metal wafers be practiced with a tool wherein particles of diamond or other superabrasive are fixed to the surface of a base plate of rigid metal, in the place of the polishing pad of urethane foam and loose abrasive particles that are conventionally used. That assumes that a high precision uniformity be provided and maintained for the surface of layer of abrasive particles, which are deposited on the base metal plate to provide cutting edges. Such tasks have not been fully solved heretofore, however.
  • One of the objects of the present invention is to provide an abrasive tool capable of efficient processing and an effective method for the manufacture of such tool, wherein the above described problems have been eliminated that are related to the both retention of abrasive particles to the base plate and the precision of polished surfaces.
  • This invention in particular, is to provide such tool to be effectively adaptable as CMP pad conditioner that enables an efficient production of high precision surfaces on semiconductor wafers or the like.
  • an abrasive tool as defined in claim 1. Further provided is such tool, wherein the upper ends of abrasive units have sharpened edges. Further provided is such tool, wherein the abrasive units are in a shape of truncated or non-truncated pyramid.
  • abrasive tool wherein the abrasive units are in a shape of truncated rectangular pyramid that have at least one of the top edges sharpened. Further provided is such abrasive tool, wherein the abrasive units are in a shape of truncated or non-truncated triangular pyramid. Further provided is such abrasive tool, wherein the abrasive units are in a shape of truncated triangular pyramid that have at least one of the top edges sharpened. Further provided is such abrasive tool, wherein the abrasive units comprise a linear ridge on the top thereof.
  • abrasive tool wherein the abrasive units are in a shape of rectangular or triangular pyramid arranged at a pitch of 200 ⁇ m or more but not exceeding 1,500 ⁇ m. Further provided is such abrasive tool, wherein the abrasive units are in a shape of non-truncated rectangular or triangular pyramid and has a height of 30 ⁇ m or more but not exceeding 200 ⁇ m. Further provided is such abrasive tool, wherein the superabrasive is diamond. Further provided is such abrasive tool, wherein the diamond particles have a nominal particle size of 40 to 60 ⁇ m or less.
  • abrasive tool wherein the layer of sintered superabrasive particles has a thickness of 0.1 mm or more. Further provided is such abrasive tool, wherein said abrasive tool is in a circular or annular shape.
  • abrasive tool wherein the abrasive part is in a circular or annular shape. Further provided is such abrasive tool, wherein the abrasive part has an outer diameter of 90 mm or more. Further provided is such abrasive tool, wherein the abrasive part has a height of 1 mm or less over a bottom of the grooves. Further provided is such abrasive tool, wherein the abrasive part consists of 2 or 4 equally divided segments that are in a shape of sector with an identical central angle.
  • abrasive tool wherein said segments each comprise two groups of grooves, a first group is parallel to a radial border of the segment and a second group is arranged to cross perpendicularly to said first group.
  • the abrasive part consists of 3 or 6 equally divided segments that are in a shape of sector with an identical central angle.
  • said segments each comprise three groups of grooves, and a first group of which is arranged parallel to a radial border of the segment and second and third groups are arranged to cross said first group at an angle of 60° and 120°, respectively.
  • said abrasive tool is a CMP pad conditioner.
  • the abrasive tool of the present invention is advantageous to those conventional techniques, in that a substantially increased retention of superabrasive particles is secured and that thus the risky popping out of superabrasive particles is minimized due to the sintering process, which is conducted in a condition of combined ultrahigh pressure and high temperature where diamond is the thermodynamically stable phase of carbon, while the bond metal is molten.
  • a higher retention can be achieved especially in the case where diamond is employed for the superabrasive, since the diamond particles are firmly joined with each other as a result of partly dissolution by the metal on the surface of the diamond.
  • the present invention provides a solution in which such irregularity has been effectively eliminated, by composing an abrasive part of several sector-shaped pieces, thus making available material pieces with a smaller area yet acceptable soundness: they (pieces) are cropped from compacts of a smaller radius, cut into several sectors with a larger radius, and assembled on a base plate into a circular tool with the target radius.
  • abrasive part of the invention when the abrasive units have worn out and diminished in the work operation, abrasive units and grooves can be reconstructed several times, readily by wire-EDM, for example, (along each of the grooves), since the abrasive units are formed on the abrasive part that comprises an adequately thick surface layer of sintered superabrasive particles.
  • the abrasive units are cut out of a compact or block of sintered superabrasive or, typically, diamond particles by means of wire EDM or like electric discharge machining process, they can be formed freely and as desired and thus a higher degree of tool precision can be readily achieved in the formation of triangular or rectangular pyramids, with the technique of the invention than with conventional art, in the level of upper ends and groove bottoms of the abrasive units.
  • the abrasive tool of the invention is very effective for an efficient production of a high precision surface of semiconductor metals.
  • the present invention uses as a material compacts of sintered particles of superabrasive, such as diamond and c-BN (cubic boron nitride), which can be prepared by an established technique, whereby superabrasive particles are processed in a combined condition of ultra-high pressure and high temperature. Since products as recovered from the process may suffer a significant deformation, which has to be preliminarily removed to produce a roughly flat surface by mold electric discharge machining, for example. Then created are abrasive units, which are to come into direct contact with works, by stepwise forming the grooves and side faces of projections, following the mode of the invention specifically described herein. Such preliminary flattening may be saved with some commercially available compacts as having a ready flat surface.
  • superabrasive such as diamond and c-BN (cubic boronitride)
  • wire EDM is preferred, though, especially for producing a sharp pointed top of abrasive units.
  • Wire EDM processes are usually program operated, whereby an electrode wire is driven along over a work surface of sintered superabrasive particles to cause electric discharge between the wire and certain ingredient of the work, thus removing the material.
  • such units can be created, for example, by cutting in several crossing groups of grooves, hereinafter also referred as "groups of separation /sectioning grooves", on a surface, either circular or annular with a central hole, of a compact of sintered superabrasive particles, to provide a sectioned abrasive surface.
  • groups of separation /sectioning grooves on a surface, either circular or annular with a central hole, of a compact of sintered superabrasive particles, to provide a sectioned abrasive surface.
  • groups of separation /sectioning grooves on a surface, either circular or annular with a central hole, of a compact of sintered superabrasive particles
  • Such groups of separation sectioning grooves can be arranged in various ways. They can be formed on a circular compact, for example, in two ( Fig. 1 ) or three ( Fig. 2 ) groups of parallel linear [grooves] that cross each other at 90° or 60°; respectively; and extend from a peripheral point in one side of the circle on the outer circumference to a corresponding point on the opposite side at regular intervals. In those cases rectangular and triangular abrasive units are created, respectively.
  • the abrasive units may also have a shape with a linear ridge or the like on the top ( Fig. 3 shows an abrasive unit with ridges running from one end to the other of the abrasive part; in Figs.
  • each abrasive unit has a rectangular shape).
  • the ridges are formed essentially parallel to the longer sides in the case of rectangular based abrasive unit, as the EDM electrode wire is driven straight and creates in a pass each groove and adjacent sloping sides.
  • each abrasive unit should have an upper end adequately small, while adjacent abrasive units be sufficiently spaced from each other, so that they can work effectively in the abrasive processes.
  • Fig. 6 which shows schematically, as an example, a detailed view of a part of the abrasive tool 1 shown in Fig. 1 , reveals some area at the top of abrasive units.
  • the proportion of such area (Y) to the base area (Y) of abrasive unit 2 can be determined by subtracting the total sectional area of all the adjacent grooves 3 from the radial sectional area of the whole layer of sintered superabrasive particles; proportions of 50 % or less and, in particular, 2 to 25 % have been found to yield good results.
  • the abrasive unit should preferably have a top angle of 30° to 120° and in particular 60° to 90°, and, to be more specific, 70° to 80°, approximately.
  • the depth of the grooves should be no less than 0.1 mm but not in excess of 1 mm; particularly appropriate is a depth no less than 0.15 mm but not in excess of 0.3 mm. Grooves too shallow are not effective for the elimination of debris from the work, frequently causing an excessively increased polishing resistance. Grooves formed too deep causes, on the contrary, can lead to abrasive units with insufficient strength in addition to a necessary increased depth of layer of sintered superabrasive particles.
  • the abrasive units be formed in a prism with a linear or a triangular, rectangular or more angular top, the lateral faces be vertical to the base plate, and the horizontal cross-sections be uniform throughout the height, the free cutting quality of the tool can be improved by providing at least one lateral face and, especially the one on the leading side of the rotation, inclined backward in relation to a plane parallel to the axis.
  • truncated pyramids such as rectangular and triangular ones, are favorable for sloping lateral faces around, and pointed top, non-truncated pyramids are even further favorable for the better cutting ability.
  • the abrasive part of the present invention is prepared with an outer diameter of 90 mm, with the layer of sintered superabrasive particles having a thickness no less than 0.1 mm but not in excess of 1 mm.
  • the layer of sintered superabrasive particles compacts of polycrystalline diamond (PCD) and polycrystalline cubic boron nitride (PCBN) are available, which have on one side a backing block of carbide alloy, that is a tungsten carbide based composite, or another VIa metal carbide, of the periodical table, based composite.
  • the compact is adhered on the backing face to the base plate of a tool; the opposite face is to be provided with the grooves for the used as an abrasive part.
  • Such compacts are available typically in disk shape, as a product of a process on a uniaxial hydrostatic press under ultrahigh pressure and high temperature conditions.
  • the tool of the invention may be realized by preparing the abrasive part in several segments, which are then assembled into one.
  • an abrasive part For the construction of an abrasive part with several segments, it is appropriate to form a groove along the boundary lines, for achieving an arrangement of abrasive units in a distribution as uniform as possible over the whole surface of the abrasive part.
  • a good arrangement without disorder of abrasive units can be obtained, except for some part close to the periphery, with an abrasive part divided into two or four segments, by forming two groups of parallel grooves, crossing each other at 90° and thus abrasive units in the shape of rectangular pyramid, either truncated or non-truncated.
  • a similar good arrangement can be obtained, by cutting in three groups of regularly spaced parallel grooves that cross each other at 120° and also three lateral faces to create an array of abrasive units in the shape of truncated or non-truncated triangular pyramid.
  • linear grooves are first formed on the surface of the abrasive part by electric discharge, by feeding an EDM electrode wire along the surface of the abrasive part.
  • the wire is driven in the Z-axis direction relative to the surface of abrasive part, in order to pass along and cut the abrasive part to create a side face of the (truncated) rectangular pyramid adjacent to the groove. The operation is repeated to complete the groups of grooves.
  • the top part of the pyramid comprises one or more diamond particles. So any pyramid in geometrical sense cannot be obtained because finest diamond particle has a definite volume. In the invention, however, we refer as not-truncated when the pyramid in question has a top side significantly small in relation to the base side. Obviously a truncated pyramid has a top larger in each direction than a corresponding pyramid.
  • abrasive part 10 first formed on the surface of an abrasive part 10 are a group of parallel grooves (one of which is representatively designated as 12, likewise applicable hereinafter) at a regular spacing in a fist direction I 1 and two side faces (representatively designated as 13 and 14, likewise applicable hereinafter) of rectangular pyramids.
  • the abrasive part 10 is rotated, together with the base plate, by 90° about the axis of the annulus and, thereafter, another group of parallel grooves (one of which is representatively designated as 16, likewise applicable hereinafter) are formed in a second direction 15 similarly to the above, as well as the two other side faces (representatively designated as 17 and 18, likewise applicable hereinafter) of the pyramids.
  • another group of parallel grooves one of which is representatively designated as 16, likewise applicable hereinafter
  • 17 and 18 respectively represented as 17 and 18, likewise applicable hereinafter
  • the sectional view taken along A-A in Fig. 7 is shown in Fig. 5 .
  • a group of parallel grooves 22 in a first direction 21 and sloping faces 23, 24 of the pyramids adjacent to the grooves are formed. Then, the abrasive part 20 is rotated by 120° about the central axis of abrasive part 25, and, in the same way, another group of parallel grooves 27 are formed at a regular interval in a second direction 26 and adjacent sloping side faces 28, 29 are formed by wire EDM (electric discharge machining).
  • wire EDM electric discharge machining
  • the abrasive part Upon completion of the process, the abrasive part is rotated again by 120° and the same process is resumed to form another group of parallel grooves 31 in a third direction 30 to cross the other two at 120°, as well as side faces 32, 33 adjacent thereto of triangular pyramid abrasive units 34, thus accomplishing the arrangement of pyramids along the grooves.
  • either triangular or rectangular pyramid abrasive units have a protrusion height of no less than 30 ⁇ m but not in excess of 200 ⁇ m above the level of groove bottom.
  • Protrusions too low may tend to cause a direct contact of the base of abrasive part with the work, such as CMP pad, resulting in inadequate conditioning performance.
  • Protrusions too high may cause, in contrast, to reduce the relative strength of the abrasive units, while an excessively thick layer becomes necessary for the sintered superabrasive particles.
  • the intervals, or a pitch, between adjacent grooves should not exceed 1500 ⁇ m, while the lower limit can be set, depending on the wire diameter to be employed for wire electric discharge machining, at something about 200 ⁇ m, for example.
  • the performance of the abrasive units depends on the particle size of the superabrasive particles contained in the top part of the (truncated) pyramid of abrasion unit.
  • the superabrasive of diamond particles, or the abrasive part being composed of sintered diamond (PCD) either 40 to 60 ⁇ m or less, 8 to 16 ⁇ m or less or, 0 to 2 ⁇ m can be used as an appropriate particle size for sintered diamond; among such sizes nominal sizes of or smaller than 8 to 16 ⁇ m or less are preferable, and 0 to 2 ⁇ m, in particular, has been found most appropriate.
  • a compact of sintered diamond particles to be used for the abrasive part of the present invention can be prepared by subjecting loose diamond particles to a combined condition of ultra-high pressure and high temperature where diamond is the thermodynamically stable phase, together with a block of cemented carbide for the backing material, and, as necessary, bonding metal such as cobalt.
  • the abrasive part of the invention can be realized by cutting out a portion, which then is surface processed to create abrasive units, by precision EDM such as, typically, wire electric discharge machining. In the wire electric discharge machining, commonly, the electrode wire is struck against the surface of sintered diamond particles to initiate an electric discharge.
  • the wire then is held close to maintain the discharge and moved horizontally along the surface of sintered diamond particles so as to carve a groove with a desired width and further side faces of abrasive units.
  • the groove can be also formed, as shown in Fig. 11 , by driving the EDM electrode wire 41, after striking the work 42 of sintered diamond, not horizontally but in the direction designated with arrows in the drawing, thus forming a groove such that the tangential planes to the wire correspond to the sloping faces of opposed abrasive units 43, 44, and, then the side faces of the pyramids on each side of the groove, with the groove level taken as the reference plane.
  • a thus constructed groove has a round bottom, showing an approximately arced cross section.
  • Such designed abrasive unit is less susceptible to the stress concentration problem and has a higher strength (or longer service life) in abrasive processes than abrasive units with grooves having a flat bottom or angled corners.
  • the tool of the present invention can be realized in various shapes as illustrated in Figs. 12 to 17 by way of examples.
  • the abrasive part can be prepared in an entire continuous circular or annular form as illustrated in Figs. 12 and 13 by way of examples; however, as shown in Figs. 14 to 17 the abrasive part of the invention can be composed of several divided segments without any problem, so large annular abrasive parts with an outer diameter of 95 mm or more can also be easily obtained.
  • the radial width be no less than 15 mm.
  • the abrasive part can be also realized as a solid disk (without central hole) instead of an annular shape, especially when the design does not require a central hole.
  • abrasive part with several divided segments As illustrated by way of examples in Figs. 14 to 17 , the disturbance or irregularity in abrasive unit arrangement and resulting effects on the work (CMP pad) caused by divide-and-assembled construction can be effectively either avoided or reduced to a minimum by providing a groove on and along each border.
  • the number of division and shape of abrasive units available are related to each other: the rectangular pyramid design ( Figs. 14 and 15 ) is available for the two (central angle of 180°) and four (central angle of 90°) segment composition, while triangular pyramid design ( Figs. 16 and 17 ) is available for the three segment composition(central angle of 120°).
  • segments of abrasive part are prepared by cutting out from a compact of sintered particles of superabrasive (or diamond, preferably) large enough to give the intended size, and machined to the designed shape and dimensions.
  • a plurality of such objects are collected and fixed with adhesive on a solid or annular, with a concentric circular hole at the center, circular surface of a rigid base plate of steel, in order to make such a large, solid circular or annular abrasive part.
  • Six, four, three or two sector shaped segments of sintered diamond particles of 60°, 90°, 120° and 180° central angle, respectively, are placed side by side on the radius (lateral joining).
  • a 120° sector can be substituted for two 60° sectors. In this case the two 120 sectors should be arranged point-symmetrically relating to the center.
  • abrasive part 51, 61, 71, 81, 91,101 are joined on the carbide backing side to the flat circular surface of the circular base plate 52, 62, 72, 82, 92, 102, respectively, so as to provide as a whole a circular or annular abrasive part.
  • the compact of sintered superabrasive particles is joined to the base plate, then subjected to wire electric discharge machining, in order to form on the surface of the compact one group 53, 63, 73, 83, 93, 103 of parallel linear grooves at regular intervals, whereby an the electric discharge is taken place between the electrode wire and the compact of sintered superabrasive particles.
  • the electrode wire is driven in parallel with the top or bottom face, to enter, via the preliminarily flattened surface, and cut in the layer of sintered superabrasive (typically a sintered diamond (PCD)) and or, in case of a thin layer of sintered superabrasive, further down to the cemented carbide layer.
  • PCD sintered diamond
  • the electrode wire is driven in the direction of the thickness of the sintered superabrasive (Z-axis direction) and thus to cut out grooves.
  • Z-axis direction the direction of the thickness of the sintered superabrasive
  • the first groove of a group for either rectangular or triangular pyramid abrasive units, may be begun to form at any position.
  • each of the abrasive part segment borders 54, 64, 74, 84, 94, 104 has to be first provided with a groove formed along it. After that, the other grooves are formed in parallel on both sides thereof at a regular pitch over all the surface.
  • a group of parallel grooves in one direction on the surface of the compact of sintered superabrasive particles is rotated about the central axis of the base plate, together with the base plate attached thereto by ⁇ being the angle of groove crossing.
  • a is equal to 90° for 180° and 90° sectors, with the abrasive unit being in the shape of truncated or non-truncated pyramid.
  • the compact of sintered superabrasive is rotated by 60° (or 120°), a second group of parallel linear grooves are formed at the intervals similarly, as well as side faces adjacent to each groove; then rotating the compact by another 60° (or 120°) (by 240° relating to the first group of grooves) a third group of parallel linear grooves 56, 66, 76, 86, 96, 106 and adjacent side faces are further and likewise formed.
  • ⁇ may be either 90° or 60°.
  • the grooves and pyramids can be formed to have upper ends lying close to a level that is in parallel with the work bottom lying, by driving the electrode wire while holding a distance in the direction of thickness from the compact bottom.
  • the triangular or rectangular pyramids of abrasive units be completely composed of sintered superabrasive particles; instead pyramids, either truncated or non-truncated, are also effective that are composed of sintered superabrasive down from the top to a depth (length) of around 60 ⁇ m, with the lower portion composed of carbide alloy.
  • An abrasive tool 1 having a structure schematically shown in Fig. 1 , was prepared.
  • a 90 mm diameter PCD block was used as a tool material, which had a 0.6 mm thick layer of sintered diamond joined with cemented carbide by simultaneous sintering.
  • the PCD block was subjected to an electric discharge machining (EDM) in order to flatten the surface of the sintered diamond layer and cut in a group of 560 ⁇ m wide parallel linear grooves 3 to form abrasive units with a square top of 260 ⁇ m sides.
  • EDM electric discharge machining
  • the area of the top part (not shown) of the abrasive units 2 corresponds to about 10 % the cross-section of the of sintered superabrasive layer, excluding the circumference (groove 3).
  • the edges of the top square were sharpened, and the tool was used as a CMP conditioner.
  • An annular abrasive tool 4 schematically shown in Fig. 2 , was prepared.
  • the sectors were stuck together to a base plate made of SUS stainless steel, so as to form as a whole a complete circle.
  • the surface of the sintered c-BN layer was polished and flattened, and subjected to wire EDM to form a group of 560 ⁇ m wide parallel linear grooves 6 and abrasive units 5 having a square top with 350 ⁇ m sides.
  • the area of the top of the abrasive units corresponded to 7 % of the total cross section of the sintered superabrasive particle layer.
  • the obtained tool was sharpened by the same technique as in Example 1, and used for polishing the surface of silicon wafers.
  • An abrasive tool having a structure such that schematically shown in Fig. 12 , was manufactured.
  • a material for the abrasive part a 100 mm diameter PCD compact was used, which was composed of 0.5 mm thick layer of sintered diamond particles with a nominal particle size of 40 to 60 ⁇ m that were integrated by simultaneous sintering with cemented carbide (WC - 8 % Co); the compact was fixed with an epoxy adhesive to a 108 mm diameter circular base plate of SUS 316 stainless steel.
  • the surface of the PCD layer was flattened by die-sinking EDM; then 200 ⁇ m wide linear grooves were formed on the PCD layer to pass through the centre of the material by cutting in by wire electric discharge machining.
  • grooves were formed to the required width, while the side faces of pyramids were cut out, by driving the wire towards the side faces or in a direction (Z-axis direction) parting from the base plate.
  • the above operation was repeated to form on the whole material face a group of parallel grooves at an 800 ⁇ m interval and roof-shaped projections with a top angle of 90°.
  • the whole was rotated by 90° about the central axis, and a second group of parallel grooves were formed to cross the first group of grooves at a right angle, by operating the wire electric discharge machining under the same conditions.
  • the side faces of the pyramids were cut out in the transversal direction, thus accomplishing the formation of a group of 200 ⁇ m high rectangular pyramids, as shown in Figs. 7 and 8 ,
  • Example 3 The operations set forth in Example 3 were repeated to prepare an abrasive tool having rectangular pyramid abrasive units.
  • a compact of PCD having a 100 mm outer diameter and 70 mm inner diameter was used for an abrasive part, which was composed of a 0.5 mm thick layer of sintered diamond particles of 0 to 2 ⁇ m nominal particle size, integrated with cemented carbide.
  • the EDM process was further operated to extend the groove to a designed width and to cut out side faces of the pyramids.
  • the process was repeated to form a group of parallel grooves at 200 ⁇ m intervals and roof-shaped protrusions of top angle of 60° on and over the whole material face: Next, the whole was rotated by 90° about the central axis and, then, the wire electric discharge machining process was operated again to form a second group of parallel grooves under the same conditions and, at the same time, to cut out another side faces to accomplish 200 ⁇ m high rectangular pyramids.
  • abrasive part Various segments given below of abrasive part were used to manufacture the tools of respective construction.
  • the diamond particles of the sintered diamond particles in each case had a nominal particle size of 20 to 30 ⁇ m.
  • the wire EDM processes were substantially identical, except that, the tool material was rotated twice in the case of triangular abrasive units, by 60° each time, while only once by 90° in the case of rectangular pyramid abrasive units. The process conditions and results are shown in the table below.
  • the abrasive tool of the present invention can be used for different types of abrasive tools; however, it is particularly preferred as disk-type rotating abrasive tool. While the tool is particularly adapted for the use as a CMP pad conditioner, but it is also suitable for directly polishing the wafer surfaces of semiconductor metal and the like. Additionally the tool can be applied for high precision machining of various work materials.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
EP06796810A 2005-08-25 2006-08-25 Tool with sintered body polishing surface and method of manufacturing the same Not-in-force EP1944125B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005243529 2005-08-25
JP2006209236 2006-07-31
PCT/JP2006/316737 WO2007023949A1 (ja) 2005-08-25 2006-08-25 焼結体研磨部を持つ工具およびその製造方法

Publications (3)

Publication Number Publication Date
EP1944125A1 EP1944125A1 (en) 2008-07-16
EP1944125A4 EP1944125A4 (en) 2009-12-16
EP1944125B1 true EP1944125B1 (en) 2012-01-25

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US (1) US20090215366A1 (zh)
EP (1) EP1944125B1 (zh)
JP (1) JP5033630B2 (zh)
KR (1) KR101293461B1 (zh)
CN (2) CN101693353A (zh)
AU (1) AU2006282293B2 (zh)
BR (1) BRPI0615020A2 (zh)
CA (1) CA2620407A1 (zh)
IL (1) IL189314A (zh)
RU (1) RU2430827C2 (zh)
TW (1) TWI406736B (zh)
WO (1) WO2007023949A1 (zh)

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Also Published As

Publication number Publication date
JPWO2007023949A1 (ja) 2009-03-05
CN101247923A (zh) 2008-08-20
US20090215366A1 (en) 2009-08-27
BRPI0615020A2 (pt) 2009-08-04
IL189314A (en) 2013-01-31
JP5033630B2 (ja) 2012-09-26
TW200714416A (en) 2007-04-16
CA2620407A1 (en) 2007-03-01
TWI406736B (zh) 2013-09-01
IL189314A0 (en) 2008-06-05
RU2008110905A (ru) 2009-09-27
KR101293461B1 (ko) 2013-08-07
EP1944125A1 (en) 2008-07-16
CN101247923B (zh) 2010-12-08
RU2430827C2 (ru) 2011-10-10
WO2007023949A1 (ja) 2007-03-01
AU2006282293B2 (en) 2011-06-23
AU2006282293A1 (en) 2007-03-01
KR20080037693A (ko) 2008-04-30
CN101693353A (zh) 2010-04-14
EP1944125A4 (en) 2009-12-16

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