JP5024317B2 - 電子部品および電子部品の製造方法 - Google Patents

電子部品および電子部品の製造方法 Download PDF

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Publication number
JP5024317B2
JP5024317B2 JP2009069526A JP2009069526A JP5024317B2 JP 5024317 B2 JP5024317 B2 JP 5024317B2 JP 2009069526 A JP2009069526 A JP 2009069526A JP 2009069526 A JP2009069526 A JP 2009069526A JP 5024317 B2 JP5024317 B2 JP 5024317B2
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JP
Japan
Prior art keywords
package
electronic component
inspection
lid
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009069526A
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English (en)
Japanese (ja)
Other versions
JP2009147976A (ja
JP2009147976A5 (enExample
Inventor
克彦 宮崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2009069526A priority Critical patent/JP5024317B2/ja
Publication of JP2009147976A publication Critical patent/JP2009147976A/ja
Publication of JP2009147976A5 publication Critical patent/JP2009147976A5/ja
Application granted granted Critical
Publication of JP5024317B2 publication Critical patent/JP5024317B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2009069526A 2002-03-25 2009-03-23 電子部品および電子部品の製造方法 Expired - Fee Related JP5024317B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009069526A JP5024317B2 (ja) 2002-03-25 2009-03-23 電子部品および電子部品の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002084333 2002-03-25
JP2002084333 2002-03-25
JP2009069526A JP5024317B2 (ja) 2002-03-25 2009-03-23 電子部品および電子部品の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2003068345A Division JP4378980B2 (ja) 2002-03-25 2003-03-13 制御端子付き電子部品

Publications (3)

Publication Number Publication Date
JP2009147976A JP2009147976A (ja) 2009-07-02
JP2009147976A5 JP2009147976A5 (enExample) 2009-10-08
JP5024317B2 true JP5024317B2 (ja) 2012-09-12

Family

ID=40917973

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2009069526A Expired - Fee Related JP5024317B2 (ja) 2002-03-25 2009-03-23 電子部品および電子部品の製造方法
JP2009108871A Pending JP2009171607A (ja) 2002-03-25 2009-04-28 制御端子付き電子部品
JP2009108870A Withdrawn JP2009175155A (ja) 2002-03-25 2009-04-28 制御端子付き電子部品

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2009108871A Pending JP2009171607A (ja) 2002-03-25 2009-04-28 制御端子付き電子部品
JP2009108870A Withdrawn JP2009175155A (ja) 2002-03-25 2009-04-28 制御端子付き電子部品

Country Status (1)

Country Link
JP (3) JP5024317B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5747574B2 (ja) 2011-03-11 2015-07-15 セイコーエプソン株式会社 圧電デバイス及び電子機器
JP6595308B2 (ja) * 2015-11-16 2019-10-23 京セラ株式会社 電子部品搭載用基板、電子装置および電子モジュール

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5954938U (ja) * 1982-10-01 1984-04-10 京セラ株式会社 リ−ドレスパッケ−ジの多段構造
JPS6367246U (enExample) * 1986-10-22 1988-05-06
JP2669072B2 (ja) * 1989-09-22 1997-10-27 富士通株式会社 集積回路パッケージ
JPH05243886A (ja) * 1992-02-28 1993-09-21 Murata Mfg Co Ltd 圧電部品
JPH05275927A (ja) * 1992-03-26 1993-10-22 Murata Mfg Co Ltd 電子部品の製造方法
JPH05315416A (ja) * 1992-05-11 1993-11-26 Kofu Nippon Denki Kk 論理検査端子付きｌｓｉ
US5459368A (en) * 1993-08-06 1995-10-17 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device mounted module
JPH0774585A (ja) * 1993-08-31 1995-03-17 Murata Mfg Co Ltd 圧電共振部品
JPH08316732A (ja) * 1995-05-22 1996-11-29 Toyo Commun Equip Co Ltd 発振器およびその製造方法
JPH1197931A (ja) * 1997-09-25 1999-04-09 Citizen Watch Co Ltd 発振器
JPH11127055A (ja) * 1997-10-23 1999-05-11 Murata Mfg Co Ltd 複合電子部品
JPH11308052A (ja) * 1998-04-17 1999-11-05 Toyo Commun Equip Co Ltd 発振器の構造
JP3406846B2 (ja) * 1998-08-31 2003-05-19 京セラ株式会社 温度補償型水晶発振器
JP2001284373A (ja) * 2000-03-29 2001-10-12 Daishinku Corp 電子部品

Also Published As

Publication number Publication date
JP2009147976A (ja) 2009-07-02
JP2009171607A (ja) 2009-07-30
JP2009175155A (ja) 2009-08-06

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