JP5005740B2 - ウェーハおよびウェーハの製造方法 - Google Patents
ウェーハおよびウェーハの製造方法 Download PDFInfo
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- JP5005740B2 JP5005740B2 JP2009186536A JP2009186536A JP5005740B2 JP 5005740 B2 JP5005740 B2 JP 5005740B2 JP 2009186536 A JP2009186536 A JP 2009186536A JP 2009186536 A JP2009186536 A JP 2009186536A JP 5005740 B2 JP5005740 B2 JP 5005740B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000000758 substrate Substances 0.000 claims description 47
- 239000000463 material Substances 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 28
- 238000005498 polishing Methods 0.000 claims description 23
- 230000007547 defect Effects 0.000 claims description 19
- 230000003746 surface roughness Effects 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 11
- 229910052732 germanium Inorganic materials 0.000 claims description 10
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 9
- 239000013078 crystal Substances 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 6
- 229910017214 AsGa Inorganic materials 0.000 claims description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910002601 GaN Inorganic materials 0.000 claims description 2
- 235000013399 edible fruits Nutrition 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 85
- 230000008569 process Effects 0.000 description 9
- 239000000126 substance Substances 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000002513 implantation Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000008570 general process Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
- C30B25/183—Epitaxial-layer growth characterised by the substrate being provided with a buffer layer, e.g. a lattice matching layer
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Recrystallisation Techniques (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
本発明の好ましい例では、約0.15ナノメートルRMS〜約0.4ナノメートルRMSの表面粗さの基板上に、第2の材料が成長する。この範囲の表面粗さが第1の材料上への第2の材料の小さい応力での成長に特に効果的である。
本発明の有益な実施形態では、平方ミリメートル当たり0.12マイクロメートルより大きいサイズの欠陥が約0.2個〜約1個の表面欠陥密度の基板上に、第2の材料が成長する。意外にも、欠陥は第2の材料のよりよい開始層の確立に有益である。
Claims (7)
- 単結晶の第1の材料の基板(1)を用意するステップと、
前記基板(1)上に、前記第1の材料の格子とは異なる格子を持った第2の材料の少なくとも1つの層(2、3)を成長させるステップと、
を含むウェーハ(52、62)の製造方法において、
前記第2の材料の少なくとも1つの層(2、3)を成長させるステップは、エッチングステップ(103)と第1の研磨ステップ(104)の後で、且つ、最終研磨ステップ(108)の前に実施され、
前記エッチングステップ(103)は、スライスされラッピングされ及び/又は研削されただけの準備の整っていない基板(1)の表面に実施され、アルカリ性によるエッチングを含み、エッチングされた基板(1)の表面がより損傷を受けた状態とし、
前記第1の研磨ステップ(104)は、前記エッチングステップ(103)の後に実施され、前記基板を0.15ナノメートルRMS〜0.4ナノメートルRMSの表面粗さを有するものとし、
前記最終研磨ステップ(108)は、1平方マイクロメートルのスキャンにつき0.2ナノメートルRMS未満の表面粗さを有する前記第2の材料の少なくとも1つのヘテロエピタキシャル層(2,3)の仕上げられた表面(8)を形成するものである、
ことを特徴とする方法。 - 前記第2の材料の成長は、傾斜バッファ層(2)およびその上に形成される緩和層(3)の成長を含むことを特徴とする請求項1に記載の方法。
- 前記傾斜バッファ層(2)の成長は傾斜SiGe層の成長を含み、そのゲルマニウム含有量は前記基板(1)から始まって徐々に増大することを特徴とする請求項2に記載の方法。
- 緩和層(3)の材料厚さは、前記最終研磨ステップ(108)を実施する前に適用されるCMPストック除去ステップ(107)により除去されることを特徴とする請求項2または3に記載の方法。
- 単結晶の第1の材料の基板はオンアクシスシリコン基板であり、当該オンアクシスシリコン基板上に前記第2の材料を成長させることを特徴とする請求項1〜4のいずれか1項に記載の方法。
- 平方ミリメートル当たり0.12マイクロメートルより大きいサイズの欠陥が0.2個〜1個の表面欠陥密度の基板(1)上に、前記第2の材料を成長させる
ことを特徴とする請求項1に記載の方法。 - 前記第1の材料はシリコンまたはゲルマニウムであり、前記第2の材料はSiGe、AsGa、GaNまたはゲルマニウムであることを特徴とする請求項1に記載のウェーハの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04291473A EP1605498A1 (en) | 2004-06-11 | 2004-06-11 | A method of manufacturing a semiconductor wafer |
EP04291473.9 | 2004-06-11 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005172558A Division JP2006054428A (ja) | 2004-06-11 | 2005-06-13 | ウェーハの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010045362A JP2010045362A (ja) | 2010-02-25 |
JP5005740B2 true JP5005740B2 (ja) | 2012-08-22 |
Family
ID=34931173
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005172558A Withdrawn JP2006054428A (ja) | 2004-06-11 | 2005-06-13 | ウェーハの製造方法 |
JP2009186536A Active JP5005740B2 (ja) | 2004-06-11 | 2009-08-11 | ウェーハおよびウェーハの製造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005172558A Withdrawn JP2006054428A (ja) | 2004-06-11 | 2005-06-13 | ウェーハの製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7138325B2 (ja) |
EP (1) | EP1605498A1 (ja) |
JP (2) | JP2006054428A (ja) |
KR (1) | KR100712042B1 (ja) |
CN (1) | CN100413028C (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7175709B2 (en) * | 2004-05-17 | 2007-02-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Epitaxy layer and method of forming the same |
US9685524B2 (en) | 2005-03-11 | 2017-06-20 | Vishay-Siliconix | Narrow semiconductor trench structure |
TWI489557B (zh) | 2005-12-22 | 2015-06-21 | Vishay Siliconix | 高移動率p-通道溝槽及平面型空乏模式的功率型金屬氧化物半導體場效電晶體 |
US8409954B2 (en) * | 2006-03-21 | 2013-04-02 | Vishay-Silconix | Ultra-low drain-source resistance power MOSFET |
US8361337B2 (en) * | 2007-03-19 | 2013-01-29 | The University Of Massachusetts | Method of producing nanopatterned templates |
US8981427B2 (en) | 2008-07-15 | 2015-03-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing of small composite semiconductor materials |
US8211737B2 (en) | 2008-09-19 | 2012-07-03 | The University Of Massachusetts | Method of producing nanopatterned articles, and articles produced thereby |
US8247033B2 (en) | 2008-09-19 | 2012-08-21 | The University Of Massachusetts | Self-assembly of block copolymers on topographically patterned polymeric substrates |
US8518837B2 (en) * | 2008-09-25 | 2013-08-27 | The University Of Massachusetts | Method of producing nanopatterned articles using surface-reconstructed block copolymer films |
US7927975B2 (en) | 2009-02-04 | 2011-04-19 | Micron Technology, Inc. | Semiconductor material manufacture |
EP2421028B1 (en) * | 2009-04-13 | 2015-11-04 | SUMCO Corporation | Method for producing silicon epitaxial wafer |
JP5381304B2 (ja) * | 2009-05-08 | 2014-01-08 | 株式会社Sumco | シリコンエピタキシャルウェーハの製造方法 |
US9012253B2 (en) * | 2009-12-16 | 2015-04-21 | Micron Technology, Inc. | Gallium nitride wafer substrate for solid state lighting devices, and associated systems and methods |
US9455146B2 (en) * | 2009-12-17 | 2016-09-27 | California Institute Of Technology | Virtual substrates for epitaxial growth and methods of making the same |
TWI510682B (zh) * | 2011-01-28 | 2015-12-01 | Sino American Silicon Prod Inc | 晶棒表面奈米化製程、晶圓製造方法及其晶圓 |
US9156682B2 (en) | 2011-05-25 | 2015-10-13 | The University Of Massachusetts | Method of forming oriented block copolymer line patterns, block copolymer line patterns formed thereby, and their use to form patterned articles |
US8492187B2 (en) | 2011-09-29 | 2013-07-23 | International Business Machines Corporation | High throughput epitaxial liftoff for releasing multiple semiconductor device layers from a single base substrate |
US9412883B2 (en) | 2011-11-22 | 2016-08-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods and apparatus for MOS capacitors in replacement gate process |
US11515408B2 (en) * | 2020-03-02 | 2022-11-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Rough buffer layer for group III-V devices on silicon |
US11555250B2 (en) * | 2020-04-29 | 2023-01-17 | Applied Materials, Inc. | Organic contamination free surface machining |
JP7487655B2 (ja) | 2020-12-23 | 2024-05-21 | 株式会社Sumco | シリコンウェーハの抵抗率測定方法 |
Family Cites Families (23)
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NL7311470A (nl) * | 1973-08-21 | 1975-02-25 | Philips Nv | Werkwijze voor het neerslaan van een epitaxiale |
TW230822B (ja) * | 1993-03-02 | 1994-09-21 | Sumitomo Electric Industries | |
JP3120825B2 (ja) * | 1994-11-14 | 2000-12-25 | 信越半導体株式会社 | エピタキシャルウエーハ及びその製造方法 |
US6039803A (en) * | 1996-06-28 | 2000-03-21 | Massachusetts Institute Of Technology | Utilization of miscut substrates to improve relaxed graded silicon-germanium and germanium layers on silicon |
JP3482982B2 (ja) * | 1996-12-12 | 2004-01-06 | 三菱住友シリコン株式会社 | Eg層付きエピタキシャルウェーハの製造方法 |
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US6174727B1 (en) * | 1998-11-03 | 2001-01-16 | Komatsu Electronic Metals, Co. | Method of detecting microscopic defects existing on a silicon wafer |
JP2000243699A (ja) * | 1999-02-23 | 2000-09-08 | Hitachi Ltd | 半導体ウェハの製造方法および半導体装置の製造方法 |
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JP2003347399A (ja) * | 2002-05-23 | 2003-12-05 | Sharp Corp | 半導体基板の製造方法 |
US6995427B2 (en) * | 2003-01-29 | 2006-02-07 | S.O.I.Tec Silicon On Insulator Technologies S.A. | Semiconductor structure for providing strained crystalline layer on insulator and method for fabricating same |
JP2004342818A (ja) * | 2003-05-15 | 2004-12-02 | Toshiba Ceramics Co Ltd | 半導体基板の製造方法 |
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EP1571241A1 (en) * | 2004-03-01 | 2005-09-07 | S.O.I.T.E.C. Silicon on Insulator Technologies | Method of manufacturing a wafer |
-
2004
- 2004-06-11 EP EP04291473A patent/EP1605498A1/en not_active Withdrawn
- 2004-12-03 US US11/004,410 patent/US7138325B2/en active Active
-
2005
- 2005-06-10 KR KR1020050049858A patent/KR100712042B1/ko active IP Right Grant
- 2005-06-10 CN CNB2005100753492A patent/CN100413028C/zh active Active
- 2005-06-13 JP JP2005172558A patent/JP2006054428A/ja not_active Withdrawn
-
2009
- 2009-08-11 JP JP2009186536A patent/JP5005740B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
KR100712042B1 (ko) | 2007-04-27 |
CN1722367A (zh) | 2006-01-18 |
EP1605498A1 (en) | 2005-12-14 |
CN100413028C (zh) | 2008-08-20 |
US20050277278A1 (en) | 2005-12-15 |
KR20060048325A (ko) | 2006-05-18 |
JP2006054428A (ja) | 2006-02-23 |
US7138325B2 (en) | 2006-11-21 |
JP2010045362A (ja) | 2010-02-25 |
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