JP5005612B2 - 脆性材料のフルカット割断方法 - Google Patents
脆性材料のフルカット割断方法 Download PDFInfo
- Publication number
- JP5005612B2 JP5005612B2 JP2008136127A JP2008136127A JP5005612B2 JP 5005612 B2 JP5005612 B2 JP 5005612B2 JP 2008136127 A JP2008136127 A JP 2008136127A JP 2008136127 A JP2008136127 A JP 2008136127A JP 5005612 B2 JP5005612 B2 JP 5005612B2
- Authority
- JP
- Japan
- Prior art keywords
- brittle material
- laser
- alkali
- wavelength
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 title claims description 55
- 238000000034 method Methods 0.000 title claims description 43
- 239000011521 glass Substances 0.000 claims description 103
- 239000013078 crystal Substances 0.000 claims description 41
- 238000010521 absorption reaction Methods 0.000 claims description 39
- 239000004065 semiconductor Substances 0.000 claims description 34
- 238000002834 transmittance Methods 0.000 claims description 23
- 230000003287 optical effect Effects 0.000 claims description 19
- 230000031700 light absorption Effects 0.000 claims description 11
- 239000003513 alkali Substances 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 9
- 230000001678 irradiating effect Effects 0.000 claims description 7
- 230000010355 oscillation Effects 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- 230000005284 excitation Effects 0.000 claims description 4
- 230000008646 thermal stress Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 description 28
- 238000005520 cutting process Methods 0.000 description 16
- 239000000835 fiber Substances 0.000 description 14
- 239000004973 liquid crystal related substance Substances 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 238000012545 processing Methods 0.000 description 8
- 230000035882 stress Effects 0.000 description 8
- 230000008901 benefit Effects 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 6
- 238000009826 distribution Methods 0.000 description 5
- 238000010297 mechanical methods and process Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000003776 cleavage reaction Methods 0.000 description 4
- 239000000110 cooling liquid Substances 0.000 description 4
- 239000006063 cullet Substances 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 230000007017 scission Effects 0.000 description 4
- 239000005341 toughened glass Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 239000005328 architectural glass Substances 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004033 diameter control Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000000087 laser glass Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008136127A JP5005612B2 (ja) | 2008-05-24 | 2008-05-24 | 脆性材料のフルカット割断方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008136127A JP5005612B2 (ja) | 2008-05-24 | 2008-05-24 | 脆性材料のフルカット割断方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005264727A Division JP4179314B2 (ja) | 2005-09-13 | 2005-09-13 | 脆性材料のフルカット割断装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008247038A JP2008247038A (ja) | 2008-10-16 |
| JP2008247038A5 JP2008247038A5 (enExample) | 2008-11-27 |
| JP5005612B2 true JP5005612B2 (ja) | 2012-08-22 |
Family
ID=39972521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008136127A Expired - Fee Related JP5005612B2 (ja) | 2008-05-24 | 2008-05-24 | 脆性材料のフルカット割断方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5005612B2 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI558552B (zh) * | 2009-05-21 | 2016-11-21 | 康寧公司 | 具有機械耐久性邊緣的薄基材及其製造方法 |
| US8932510B2 (en) * | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
| US8946590B2 (en) | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
| WO2012096053A1 (ja) * | 2011-01-11 | 2012-07-19 | 旭硝子株式会社 | 強化ガラス板の切断方法 |
| CN103429545B (zh) | 2011-03-18 | 2017-07-07 | 旭硝子株式会社 | 显示装置用化学强化玻璃 |
| JP2014210670A (ja) * | 2011-09-01 | 2014-11-13 | 旭硝子株式会社 | 強化ガラスパネルの製造方法 |
| US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
| CN104364208B (zh) * | 2012-06-28 | 2017-12-12 | 旭硝子株式会社 | 玻璃基板的切割方法及玻璃基板的制造方法 |
| WO2014010490A1 (ja) * | 2012-07-09 | 2014-01-16 | 旭硝子株式会社 | 強化ガラス板の切断方法 |
| US9610653B2 (en) | 2012-09-21 | 2017-04-04 | Electro Scientific Industries, Inc. | Method and apparatus for separation of workpieces and articles produced thereby |
| JP7695498B2 (ja) * | 2021-07-20 | 2025-06-19 | 株式会社アドテックエンジニアリング | レーザ加工方法及びレーザ加工装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63159832A (ja) * | 1986-12-24 | 1988-07-02 | Hamamatsu Photonics Kk | 波長可変レ−ザ装置 |
| JP3036906B2 (ja) * | 1991-07-30 | 2000-04-24 | ホーヤ株式会社 | ガラス加工方法及びその装置 |
| JP3532100B2 (ja) * | 1997-12-03 | 2004-05-31 | 日本碍子株式会社 | レーザ割断方法 |
| JP2002049064A (ja) * | 2000-08-07 | 2002-02-15 | Toshiba Corp | 光パラメトリック発振器 |
| JP2002090787A (ja) * | 2000-09-19 | 2002-03-27 | Nikon Corp | 波長変換光学系及びこの波長変換光学系を用いた露光装置 |
| JP4329978B2 (ja) * | 2001-02-06 | 2009-09-09 | 古河電気工業株式会社 | 半導体レーザモジュールと、光帰還機能を有する半導体レーザ素子 |
| WO2003076151A1 (en) * | 2002-03-12 | 2003-09-18 | Mitsuboshi Diamond Industrial Co., Ltd. | Method and device for processing fragile material |
| JP2005088078A (ja) * | 2003-09-17 | 2005-04-07 | Lemi Ltd | 走査型レーザ装置 |
| JP2005314198A (ja) * | 2004-04-26 | 2005-11-10 | Lemi Ltd | ガラス割断用レーザ装置 |
| JP4179314B2 (ja) * | 2005-09-13 | 2008-11-12 | 株式会社レミ | 脆性材料のフルカット割断装置 |
-
2008
- 2008-05-24 JP JP2008136127A patent/JP5005612B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008247038A (ja) | 2008-10-16 |
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