JP5005416B2 - 多層配線基板及びその製造方法 - Google Patents

多層配線基板及びその製造方法 Download PDF

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JP5005416B2
JP5005416B2 JP2007111642A JP2007111642A JP5005416B2 JP 5005416 B2 JP5005416 B2 JP 5005416B2 JP 2007111642 A JP2007111642 A JP 2007111642A JP 2007111642 A JP2007111642 A JP 2007111642A JP 5005416 B2 JP5005416 B2 JP 5005416B2
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via pad
pad
interlayer insulating
insulating layer
stacked
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Japanese (ja)
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JP2008270531A (ja
JP2008270531A5 (enExample
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正邦 北島
啓介 上田
隆一 松木
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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JP2007111642A 2007-04-20 2007-04-20 多層配線基板及びその製造方法 Active JP5005416B2 (ja)

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JP2007111642A JP5005416B2 (ja) 2007-04-20 2007-04-20 多層配線基板及びその製造方法

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JP2007111642A JP5005416B2 (ja) 2007-04-20 2007-04-20 多層配線基板及びその製造方法

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JP2008270531A JP2008270531A (ja) 2008-11-06
JP2008270531A5 JP2008270531A5 (enExample) 2010-03-04
JP5005416B2 true JP5005416B2 (ja) 2012-08-22

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10849226B2 (en) 2018-12-04 2020-11-24 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing the same
US10887986B2 (en) 2018-12-04 2021-01-05 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing the same

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5383348B2 (ja) * 2009-06-29 2014-01-08 京セラ株式会社 電気配線基板および光モジュール
KR20110036149A (ko) * 2009-10-01 2011-04-07 삼성전기주식회사 다층 세라믹 기판 및 그 제조 방법
KR101412225B1 (ko) 2012-08-10 2014-06-25 이비덴 가부시키가이샤 배선판 및 그 제조 방법
JP6020645B2 (ja) * 2015-04-22 2016-11-02 Tdk株式会社 電子部品
JP7449660B2 (ja) * 2019-09-06 2024-03-14 株式会社村田製作所 インダクタ部品
JP7112438B2 (ja) * 2020-02-07 2022-08-03 積水化学工業株式会社 硬化体、ｂステージフィルム及び多層プリント配線板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3854160B2 (ja) * 2002-01-23 2006-12-06 京セラ株式会社 多層配線基板
JP2005101377A (ja) * 2003-09-25 2005-04-14 Kyocera Corp 多層配線基板
JP4445777B2 (ja) * 2004-02-27 2010-04-07 日本特殊陶業株式会社 配線基板、及び配線基板の製造方法
WO2006101134A1 (ja) * 2005-03-24 2006-09-28 Ibiden Co., Ltd. 多層プリント配線板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10849226B2 (en) 2018-12-04 2020-11-24 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing the same
US10887986B2 (en) 2018-12-04 2021-01-05 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing the same

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JP2008270531A (ja) 2008-11-06

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