JP4978822B2 - 多層セラミック基板の製造方法および多層セラミック基板 - Google Patents
多層セラミック基板の製造方法および多層セラミック基板 Download PDFInfo
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- JP4978822B2 JP4978822B2 JP2004320720A JP2004320720A JP4978822B2 JP 4978822 B2 JP4978822 B2 JP 4978822B2 JP 2004320720 A JP2004320720 A JP 2004320720A JP 2004320720 A JP2004320720 A JP 2004320720A JP 4978822 B2 JP4978822 B2 JP 4978822B2
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- Prior art keywords
- green sheet
- ceramic substrate
- multilayer ceramic
- constraining layer
- constraining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000919 ceramic Substances 0.000 title claims description 100
- 239000000758 substrate Substances 0.000 title claims description 82
- 238000004519 manufacturing process Methods 0.000 title claims description 32
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 37
- 238000000034 method Methods 0.000 claims description 34
- 238000010304 firing Methods 0.000 claims description 32
- 239000004020 conductor Substances 0.000 claims description 28
- 239000011521 glass Substances 0.000 claims description 26
- 238000002441 X-ray diffraction Methods 0.000 claims description 14
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 12
- 239000011230 binding agent Substances 0.000 claims description 12
- 239000002241 glass-ceramic Substances 0.000 claims description 12
- 239000010433 feldspar Substances 0.000 claims description 11
- 239000002002 slurry Substances 0.000 claims description 10
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 9
- 229910010272 inorganic material Inorganic materials 0.000 claims description 7
- 239000011147 inorganic material Substances 0.000 claims description 7
- 239000004014 plasticizer Substances 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 6
- 238000007606 doctor blade method Methods 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 40
- 230000008569 process Effects 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 17
- 239000002245 particle Substances 0.000 description 13
- 229910010293 ceramic material Inorganic materials 0.000 description 10
- 239000000843 powder Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- 238000002425 crystallisation Methods 0.000 description 7
- 230000008025 crystallization Effects 0.000 description 7
- 238000007639 printing Methods 0.000 description 6
- 229910003668 SrAl Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000000452 restraining effect Effects 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000005422 blasting Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910052647 feldspar group Inorganic materials 0.000 description 3
- 238000005488 sandblasting Methods 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 238000001354 calcination Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052661 anorthite Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- GWWPLLOVYSCJIO-UHFFFAOYSA-N dialuminum;calcium;disilicate Chemical compound [Al+3].[Al+3].[Ca+2].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] GWWPLLOVYSCJIO-UHFFFAOYSA-N 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011802 pulverized particle Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- IATRAKWUXMZMIY-UHFFFAOYSA-N strontium oxide Inorganic materials [O-2].[Sr+2] IATRAKWUXMZMIY-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004320720A JP4978822B2 (ja) | 2004-11-04 | 2004-11-04 | 多層セラミック基板の製造方法および多層セラミック基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004320720A JP4978822B2 (ja) | 2004-11-04 | 2004-11-04 | 多層セラミック基板の製造方法および多層セラミック基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006135012A JP2006135012A (ja) | 2006-05-25 |
| JP2006135012A5 JP2006135012A5 (https=) | 2009-11-12 |
| JP4978822B2 true JP4978822B2 (ja) | 2012-07-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004320720A Expired - Lifetime JP4978822B2 (ja) | 2004-11-04 | 2004-11-04 | 多層セラミック基板の製造方法および多層セラミック基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4978822B2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102072287B1 (ko) * | 2018-02-21 | 2020-01-31 | 한국산업기술대학교산학협력단 | Ltcc(저온 동시 소성 세라믹)를 이용한 유해가스 감지센서의 제조방법 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2785544B2 (ja) * | 1991-10-04 | 1998-08-13 | 松下電器産業株式会社 | 多層セラミック基板の製造方法 |
| JPH10218675A (ja) * | 1997-02-06 | 1998-08-18 | Sumitomo Kinzoku Electro Device:Kk | セラミック基板の製造方法 |
| JPH11106252A (ja) * | 1997-10-03 | 1999-04-20 | Nippon Electric Glass Co Ltd | 低温焼成ガラスセラミック材料 |
| JP4392633B2 (ja) * | 1999-01-20 | 2010-01-06 | 日立金属株式会社 | マイクロ波用誘電体磁器組成物およびその製造方法ならびにマイクロ波用誘電体磁器組成物を用いたマイクロ波用電子部品 |
| JP2001342073A (ja) * | 2000-05-29 | 2001-12-11 | Kyocera Corp | ガラスセラミック基板の製造方法 |
| JP3826685B2 (ja) * | 2000-06-26 | 2006-09-27 | 株式会社村田製作所 | ガラスセラミック回路基板の製造方法 |
| JP2002084065A (ja) * | 2000-09-07 | 2002-03-22 | Murata Mfg Co Ltd | 多層セラミック基板およびその製造方法ならびに電子装置 |
| JP3630372B2 (ja) * | 2001-10-29 | 2005-03-16 | 松下電器産業株式会社 | 多層セラミック基板およびその製造方法 |
| JP2003252678A (ja) * | 2002-03-01 | 2003-09-10 | Ngk Spark Plug Co Ltd | ガラス組成物、誘電体およびそれらの製造方法ならびにそれらを用いた配線基板 |
| JP2003304064A (ja) * | 2002-04-08 | 2003-10-24 | Sumitomo Metal Ind Ltd | 空気層を内蔵したセラミック多層回路基板及びその製造方法 |
| JP2005159038A (ja) * | 2003-11-26 | 2005-06-16 | Kyocera Corp | 低温焼成セラミック基板の製造方法 |
-
2004
- 2004-11-04 JP JP2004320720A patent/JP4978822B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006135012A (ja) | 2006-05-25 |
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