JP4974022B2 - 格子状配列プローブ組立体 - Google Patents

格子状配列プローブ組立体 Download PDF

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Publication number
JP4974022B2
JP4974022B2 JP2006081729A JP2006081729A JP4974022B2 JP 4974022 B2 JP4974022 B2 JP 4974022B2 JP 2006081729 A JP2006081729 A JP 2006081729A JP 2006081729 A JP2006081729 A JP 2006081729A JP 4974022 B2 JP4974022 B2 JP 4974022B2
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JP
Japan
Prior art keywords
probe
resin film
vertical
probe assembly
terminal
Prior art date
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Expired - Fee Related
Application number
JP2006081729A
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English (en)
Japanese (ja)
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JP2007225581A5 (enExample
JP2007225581A (ja
Inventor
軍生 木本
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Individual
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Individual
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Priority to JP2006081729A priority Critical patent/JP4974022B2/ja
Priority to TW096103868A priority patent/TWI397696B/zh
Priority to CN2007100802360A priority patent/CN101025426B/zh
Priority to US11/706,652 priority patent/US7501840B2/en
Priority to KR1020070016210A priority patent/KR20070083187A/ko
Publication of JP2007225581A publication Critical patent/JP2007225581A/ja
Publication of JP2007225581A5 publication Critical patent/JP2007225581A5/ja
Application granted granted Critical
Publication of JP4974022B2 publication Critical patent/JP4974022B2/ja
Expired - Fee Related legal-status Critical Current
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  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2006081729A 2006-02-19 2006-02-22 格子状配列プローブ組立体 Expired - Fee Related JP4974022B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006081729A JP4974022B2 (ja) 2006-02-22 2006-02-22 格子状配列プローブ組立体
TW096103868A TWI397696B (zh) 2006-02-19 2007-02-02 Probe assembly
CN2007100802360A CN101025426B (zh) 2006-02-19 2007-02-14 探针组合体
US11/706,652 US7501840B2 (en) 2006-02-19 2007-02-15 Probe assembly comprising a parallelogram link vertical probe made of a metal foil attached to the surface of a resin film
KR1020070016210A KR20070083187A (ko) 2006-02-19 2007-02-15 프로브 조립체

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006081729A JP4974022B2 (ja) 2006-02-22 2006-02-22 格子状配列プローブ組立体

Publications (3)

Publication Number Publication Date
JP2007225581A JP2007225581A (ja) 2007-09-06
JP2007225581A5 JP2007225581A5 (enExample) 2009-05-07
JP4974022B2 true JP4974022B2 (ja) 2012-07-11

Family

ID=38547524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006081729A Expired - Fee Related JP4974022B2 (ja) 2006-02-19 2006-02-22 格子状配列プローブ組立体

Country Status (1)

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JP (1) JP4974022B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5333829B2 (ja) * 2008-10-03 2013-11-06 軍生 木本 プローブ組立体
KR101037979B1 (ko) 2008-10-10 2011-06-09 송광석 수직형 프로브 및 이를 포함하는 프로브헤드 조립체
US8970238B2 (en) * 2011-06-17 2015-03-03 Electro Scientific Industries, Inc. Probe module with interleaved serpentine test contacts for electronic device testing
JP5787923B2 (ja) * 2013-03-15 2015-09-30 株式会社東芝 マイクロプローブおよびマイクロプローブの製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH075196A (ja) * 1993-06-18 1995-01-10 Fujitsu Autom Ltd プローブヘッドとプロービング方法
JP3762444B2 (ja) * 1993-08-24 2006-04-05 信昭 鈴木 回路基板の検査用プローブとその取付構造
JP2001324515A (ja) * 2000-05-17 2001-11-22 Suncall Corp 電子部品検査用コンタクトプローブ装置
JP2002296295A (ja) * 2001-03-29 2002-10-09 Isao Kimoto 接触子組立体の接触子保持構造
JP4721099B2 (ja) * 2004-03-16 2011-07-13 軍生 木本 電気信号接続装置及びこれを用いたプローブ組立体並びにプローバ装置
JP4521611B2 (ja) * 2004-04-09 2010-08-11 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法

Also Published As

Publication number Publication date
JP2007225581A (ja) 2007-09-06

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