JP4973666B2 - 抵抗記憶素子及びその製造方法、並びに不揮発性半導体記憶装置 - Google Patents
抵抗記憶素子及びその製造方法、並びに不揮発性半導体記憶装置 Download PDFInfo
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- JP4973666B2 JP4973666B2 JP2008548096A JP2008548096A JP4973666B2 JP 4973666 B2 JP4973666 B2 JP 4973666B2 JP 2008548096 A JP2008548096 A JP 2008548096A JP 2008548096 A JP2008548096 A JP 2008548096A JP 4973666 B2 JP4973666 B2 JP 4973666B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 30
- 239000004065 semiconductor Substances 0.000 title claims description 24
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims abstract description 71
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 64
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000013078 crystal Substances 0.000 claims abstract description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 58
- 229910052757 nitrogen Inorganic materials 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 24
- 239000007789 gas Substances 0.000 claims description 22
- 238000004544 sputter deposition Methods 0.000 claims description 20
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052786 argon Inorganic materials 0.000 claims description 4
- 230000001590 oxidative effect Effects 0.000 claims description 4
- 238000005546 reactive sputtering Methods 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 3
- 229910000510 noble metal Inorganic materials 0.000 claims description 3
- 239000010408 film Substances 0.000 description 164
- 239000010410 layer Substances 0.000 description 73
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 54
- 229910052697 platinum Inorganic materials 0.000 description 24
- 239000011229 interlayer Substances 0.000 description 23
- 230000008569 process Effects 0.000 description 17
- 230000003647 oxidation Effects 0.000 description 14
- 238000007254 oxidation reaction Methods 0.000 description 14
- 238000000151 deposition Methods 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910052814 silicon oxide Inorganic materials 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 6
- 238000001312 dry etching Methods 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 6
- 229910052719 titanium Inorganic materials 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- 238000002955 isolation Methods 0.000 description 5
- 239000013081 microcrystal Substances 0.000 description 5
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 229910010413 TiO 2 Inorganic materials 0.000 description 3
- 238000002441 X-ray diffraction Methods 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- -1 transition metal nitride Chemical class 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- 238000005477 sputtering target Methods 0.000 description 2
- 229910052723 transition metal Inorganic materials 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- IVHJCRXBQPGLOV-UHFFFAOYSA-N azanylidynetungsten Chemical compound [W]#N IVHJCRXBQPGLOV-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002003 electron diffraction Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- ZVWKZXLXHLZXLS-UHFFFAOYSA-N zirconium nitride Chemical compound [Zr]#N ZVWKZXLXHLZXLS-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/101—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including resistors or capacitors only
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/30—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/021—Formation of switching materials, e.g. deposition of layers
- H10N70/028—Formation of switching materials, e.g. deposition of layers by conversion of electrode material, e.g. oxidation
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/883—Oxides or nitrides
- H10N70/8833—Binary metal oxides, e.g. TaOx
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- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Physical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
Description
M. Fujimoto et al., "High-speed resistive switching of TiO2/TiN nano-crystalline thin film", Japanese Journal of Applied Physics, Vol. 45, No. 11, 2006, pp. L310-L312 C. Yoshida et al., "High speed resistive switching in Pt/TiO2/TiN resistor for multiple-valued memory device, Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials, 2006, pp. 580-581 K. Kinoshita et al., Applied Physics Letters, Vol. 89, 2006, 103509
12…窒化チタン膜
14…下部電極層
16…抵抗記憶層
18…上部電極層
20…シリコン基板
22…素子分離膜
24…ゲート電極
26,28…ソース/ドレイン領域
30,44,66…層間絶縁膜
32,34,46,68…コンタクトホール
36,38,48,70…コンタクトプラグ
40…グラウンド線
42…中継配線
50,56…プラチナ膜
52…窒化チタン膜
54…酸化チタン膜
58…下部電極層
60…抵抗記憶層
62…上部電極層
64…抵抗記憶素子
72…ビット線
本発明の第1実施形態による抵抗記憶素子及びその製造方法について図1乃至図10を用いて説明する。
本発明の第2実施形態による不揮発性半導体記憶装置及びその製造方法について図11乃至図14を用いて説明する。
本発明は、上記実施形態に限らず種々の変形が可能である。
Claims (9)
- 高抵抗状態と低抵抗状態とを記憶し、電圧の印加によって前記高抵抗状態と前記低抵抗状態とを切り換える抵抗記憶素子であって、
窒化チタン膜よりなる第1の電極層と、
前記第1の電極層上に形成され、ルチル相の結晶構造を有する酸化チタン膜よりなる抵抗記憶層と、
前記抵抗記憶層上に形成された第2の電極層と
を有することを特徴とする抵抗記憶素子。 - 請求項1記載の抵抗記憶素子において、
前記第1の電極層は、貴金属材料よりなる金属膜上に形成されている
ことを特徴とする抵抗記憶素子。 - 窒化チタン膜よりなる第1の電極層を形成する工程と、
前記窒化チタン膜の表面を熱酸化し、前記窒化チタン膜上に、ルチル相の結晶構造を有する酸化チタン膜よりなる抵抗記憶層を形成する工程と、
前記抵抗記憶層上に、第2の電極層を形成する工程と
を有することを特徴とする抵抗記憶素子の製造方法。 - 請求項3記載の抵抗記憶素子の製造方法において、
前記抵抗記憶層を形成する工程では、形成する前記酸化チタン膜下に前記窒化チタン膜が残存するように、前記窒化チタン膜を熱酸化する
ことを特徴とする抵抗記憶素子の製造方法。 - 請求項3又は4記載の抵抗記憶素子の製造方法において、
前記窒化チタン膜は、窒素を含むスパッタガスを用いた反応性スパッタにより形成する
ことを特徴とする抵抗記憶素子の製造方法。 - 請求項5記載の抵抗記憶素子の製造方法において、
前記スパッタガスは、5%以上の窒素を含む窒素とアルゴンとの混合ガスである
ことを特徴とする抵抗記憶素子の製造方法。 - 請求項3乃至6のいずれか1項に記載の抵抗記憶素子の製造方法において、
前記抵抗記憶層を形成する工程では、500〜600℃の温度で前記窒化チタン膜を熱酸化する
ことを特徴とする抵抗記憶素子の製造方法。 - 請求項3乃至7のいずれか1項に記載の抵抗記憶素子の製造方法において、
前記第1の電極層を形成する工程では、貴金属材料よりなる金属膜上に、前記窒化チタン膜を形成する
ことを特徴とする抵抗記憶素子の製造方法。 - 窒化チタン膜よりなる第1の電極層と、前記第1の電極層上に形成され、ルチル相の結晶構造を有する酸化チタン膜よりなる抵抗記憶層と、前記抵抗記憶層上に 形成された第2の電極層とを有し、高抵抗状態と低抵抗状態とを記憶し、電圧の印加によって前記高抵抗状態と前記低抵抗状態とを切り換える抵抗記憶素子と、
前記抵抗記憶素子の前記第1の電極層又は前記第2の電極層に接続された選択トランジスタと
を有することを特徴とする不揮発性半導体記憶装置。
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PCT/JP2006/323938 WO2008068800A1 (ja) | 2006-11-30 | 2006-11-30 | 抵抗記憶素子及びその製造方法、並びに不揮発性半導体記憶装置 |
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JPWO2008068800A1 JPWO2008068800A1 (ja) | 2010-03-11 |
JP4973666B2 true JP4973666B2 (ja) | 2012-07-11 |
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US (1) | US8102003B2 (ja) |
JP (1) | JP4973666B2 (ja) |
KR (1) | KR101136870B1 (ja) |
CN (1) | CN101536188B (ja) |
WO (1) | WO2008068800A1 (ja) |
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JP2005167064A (ja) * | 2003-12-04 | 2005-06-23 | Sharp Corp | 不揮発性半導体記憶装置 |
KR100593448B1 (ko) | 2004-09-10 | 2006-06-28 | 삼성전자주식회사 | 전이금속 산화막을 데이터 저장 물질막으로 채택하는비휘발성 기억 셀들 및 그 제조방법들 |
JP4581068B2 (ja) * | 2004-09-15 | 2010-11-17 | 独立行政法人科学技術振興機構 | 抵抗スイッチング素子及び界面抵抗型不揮発性メモリ素子 |
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2006
- 2006-11-30 CN CN2006800562604A patent/CN101536188B/zh not_active Expired - Fee Related
- 2006-11-30 KR KR1020097010597A patent/KR101136870B1/ko not_active IP Right Cessation
- 2006-11-30 WO PCT/JP2006/323938 patent/WO2008068800A1/ja active Application Filing
- 2006-11-30 JP JP2008548096A patent/JP4973666B2/ja not_active Expired - Fee Related
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2009
- 2009-05-28 US US12/473,469 patent/US8102003B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10692934B2 (en) | 2018-09-11 | 2020-06-23 | Toshiba Memory Corporation | Memory device |
Also Published As
Publication number | Publication date |
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US8102003B2 (en) | 2012-01-24 |
US20090236581A1 (en) | 2009-09-24 |
JPWO2008068800A1 (ja) | 2010-03-11 |
WO2008068800A1 (ja) | 2008-06-12 |
CN101536188B (zh) | 2010-09-29 |
CN101536188A (zh) | 2009-09-16 |
KR101136870B1 (ko) | 2012-04-20 |
KR20090087003A (ko) | 2009-08-14 |
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