JP4962454B2 - 伝送線路基板 - Google Patents
伝送線路基板 Download PDFInfo
- Publication number
- JP4962454B2 JP4962454B2 JP2008231070A JP2008231070A JP4962454B2 JP 4962454 B2 JP4962454 B2 JP 4962454B2 JP 2008231070 A JP2008231070 A JP 2008231070A JP 2008231070 A JP2008231070 A JP 2008231070A JP 4962454 B2 JP4962454 B2 JP 4962454B2
- Authority
- JP
- Japan
- Prior art keywords
- ground conductor
- substrate
- transmission line
- capacitor
- dielectric substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- 230000005540 biological transmission Effects 0.000 title claims description 23
- 239000004020 conductor Substances 0.000 claims description 61
- 239000000758 substrate Substances 0.000 claims description 35
- 239000003990 capacitor Substances 0.000 claims description 28
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000005684 electric field Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0227—Split or nearly split shielding or ground planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0239—Signal transmission by AC coupling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
- Semiconductor Integrated Circuits (AREA)
- Non-Reversible Transmitting Devices (AREA)
Description
図1は、本発明の実施の形態1に係る伝送線路基板を示す上面図である。図2は、図1のA−A´における断面図である。
Cs=ε×εr×S/d
また、誘電体膜18のインピーダンスZcsは、jを虚数単位、ωを交流の角振動数とすると、以下のように表される。
Zcs=1/jωCs
MIMキャパシタの容量Csは大きくないため、周波数が低くなるに従って誘電体膜18のインピーダンスZcsが高くなり、損失が増加する。
Zt=1/{jω(Cs+Cl)}
図3は、本発明の実施の形態2に係る伝送線路基板を示す上面図であり、図4は下面図である。
12 信号線路
14 第1の接地導体
16 第2の接地導体
18 誘電体膜
20 チップコンデンサ
22 抵抗
26 第3の接地導体
28 第4の接地導体
30,32 ヴィア
Claims (2)
- 誘電体基板と、
誘電体基板の上面に形成された信号線路と、
前記誘電体基板の上面に形成され、前記信号線路と電界結合し、互いに電位が異なる第1の接地導体及び第2の接地導体と、
前記誘電体基板の下面に形成され、前記誘電体基板を貫通するヴィアにより前記第1の接地導体及び前記第2の接地導体にそれぞれ接続された第3の接地導体及び第4の接地導体と、
重なった前記第1の接地導体の一部と前記第2の接地導体の一部との間に形成されてMIMキャパシタを構成する誘電体膜と、
前記第3の接地導体と前記第4の接地導体の間に直列に接続されたコンデンサ及び抵抗とを備えることを特徴とする伝送線路基板。 - 前記ヴィアの端から前記コンデンサまでの距離は、伝送周波数に相当する波長の1/4以下であることを特徴とする請求項1に記載の伝送線路基板。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008231070A JP4962454B2 (ja) | 2008-09-09 | 2008-09-09 | 伝送線路基板 |
US12/392,504 US7969261B2 (en) | 2008-09-09 | 2009-02-25 | Transmission line substrate having overlapping ground conductors that constitute a MIM capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008231070A JP4962454B2 (ja) | 2008-09-09 | 2008-09-09 | 伝送線路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010068112A JP2010068112A (ja) | 2010-03-25 |
JP4962454B2 true JP4962454B2 (ja) | 2012-06-27 |
Family
ID=41798734
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008231070A Active JP4962454B2 (ja) | 2008-09-09 | 2008-09-09 | 伝送線路基板 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7969261B2 (ja) |
JP (1) | JP4962454B2 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10485095B2 (en) | 2011-03-10 | 2019-11-19 | Mediatek, Inc. | Printed circuit board design for high speed application |
US9949360B2 (en) | 2011-03-10 | 2018-04-17 | Mediatek Inc. | Printed circuit board design for high speed application |
JP2013118428A (ja) * | 2011-12-01 | 2013-06-13 | Mitsubishi Electric Corp | マイクロストリップ伝送線路および高周波増幅器 |
CN104752799A (zh) * | 2013-12-31 | 2015-07-01 | 四零四科技股份有限公司 | 无线通讯电路保护结构 |
US9426871B2 (en) * | 2014-02-04 | 2016-08-23 | Moxa Inc. | Wireless communications circuit protection structure |
CN106169482B (zh) * | 2016-08-01 | 2019-04-09 | 京东方科技集团股份有限公司 | 一种基板及其制作方法、电子器件 |
US10003116B1 (en) * | 2017-03-29 | 2018-06-19 | Novatek Microelectronics Corp. | Electronic apparatus having coplanar waveguide transmission line |
US20190363748A1 (en) * | 2018-05-23 | 2019-11-28 | Qualcomm Incorporated | Integrated Passive Device Transmission-Line Resonator |
EP3849286A1 (en) * | 2020-01-09 | 2021-07-14 | Murata Manufacturing Co., Ltd. | Electronic device with differential transmission lines equipped with 3d capacitors supported by a base, and corresponding manufacturing method |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60172801A (ja) * | 1984-02-17 | 1985-09-06 | Nippon Telegr & Teleph Corp <Ntt> | マイクロ波伝送線路 |
US5777528A (en) * | 1995-05-26 | 1998-07-07 | Motorola, Inc. | Mode suppressing coplanar waveguide transition and method |
JP3573935B2 (ja) | 1997-11-25 | 2004-10-06 | 株式会社リコー | マイクロ波回路 |
JPH11355007A (ja) * | 1998-04-07 | 1999-12-24 | Nec Corp | マイクロ波・ミリ波回路 |
JP3611728B2 (ja) | 1998-08-19 | 2005-01-19 | シャープ株式会社 | ミリ波用ミキサ回路基板 |
JP3430060B2 (ja) | 1999-02-22 | 2003-07-28 | シャープ株式会社 | 高周波用半導体装置 |
JP3437826B2 (ja) | 2000-09-21 | 2003-08-18 | 株式会社東芝 | マイクロ波回路 |
JP2003188047A (ja) * | 2001-12-14 | 2003-07-04 | Mitsubishi Electric Corp | Dcブロック回路および通信装置 |
JP3916072B2 (ja) * | 2003-02-04 | 2007-05-16 | 住友電気工業株式会社 | 交流結合回路 |
JP3966865B2 (ja) * | 2004-04-08 | 2007-08-29 | 富士通株式会社 | Dcカット構造 |
-
2008
- 2008-09-09 JP JP2008231070A patent/JP4962454B2/ja active Active
-
2009
- 2009-02-25 US US12/392,504 patent/US7969261B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US7969261B2 (en) | 2011-06-28 |
JP2010068112A (ja) | 2010-03-25 |
US20100060390A1 (en) | 2010-03-11 |
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