JP4961179B2 - 基板処理装置及び半導体装置の製造方法 - Google Patents

基板処理装置及び半導体装置の製造方法 Download PDF

Info

Publication number
JP4961179B2
JP4961179B2 JP2006216028A JP2006216028A JP4961179B2 JP 4961179 B2 JP4961179 B2 JP 4961179B2 JP 2006216028 A JP2006216028 A JP 2006216028A JP 2006216028 A JP2006216028 A JP 2006216028A JP 4961179 B2 JP4961179 B2 JP 4961179B2
Authority
JP
Japan
Prior art keywords
substrate
wafer
susceptor
processing
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006216028A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008042023A (ja
JP2008042023A5 (enExample
Inventor
幸一郎 原田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Denki Electric Inc
Original Assignee
Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Kokusai Electric Inc, Kokusai Denki Electric Inc filed Critical Hitachi Kokusai Electric Inc
Priority to JP2006216028A priority Critical patent/JP4961179B2/ja
Publication of JP2008042023A publication Critical patent/JP2008042023A/ja
Publication of JP2008042023A5 publication Critical patent/JP2008042023A5/ja
Application granted granted Critical
Publication of JP4961179B2 publication Critical patent/JP4961179B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
JP2006216028A 2006-08-08 2006-08-08 基板処理装置及び半導体装置の製造方法 Active JP4961179B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006216028A JP4961179B2 (ja) 2006-08-08 2006-08-08 基板処理装置及び半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006216028A JP4961179B2 (ja) 2006-08-08 2006-08-08 基板処理装置及び半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2008042023A JP2008042023A (ja) 2008-02-21
JP2008042023A5 JP2008042023A5 (enExample) 2009-09-10
JP4961179B2 true JP4961179B2 (ja) 2012-06-27

Family

ID=39176685

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006216028A Active JP4961179B2 (ja) 2006-08-08 2006-08-08 基板処理装置及び半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP4961179B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010084230A (ja) * 2008-09-04 2010-04-15 Tokyo Electron Ltd 成膜装置、基板処理装置及び回転テーブル
JP5264403B2 (ja) * 2008-10-14 2013-08-14 株式会社アルバック プラズマエッチング装置において用いる基板トレイ、エッチング装置及びエッチング方法
JP5869899B2 (ja) * 2011-04-01 2016-02-24 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、基板処理方法及びサセプタカバー
JP6066571B2 (ja) * 2012-02-17 2017-01-25 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
JP2018095916A (ja) * 2016-12-13 2018-06-21 株式会社日立国際電気 基板処理装置、リソグラフィ用テンプレートの製造方法、プログラム
JP2020021922A (ja) * 2018-07-24 2020-02-06 住友電気工業株式会社 基板加熱ユニットおよび表面板
JP7450512B2 (ja) * 2020-10-07 2024-03-15 東京エレクトロン株式会社 基板処理方法及び基板処理装置
CN117364065A (zh) * 2022-07-01 2024-01-09 苏州珂玛材料科技股份有限公司 一种更换陶瓷加热器顶部结构使之具有静电吸附能力的方法
CN117364064A (zh) * 2022-07-01 2024-01-09 苏州珂玛材料科技股份有限公司 一种适用于不同尺寸晶圆的加热器的制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3064409B2 (ja) * 1990-11-30 2000-07-12 株式会社日立製作所 保持装置およびそれを用いた半導体製造装置
JPH06349810A (ja) * 1993-06-02 1994-12-22 Hitachi Electron Eng Co Ltd 気相反応装置
JP3312163B2 (ja) * 1994-11-18 2002-08-05 日本電信電話株式会社 真空吸着装置
JP2002134487A (ja) * 2000-10-25 2002-05-10 Hitachi Ltd 半導体装置の製造方法
JP2003142566A (ja) * 2001-11-07 2003-05-16 New Creation Co Ltd 真空吸着器及びその製造方法
JP2005064284A (ja) * 2003-08-14 2005-03-10 Asm Japan Kk 半導体基板保持装置
JP4444843B2 (ja) * 2005-01-31 2010-03-31 住友大阪セメント株式会社 静電チャック
JP2007067394A (ja) * 2005-08-05 2007-03-15 Tokyo Electron Ltd 基板処理装置およびそれに用いる基板載置台

Also Published As

Publication number Publication date
JP2008042023A (ja) 2008-02-21

Similar Documents

Publication Publication Date Title
CN112992639B (zh) 具有静电卡盘的基板处理装置及基板处理方法
TWI861122B (zh) 載置台及電漿處理裝置
CN102067737B (zh) 具有不同高度的内外电极的阴极
KR102487342B1 (ko) 정전척 어셈블리 및 이를 구비하는 플라즈마 처리장치
KR102092623B1 (ko) 플라스마 처리 장치
JP7382329B2 (ja) 基板支持体のためのプロセスキット
TWI717631B (zh) 電漿處理裝置
JP7110020B2 (ja) 基板支持装置およびプラズマ処理装置
KR102353796B1 (ko) 정전척, 배치대, 플라즈마 처리 장치, 및 정전척의 제조방법
US20060005930A1 (en) Substrate supporting structure for semiconductor processing, and plasma processing device
CN116457931A (zh) 高温双极静电卡盘
KR20130111221A (ko) 프로세스 공간이 한정된 ｐｅｃｖｄ 챔버
TW202117912A (zh) 基板支持器及電漿處理裝置
TWI880938B (zh) 包含擋門之組件及基板處理裝置
JP4961179B2 (ja) 基板処理装置及び半導体装置の製造方法
JP4777790B2 (ja) プラズマ処理室用構造物、プラズマ処理室、及びプラズマ処理装置
TW201543532A (zh) 用於基板之電漿處理之方法及裝置
JP5171584B2 (ja) 基板処理装置の基板載置台、基板処理装置及び半導体デバイスの製造方法
JP2009152233A (ja) 半導体製造装置
JP2008053489A (ja) 基板処理装置
JP2005093886A (ja) 半導体製造装置
KR20230092672A (ko) 포커스 링 및 이를 포함하는 기판 처리 장치
KR20080030713A (ko) 기판 가공 장치
TW202447828A (zh) 電漿處理裝置、基板支持器及環構造
JP2008270468A (ja) 基板処理装置及び半導体装置の製造方法。

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090728

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090728

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100820

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110531

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110725

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111220

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20120213

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120216

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120313

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120326

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150330

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4961179

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250