JP2008042023A5 - - Google Patents

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Publication number
JP2008042023A5
JP2008042023A5 JP2006216028A JP2006216028A JP2008042023A5 JP 2008042023 A5 JP2008042023 A5 JP 2008042023A5 JP 2006216028 A JP2006216028 A JP 2006216028A JP 2006216028 A JP2006216028 A JP 2006216028A JP 2008042023 A5 JP2008042023 A5 JP 2008042023A5
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JP
Japan
Prior art keywords
substrate
processing
susceptor
mounting body
processing apparatus
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JP2006216028A
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English (en)
Japanese (ja)
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JP4961179B2 (ja
JP2008042023A (ja
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Priority to JP2006216028A priority Critical patent/JP4961179B2/ja
Priority claimed from JP2006216028A external-priority patent/JP4961179B2/ja
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Publication of JP2008042023A5 publication Critical patent/JP2008042023A5/ja
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JP2006216028A 2006-08-08 2006-08-08 基板処理装置及び半導体装置の製造方法 Active JP4961179B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006216028A JP4961179B2 (ja) 2006-08-08 2006-08-08 基板処理装置及び半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006216028A JP4961179B2 (ja) 2006-08-08 2006-08-08 基板処理装置及び半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2008042023A JP2008042023A (ja) 2008-02-21
JP2008042023A5 true JP2008042023A5 (enExample) 2009-09-10
JP4961179B2 JP4961179B2 (ja) 2012-06-27

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ID=39176685

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JP2006216028A Active JP4961179B2 (ja) 2006-08-08 2006-08-08 基板処理装置及び半導体装置の製造方法

Country Status (1)

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JP (1) JP4961179B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010084230A (ja) * 2008-09-04 2010-04-15 Tokyo Electron Ltd 成膜装置、基板処理装置及び回転テーブル
JP5264403B2 (ja) * 2008-10-14 2013-08-14 株式会社アルバック プラズマエッチング装置において用いる基板トレイ、エッチング装置及びエッチング方法
JP5869899B2 (ja) * 2011-04-01 2016-02-24 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、基板処理方法及びサセプタカバー
JP6066571B2 (ja) * 2012-02-17 2017-01-25 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
JP2018095916A (ja) * 2016-12-13 2018-06-21 株式会社日立国際電気 基板処理装置、リソグラフィ用テンプレートの製造方法、プログラム
JP2020021922A (ja) * 2018-07-24 2020-02-06 住友電気工業株式会社 基板加熱ユニットおよび表面板
JP7450512B2 (ja) * 2020-10-07 2024-03-15 東京エレクトロン株式会社 基板処理方法及び基板処理装置
CN117364064A (zh) * 2022-07-01 2024-01-09 苏州珂玛材料科技股份有限公司 一种适用于不同尺寸晶圆的加热器的制备方法
CN117364065A (zh) * 2022-07-01 2024-01-09 苏州珂玛材料科技股份有限公司 一种更换陶瓷加热器顶部结构使之具有静电吸附能力的方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3064409B2 (ja) * 1990-11-30 2000-07-12 株式会社日立製作所 保持装置およびそれを用いた半導体製造装置
JPH06349810A (ja) * 1993-06-02 1994-12-22 Hitachi Electron Eng Co Ltd 気相反応装置
JP3312163B2 (ja) * 1994-11-18 2002-08-05 日本電信電話株式会社 真空吸着装置
JP2002134487A (ja) * 2000-10-25 2002-05-10 Hitachi Ltd 半導体装置の製造方法
JP2003142566A (ja) * 2001-11-07 2003-05-16 New Creation Co Ltd 真空吸着器及びその製造方法
JP2005064284A (ja) * 2003-08-14 2005-03-10 Asm Japan Kk 半導体基板保持装置
JP4444843B2 (ja) * 2005-01-31 2010-03-31 住友大阪セメント株式会社 静電チャック
JP2007067394A (ja) * 2005-08-05 2007-03-15 Tokyo Electron Ltd 基板処理装置およびそれに用いる基板載置台

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