JP2008042023A5 - - Google Patents

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Publication number
JP2008042023A5
JP2008042023A5 JP2006216028A JP2006216028A JP2008042023A5 JP 2008042023 A5 JP2008042023 A5 JP 2008042023A5 JP 2006216028 A JP2006216028 A JP 2006216028A JP 2006216028 A JP2006216028 A JP 2006216028A JP 2008042023 A5 JP2008042023 A5 JP 2008042023A5
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JP
Japan
Prior art keywords
substrate
processing
susceptor
mounting body
processing apparatus
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JP2006216028A
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Japanese (ja)
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JP4961179B2 (en
JP2008042023A (en
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Priority to JP2006216028A priority Critical patent/JP4961179B2/en
Priority claimed from JP2006216028A external-priority patent/JP4961179B2/en
Publication of JP2008042023A publication Critical patent/JP2008042023A/en
Publication of JP2008042023A5 publication Critical patent/JP2008042023A5/ja
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Publication of JP4961179B2 publication Critical patent/JP4961179B2/en
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Claims (2)

プラズマにより基板を処理する処理容器と、
前記処理容器の中に設けられアース電極を有するサセプタと、
前記サセプタの上に設けられ少なくとも前記基板の周縁部を支持する支持部を有する基板載置体と
を備えた基板処理装置。 A processing vessel for processing a substrate with plasma;
A susceptor provided in the processing vessel and having a ground electrode;
The substrate processing apparatus provided with the substrate mounting body which has a support part which is provided on the said susceptor and supports the peripheral part of the said substrate at least. 前記基板載置体は、非金属材料ないし絶縁体である請求項１記載の基板処理装置。The substrate processing apparatus according to claim 1, wherein the substrate mounting body is a non-metallic material or an insulator.
JP2006216028A 2006-08-08 2006-08-08 Substrate processing apparatus and semiconductor device manufacturing method Active JP4961179B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006216028A JP4961179B2 (en) 2006-08-08 2006-08-08 Substrate processing apparatus and semiconductor device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006216028A JP4961179B2 (en) 2006-08-08 2006-08-08 Substrate processing apparatus and semiconductor device manufacturing method

Publications (3)

Publication Number Publication Date
JP2008042023A JP2008042023A (en) 2008-02-21
JP2008042023A5 true JP2008042023A5 (en) 2009-09-10
JP4961179B2 JP4961179B2 (en) 2012-06-27

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ID=39176685

Family Applications (1)

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JP2006216028A Active JP4961179B2 (en) 2006-08-08 2006-08-08 Substrate processing apparatus and semiconductor device manufacturing method

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JP (1) JP4961179B2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010084230A (en) * 2008-09-04 2010-04-15 Tokyo Electron Ltd Film deposition apparatus, substrate process apparatus, and turntable
JP5264403B2 (en) * 2008-10-14 2013-08-14 株式会社アルバック Substrate tray, etching apparatus and etching method used in plasma etching apparatus
JP5869899B2 (en) * 2011-04-01 2016-02-24 株式会社日立国際電気 Substrate processing apparatus, semiconductor device manufacturing method, substrate processing method, and susceptor cover
JP6066571B2 (en) * 2012-02-17 2017-01-25 株式会社日立国際電気 Substrate processing apparatus and semiconductor device manufacturing method
JP2018095916A (en) * 2016-12-13 2018-06-21 株式会社日立国際電気 Substrate treatment apparatus, lithography temperature manufacturing method, program
JP2020021922A (en) * 2018-07-24 2020-02-06 住友電気工業株式会社 Substrate heating unit and surface plate

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3064409B2 (en) * 1990-11-30 2000-07-12 株式会社日立製作所 Holding device and semiconductor manufacturing apparatus using the same
JPH06349810A (en) * 1993-06-02 1994-12-22 Hitachi Electron Eng Co Ltd Vapor phase reaction apparatus
JP3312163B2 (en) * 1994-11-18 2002-08-05 日本電信電話株式会社 Vacuum suction device
JP2002134487A (en) * 2000-10-25 2002-05-10 Hitachi Ltd Method for manufacturing semiconductor device
JP2003142566A (en) * 2001-11-07 2003-05-16 New Creation Co Ltd Vacuum sucker and its manufacturing method
JP2005064284A (en) * 2003-08-14 2005-03-10 Asm Japan Kk Semiconductor substrate holding device
JP4444843B2 (en) * 2005-01-31 2010-03-31 住友大阪セメント株式会社 Electrostatic chuck
JP2007067394A (en) * 2005-08-05 2007-03-15 Tokyo Electron Ltd Substrate processing apparatus and substrate stage used for the same

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