JP7382329B2 - 基板支持体のためのプロセスキット - Google Patents
基板支持体のためのプロセスキット Download PDFInfo
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- JP7382329B2 JP7382329B2 JP2020539696A JP2020539696A JP7382329B2 JP 7382329 B2 JP7382329 B2 JP 7382329B2 JP 2020539696 A JP2020539696 A JP 2020539696A JP 2020539696 A JP2020539696 A JP 2020539696A JP 7382329 B2 JP7382329 B2 JP 7382329B2
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- edge ring
- substrate support
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- 239000000758 substrate Substances 0.000 title claims description 114
- 238000000034 method Methods 0.000 title claims description 51
- 230000008569 process Effects 0.000 title claims description 45
- 230000002093 peripheral effect Effects 0.000 claims description 29
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000010453 quartz Substances 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 238000012545 processing Methods 0.000 description 27
- 238000009616 inductively coupled plasma Methods 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 8
- 239000012212 insulator Substances 0.000 description 7
- 230000005684 electric field Effects 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 239000008246 gaseous mixture Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
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- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
- H01J2237/3343—Problems associated with etching
- H01J2237/3344—Problems associated with etching isotropy
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
Claims (14)
- 石英で製作され、上面および下面を有する上部エッジリングであり、前記上面が、実質的に平面であり、前記下面が、前記上部エッジリングの半径方向最外部分を画定する第1の段差を有すると共に、前記上部エッジリングの半径方向最内部分を画定する第2の段差を有する階段状下面を含み、前記半径方向最外部分と前記半径方向最内部分との間に延び、前記半径方向最外部分と前記半径方向最内部分を分ける中央部分を有しており、前記上部エッジリングの内面が、前記上面から前記下面まで一定の直径で延びている、上部エッジリングと、
下部エッジリングであって、前記下部エッジリングは、前記階段状下面の前記第1の段差から半径方向に間隔を空けて配置されており、前記下部エッジリングは、前記上部エッジリングの前記階段状下面の前記第2の段差と連係するように構成されている、下部エッジリングと
を含む基板支持体のためのプロセスキット。 - 前記下部エッジリングが、上部外周エッジに沿ってノッチを有し、前記上部エッジリングの前記階段状下面が、前記ノッチと連係するように構成される、請求項1に記載のプロセスキット。
- 前記上部エッジリングが、前記下部エッジリングの内径よりも小さい内径、および前記下部エッジリングの外径よりも大きい外径を有する、請求項1に記載のプロセスキット。
- 前記下部エッジリングが導電性である、請求項1に記載のプロセスキット。
- 前記半径方向最外部分が、前記半径方向最内部分の厚さよりも大きい厚さを有する、請求項1に記載のプロセスキット。
- 前記上部エッジリングが、前記上面を、前記上部エッジリングの外周壁に、または前記上部エッジリングの前記下面に接続する湾曲した上部周辺エッジを含む、請求項1~5のいずれか1項に記載のプロセスキット。
- 前記上部エッジリングが、約1.5インチ~約2.0インチの幅を有する、請求項1~5のいずれか1項に記載のプロセスキット。
- 前記上部エッジリングの前記半径方向最内部分が、約13.5インチ~約14.5インチの外径を有する、請求項1~5のいずれか1項に記載のプロセスキット。
- 基板支持体であって、
所与の直径を有する基板を支持するように構成された基板支持面を支持する基部と、
前記基板支持体の上に配設された請求項1に記載のプロセスキットとを備え、
前記下部エッジリングが、前記基部の上面の上方および前記基板支持面の下方の高さに位置づけられた上面を有し、
前記上部エッジリングが、前記所与の直径よりも小さい内径および前記基部の外径よりも大きい外径を有する、基板支持体。 - 前記基部の上に配設された前記基板支持体の上部部分であり、前記基板支持体の前記上部部分の上面が前記基板支持面を含む、前記基板支持体の上部部分
をさらに含む、請求項9に記載の基板支持体。 - 前記基板支持体の前記上部部分が、半径方向外側に延びる外周棚を含み、前記上部エッジリングが、前記外周棚に載るように構成された下面を有する、請求項10に記載の基板支持体。
- 前記下部エッジリングが、上部外周エッジにノッチを有し、前記上部エッジリングが、前記上部エッジリングと前記下部エッジリングとを位置合わせするために前記ノッチと連係するように構成された輪郭形成済み下面を有する、請求項9~11のいずれかに記載の基板支持体。
- 前記下部エッジリングが、アルミニウムまたはアルミニウム合金で製作される、請求項9~11のいずれかに記載の基板支持体。
- 前記下部エッジリングが、湾曲したエッジを含む、請求項9~11のいずれかに記載の基板支持体。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862619473P | 2018-01-19 | 2018-01-19 | |
US62/619,473 | 2018-01-19 | ||
US16/249,716 | 2019-01-16 | ||
US16/249,716 US11387134B2 (en) | 2018-01-19 | 2019-01-16 | Process kit for a substrate support |
PCT/US2019/014076 WO2019143858A1 (en) | 2018-01-19 | 2019-01-17 | Process kit for a substrate support |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2021511663A JP2021511663A (ja) | 2021-05-06 |
JPWO2019143858A5 JPWO2019143858A5 (ja) | 2022-01-26 |
JP7382329B2 true JP7382329B2 (ja) | 2023-11-16 |
Family
ID=67300133
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020539696A Active JP7382329B2 (ja) | 2018-01-19 | 2019-01-17 | 基板支持体のためのプロセスキット |
Country Status (6)
Country | Link |
---|---|
US (1) | US11387134B2 (ja) |
JP (1) | JP7382329B2 (ja) |
KR (1) | KR20200101993A (ja) |
CN (1) | CN111587481A (ja) |
TW (1) | TWI840341B (ja) |
WO (1) | WO2019143858A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10658222B2 (en) | 2015-01-16 | 2020-05-19 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
EP4010915A4 (en) * | 2019-08-05 | 2023-12-13 | Lam Research Corporation | EDGE RING SYSTEMS FOR SUBSTRATE PROCESSING SYSTEMS |
KR102077975B1 (ko) * | 2019-10-15 | 2020-02-14 | 주식회사 기가레인 | 플라즈마 처리 수직도가 향상된 플라즈마 처리 장치 |
US20220108908A1 (en) * | 2020-10-06 | 2022-04-07 | Applied Materials, Inc. | Shadow ring kit for plasma etch wafer singulation process |
WO2024137297A1 (en) * | 2022-12-20 | 2024-06-27 | Lam Research Corporation | Lower plasma exclusion zone ring for controlling plasma deposition or etching near a substrate notch |
JP2024090654A (ja) * | 2022-12-23 | 2024-07-04 | 住友大阪セメント株式会社 | 静電チャック部材及び静電チャック装置 |
JP7529008B2 (ja) | 2022-12-23 | 2024-08-06 | 住友大阪セメント株式会社 | 静電チャック部材及び静電チャック装置 |
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2019
- 2019-01-16 US US16/249,716 patent/US11387134B2/en active Active
- 2019-01-17 CN CN201980008203.6A patent/CN111587481A/zh active Pending
- 2019-01-17 KR KR1020207023788A patent/KR20200101993A/ko not_active Application Discontinuation
- 2019-01-17 JP JP2020539696A patent/JP7382329B2/ja active Active
- 2019-01-17 WO PCT/US2019/014076 patent/WO2019143858A1/en active Application Filing
- 2019-01-18 TW TW108101940A patent/TWI840341B/zh active
Patent Citations (5)
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JP2002246370A (ja) | 2001-02-15 | 2002-08-30 | Tokyo Electron Ltd | フォーカスリング及びプラズマ処理装置 |
JP2007300057A (ja) | 2006-04-27 | 2007-11-15 | Applied Materials Inc | 二重温度帯を有する静電チャックをもつ基板支持体 |
JP2011108764A (ja) | 2009-11-16 | 2011-06-02 | Hitachi High-Technologies Corp | プラズマ処理装置 |
US20150179412A1 (en) | 2013-12-20 | 2015-06-25 | Lam Research Corporation | Edge ring dimensioned to extend lifetime of elastomer seal in a plasma processing chamber |
JP3209624U (ja) | 2016-01-22 | 2017-03-30 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 容量結合型プラズマ処理装置のエッジリングのrf振幅の制御 |
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KR20200101993A (ko) | 2020-08-28 |
JP2021511663A (ja) | 2021-05-06 |
TWI840341B (zh) | 2024-05-01 |
TW201941354A (zh) | 2019-10-16 |
US20190229007A1 (en) | 2019-07-25 |
US11387134B2 (en) | 2022-07-12 |
WO2019143858A1 (en) | 2019-07-25 |
CN111587481A (zh) | 2020-08-25 |
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