JP4958655B2 - 電子部品実装装置および電子装置の製造方法 - Google Patents

電子部品実装装置および電子装置の製造方法 Download PDF

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Publication number
JP4958655B2
JP4958655B2 JP2007168502A JP2007168502A JP4958655B2 JP 4958655 B2 JP4958655 B2 JP 4958655B2 JP 2007168502 A JP2007168502 A JP 2007168502A JP 2007168502 A JP2007168502 A JP 2007168502A JP 4958655 B2 JP4958655 B2 JP 4958655B2
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JP
Japan
Prior art keywords
electronic component
mounting
mounting substrate
substrate
mounting apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007168502A
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English (en)
Japanese (ja)
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JP2009010074A5 (https=
JP2009010074A (ja
Inventor
俊幸 倉持
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2007168502A priority Critical patent/JP4958655B2/ja
Priority to KR1020080058249A priority patent/KR20080114531A/ko
Priority to US12/146,936 priority patent/US7712649B2/en
Priority to CNA2008101261380A priority patent/CN101335222A/zh
Publication of JP2009010074A publication Critical patent/JP2009010074A/ja
Publication of JP2009010074A5 publication Critical patent/JP2009010074A5/ja
Application granted granted Critical
Publication of JP4958655B2 publication Critical patent/JP4958655B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding

Landscapes

  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2007168502A 2007-06-27 2007-06-27 電子部品実装装置および電子装置の製造方法 Expired - Fee Related JP4958655B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007168502A JP4958655B2 (ja) 2007-06-27 2007-06-27 電子部品実装装置および電子装置の製造方法
KR1020080058249A KR20080114531A (ko) 2007-06-27 2008-06-20 전자 부품 실장 장치 및 전자 장치의 제조 방법
US12/146,936 US7712649B2 (en) 2007-06-27 2008-06-26 Using a simultaneously tilting and moving bonding apparatus
CNA2008101261380A CN101335222A (zh) 2007-06-27 2008-06-27 电子元件安装装置及制造电子器件的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007168502A JP4958655B2 (ja) 2007-06-27 2007-06-27 電子部品実装装置および電子装置の製造方法

Publications (3)

Publication Number Publication Date
JP2009010074A JP2009010074A (ja) 2009-01-15
JP2009010074A5 JP2009010074A5 (https=) 2010-04-22
JP4958655B2 true JP4958655B2 (ja) 2012-06-20

Family

ID=40159163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007168502A Expired - Fee Related JP4958655B2 (ja) 2007-06-27 2007-06-27 電子部品実装装置および電子装置の製造方法

Country Status (4)

Country Link
US (1) US7712649B2 (https=)
JP (1) JP4958655B2 (https=)
KR (1) KR20080114531A (https=)
CN (1) CN101335222A (https=)

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US9314869B2 (en) * 2012-01-13 2016-04-19 Asm Technology Singapore Pte. Ltd. Method of recovering a bonding apparatus from a bonding failure
US8870051B2 (en) * 2012-05-03 2014-10-28 International Business Machines Corporation Flip chip assembly apparatus employing a warpage-suppressor assembly
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CH707934B1 (de) * 2013-04-19 2017-04-28 Besi Switzerland Ag Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.
JP5608829B1 (ja) * 2014-03-31 2014-10-15 アルファーデザイン株式会社 部品実装装置
CN104439777B (zh) * 2014-11-10 2016-03-30 深圳市鹏煜威科技有限公司 一种机脚夹持装置
US9929121B2 (en) 2015-08-31 2018-03-27 Kulicke And Soffa Industries, Inc. Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines
WO2018146880A1 (ja) * 2017-02-09 2018-08-16 ボンドテック株式会社 部品実装システム、樹脂成形装置、部品実装方法および樹脂成形方法
US10571682B2 (en) 2017-08-10 2020-02-25 Infineon Technologies Ag Tilted chip assembly for optical devices
CN111434202B (zh) * 2017-12-07 2021-06-22 雅马哈发动机株式会社 被安装物作业装置
DE102018115144A1 (de) * 2018-06-23 2019-12-24 Besi Switzerland Ag Stellantrieb für einen Bondkopf
WO2023200659A1 (en) 2022-04-12 2023-10-19 Kulicke And Soffa Industries, Inc. Methods of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system, and related bonding systems
CN117198896B (zh) * 2022-05-31 2024-07-19 长沙瑶华半导体科技有限公司 一种曲面法兰表面多点测高贴片方法
CN118046150B (zh) * 2024-04-11 2024-06-21 潍坊鸿洋机械科技有限公司 一种汽车排气管制作加工焊接装置

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Also Published As

Publication number Publication date
KR20080114531A (ko) 2008-12-31
US20090001133A1 (en) 2009-01-01
CN101335222A (zh) 2008-12-31
JP2009010074A (ja) 2009-01-15
US7712649B2 (en) 2010-05-11

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