CN101335222A - 电子元件安装装置及制造电子器件的方法 - Google Patents

电子元件安装装置及制造电子器件的方法 Download PDF

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Publication number
CN101335222A
CN101335222A CNA2008101261380A CN200810126138A CN101335222A CN 101335222 A CN101335222 A CN 101335222A CN A2008101261380 A CNA2008101261380 A CN A2008101261380A CN 200810126138 A CN200810126138 A CN 200810126138A CN 101335222 A CN101335222 A CN 101335222A
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CN
China
Prior art keywords
electronic component
mounting
mounting substrate
electronic
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2008101261380A
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English (en)
Chinese (zh)
Inventor
仓持俊幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Co Ltd
Original Assignee
Shinko Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Co Ltd filed Critical Shinko Electric Co Ltd
Publication of CN101335222A publication Critical patent/CN101335222A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding

Landscapes

  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CNA2008101261380A 2007-06-27 2008-06-27 电子元件安装装置及制造电子器件的方法 Pending CN101335222A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007168502A JP4958655B2 (ja) 2007-06-27 2007-06-27 電子部品実装装置および電子装置の製造方法
JP2007168502 2007-06-27

Publications (1)

Publication Number Publication Date
CN101335222A true CN101335222A (zh) 2008-12-31

Family

ID=40159163

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2008101261380A Pending CN101335222A (zh) 2007-06-27 2008-06-27 电子元件安装装置及制造电子器件的方法

Country Status (4)

Country Link
US (1) US7712649B2 (https=)
JP (1) JP4958655B2 (https=)
KR (1) KR20080114531A (https=)
CN (1) CN101335222A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
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CN103943520A (zh) * 2013-01-21 2014-07-23 贝思瑞士股份公司 具有可加热和可冷却抽吸构件的结合头
CN104112688A (zh) * 2013-04-19 2014-10-22 贝思瑞士股份公司 用于将电子或光学部件安装在基板上的方法和设备
CN111434202A (zh) * 2017-12-07 2020-07-17 雅马哈发动机株式会社 被安装物作业装置
CN117198896A (zh) * 2022-05-31 2023-12-08 长沙瑶华半导体科技有限公司 一种曲面法兰表面多点测高贴片方法

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US8870051B2 (en) * 2012-05-03 2014-10-28 International Business Machines Corporation Flip chip assembly apparatus employing a warpage-suppressor assembly
JP5608829B1 (ja) * 2014-03-31 2014-10-15 アルファーデザイン株式会社 部品実装装置
CN104439777B (zh) * 2014-11-10 2016-03-30 深圳市鹏煜威科技有限公司 一种机脚夹持装置
US9929121B2 (en) 2015-08-31 2018-03-27 Kulicke And Soffa Industries, Inc. Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines
WO2018146880A1 (ja) * 2017-02-09 2018-08-16 ボンドテック株式会社 部品実装システム、樹脂成形装置、部品実装方法および樹脂成形方法
US10571682B2 (en) 2017-08-10 2020-02-25 Infineon Technologies Ag Tilted chip assembly for optical devices
DE102018115144A1 (de) * 2018-06-23 2019-12-24 Besi Switzerland Ag Stellantrieb für einen Bondkopf
WO2023200659A1 (en) 2022-04-12 2023-10-19 Kulicke And Soffa Industries, Inc. Methods of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system, and related bonding systems
CN118046150B (zh) * 2024-04-11 2024-06-21 潍坊鸿洋机械科技有限公司 一种汽车排气管制作加工焊接装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103943520A (zh) * 2013-01-21 2014-07-23 贝思瑞士股份公司 具有可加热和可冷却抽吸构件的结合头
CN103943520B (zh) * 2013-01-21 2017-11-17 贝思瑞士股份公司 具有可加热和可冷却抽吸构件的结合头
CN104112688A (zh) * 2013-04-19 2014-10-22 贝思瑞士股份公司 用于将电子或光学部件安装在基板上的方法和设备
CN104112688B (zh) * 2013-04-19 2018-03-23 贝思瑞士股份公司 用于将电子或光学部件安装在基板上的方法和设备
CN111434202A (zh) * 2017-12-07 2020-07-17 雅马哈发动机株式会社 被安装物作业装置
CN111434202B (zh) * 2017-12-07 2021-06-22 雅马哈发动机株式会社 被安装物作业装置
CN117198896A (zh) * 2022-05-31 2023-12-08 长沙瑶华半导体科技有限公司 一种曲面法兰表面多点测高贴片方法

Also Published As

Publication number Publication date
JP4958655B2 (ja) 2012-06-20
KR20080114531A (ko) 2008-12-31
US20090001133A1 (en) 2009-01-01
JP2009010074A (ja) 2009-01-15
US7712649B2 (en) 2010-05-11

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Open date: 20081231