JP4954591B2 - 発光装置およびその製造方法 - Google Patents
発光装置およびその製造方法 Download PDFInfo
- Publication number
- JP4954591B2 JP4954591B2 JP2006111292A JP2006111292A JP4954591B2 JP 4954591 B2 JP4954591 B2 JP 4954591B2 JP 2006111292 A JP2006111292 A JP 2006111292A JP 2006111292 A JP2006111292 A JP 2006111292A JP 4954591 B2 JP4954591 B2 JP 4954591B2
- Authority
- JP
- Japan
- Prior art keywords
- runner
- light emitting
- emitting device
- resin
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/24—Feeding the material into the mould
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Description
2、202、302 配線パターン
3 チップ
5 ランナー部
205 主ランナー部
205a 副ランナー部
8 封止樹脂
10、310 樹脂部
11 ランナー
12、312 主平面
13 リフレクタ
15、315 発光装置
21 金型
21a、221a キャビティ型
21b ベース型
22 樹脂注入口
23 キャビティ
24 エアーベント
26 セット面
Claims (8)
- 互いに離間された配線パターンを基材の主平面に形成し、前記配線パターン間の間隙を封止樹脂を注入するランナー部とする基板と、該基板上にダイボンディングされる発光素子と、前記ランナー部から注入した封止樹脂によって前記発光素子を封止する樹脂部とを備えてなる発光装置であって、
前記主平面において、前記配線パターンの表面と、前記ランナー部に封止樹脂が充填されて形成されたランナーの表面とが面一であることを特徴とする発光装置。 - 前記樹脂部にレンズを一体的に形成してなることを特徴とする請求項1に記載の発光装置。
- 前記主平面上にリフレクタが配設されてなることを特徴とする請求項1または2に記載の発光装置。
- キャビティ部と該キャビティ部に連通される樹脂注入口および大気に開放されているエアーベントとを備えた金型に、主平面に発光素子をダイボンディングするとともに互いに離間された配線パターンを有し、前記配線パターン間の間隙を封止樹脂を注入するランナー部とする基板を当接し、前記ランナー部を封止樹脂の通路として前記キャビティ部に封止樹脂を注入することを特徴とする発光装置の製造方法。
- 前記キャビティ部は複数のキャビティが一方向に配列されかつ前記ランナー部によって連通していることを特徴とする請求項4に記載の発光装置の製造方法。
- 少なくとも封止樹脂注入中は前記ランナー部が傾斜するように前記金型を回転させ、前記ランナー部の下部から上部に向かって封止樹脂を注入することを特徴とする請求項4または5に記載の発光装置の製造方法。
- 封止樹脂注入後は前記ランナー部が水平となるように前記金型が回転されることを特徴とする請求項6に記載の発光装置の製造方法。
- 前記複数のキャビティに封止樹脂を注入後キャビティ毎にダイシングして個別発光装置とすることを特徴とする請求項5に記載の発光装置の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006111292A JP4954591B2 (ja) | 2006-04-13 | 2006-04-13 | 発光装置およびその製造方法 |
CNB2007100917839A CN100568564C (zh) | 2006-04-13 | 2007-04-11 | 发光装置及其制造方法 |
US11/783,709 US20070241346A1 (en) | 2006-04-13 | 2007-04-11 | Light emitting device and method for producing light emitting device |
DE102007017045A DE102007017045A1 (de) | 2006-04-13 | 2007-04-11 | Licht emittierendes Bauteil sowie Verfahren und Substrat zu dessen Herstellung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006111292A JP4954591B2 (ja) | 2006-04-13 | 2006-04-13 | 発光装置およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007287805A JP2007287805A (ja) | 2007-11-01 |
JP4954591B2 true JP4954591B2 (ja) | 2012-06-20 |
Family
ID=38514875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006111292A Expired - Fee Related JP4954591B2 (ja) | 2006-04-13 | 2006-04-13 | 発光装置およびその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20070241346A1 (ja) |
JP (1) | JP4954591B2 (ja) |
CN (1) | CN100568564C (ja) |
DE (1) | DE102007017045A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY152737A (en) * | 2010-08-24 | 2014-11-28 | Silq Malaysia Sdn Bhd | Methodology of forming optical lens for semiconductor light emitting device |
DE102010049333B4 (de) * | 2010-10-22 | 2012-07-05 | Jürgen Hackert | Verfahren und Vorrichtung zur Herstellung einer bandförmigen Struktur zur Aufnahme von elektronischen Bauteilen |
DE102011078906A1 (de) * | 2011-07-11 | 2013-01-17 | Osram Opto Semiconductors Gmbh | Verfahren zum herstellen eines optoelektronischen halbleiterbauteils mittels spritzpressens |
JP2013025540A (ja) | 2011-07-20 | 2013-02-04 | Toshiba Corp | 半導体記憶装置 |
CN103531669B (zh) * | 2012-07-05 | 2016-09-07 | 北京时代浩鼎科技股份有限公司 | 发光二极管封装结构的制造方法 |
CN106945211B (zh) * | 2017-03-06 | 2019-05-24 | 航天材料及工艺研究所 | 一种热固性酚醛树脂拉伸试样浇铸体 |
CN110459481A (zh) * | 2018-05-07 | 2019-11-15 | 昱鑫制造股份有限公司 | 半导体元件的封装方法及其对位模具 |
CN114627773B (zh) * | 2022-03-11 | 2024-02-20 | 武汉华星光电半导体显示技术有限公司 | 拼接显示面板 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2994219B2 (ja) * | 1994-05-24 | 1999-12-27 | シャープ株式会社 | 半導体デバイスの製造方法 |
JPH10150227A (ja) * | 1996-11-15 | 1998-06-02 | Rohm Co Ltd | チップ型発光素子 |
US5869883A (en) * | 1997-09-26 | 1999-02-09 | Stanley Wang, President Pantronix Corp. | Packaging of semiconductor circuit in pre-molded plastic package |
JP2001135860A (ja) * | 1999-11-05 | 2001-05-18 | Matsushita Electronics Industry Corp | 半導体発光装置およびその製造方法 |
JP3956335B2 (ja) * | 2000-03-06 | 2007-08-08 | シャープ株式会社 | 樹脂注型用金型を用いた半導体装置の製造方法 |
JP3614776B2 (ja) * | 2000-12-19 | 2005-01-26 | シャープ株式会社 | チップ部品型ledとその製造方法 |
JP4211359B2 (ja) * | 2002-03-06 | 2009-01-21 | 日亜化学工業株式会社 | 半導体装置の製造方法 |
JP3910171B2 (ja) * | 2003-02-18 | 2007-04-25 | シャープ株式会社 | 半導体発光装置、その製造方法および電子撮像装置 |
CN100587560C (zh) * | 2003-04-01 | 2010-02-03 | 夏普株式会社 | 发光装置用组件、发光装置、背侧光照射装置、显示装置 |
JP4504662B2 (ja) * | 2003-04-09 | 2010-07-14 | シチズン電子株式会社 | Ledランプ |
JP4243177B2 (ja) * | 2003-12-22 | 2009-03-25 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
-
2006
- 2006-04-13 JP JP2006111292A patent/JP4954591B2/ja not_active Expired - Fee Related
-
2007
- 2007-04-11 US US11/783,709 patent/US20070241346A1/en not_active Abandoned
- 2007-04-11 DE DE102007017045A patent/DE102007017045A1/de not_active Ceased
- 2007-04-11 CN CNB2007100917839A patent/CN100568564C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101055912A (zh) | 2007-10-17 |
CN100568564C (zh) | 2009-12-09 |
US20070241346A1 (en) | 2007-10-18 |
DE102007017045A1 (de) | 2007-10-18 |
JP2007287805A (ja) | 2007-11-01 |
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