JP4950719B2 - プローブの針先位置の検出方法、アライメント方法、針先位置検出装置及びプローブ装置 - Google Patents

プローブの針先位置の検出方法、アライメント方法、針先位置検出装置及びプローブ装置 Download PDF

Info

Publication number
JP4950719B2
JP4950719B2 JP2007077923A JP2007077923A JP4950719B2 JP 4950719 B2 JP4950719 B2 JP 4950719B2 JP 2007077923 A JP2007077923 A JP 2007077923A JP 2007077923 A JP2007077923 A JP 2007077923A JP 4950719 B2 JP4950719 B2 JP 4950719B2
Authority
JP
Japan
Prior art keywords
probes
contact body
contact
needle
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007077923A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008243860A5 (enExample
JP2008243860A (ja
Inventor
浩史 山田
勝 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2007077923A priority Critical patent/JP4950719B2/ja
Priority to CN2008100039701A priority patent/CN101285865B/zh
Priority to US12/046,879 priority patent/US7839156B2/en
Priority to KR1020080022752A priority patent/KR100945328B1/ko
Priority to TW097110056A priority patent/TWI431705B/zh
Publication of JP2008243860A publication Critical patent/JP2008243860A/ja
Publication of JP2008243860A5 publication Critical patent/JP2008243860A5/ja
Application granted granted Critical
Publication of JP4950719B2 publication Critical patent/JP4950719B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2007077923A 2007-03-23 2007-03-23 プローブの針先位置の検出方法、アライメント方法、針先位置検出装置及びプローブ装置 Active JP4950719B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007077923A JP4950719B2 (ja) 2007-03-23 2007-03-23 プローブの針先位置の検出方法、アライメント方法、針先位置検出装置及びプローブ装置
CN2008100039701A CN101285865B (zh) 2007-03-23 2008-01-23 探针针尖位置检测方法及装置、对准方法以及探针装置
US12/046,879 US7839156B2 (en) 2007-03-23 2008-03-12 Method for detecting tip position of probe, alignment method, apparatus for detecting tip position of probe and probe apparatus
KR1020080022752A KR100945328B1 (ko) 2007-03-23 2008-03-12 프로브의 침끝위치의 검출 방법, 얼라이먼트 방법,침끝위치 검출 장치 및 프로브 장치
TW097110056A TWI431705B (zh) 2007-03-23 2008-03-21 Method for detecting the position of the needle end of the probe, the alignment method, the needle end position detecting device, and the probe device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007077923A JP4950719B2 (ja) 2007-03-23 2007-03-23 プローブの針先位置の検出方法、アライメント方法、針先位置検出装置及びプローブ装置

Publications (3)

Publication Number Publication Date
JP2008243860A JP2008243860A (ja) 2008-10-09
JP2008243860A5 JP2008243860A5 (enExample) 2010-03-04
JP4950719B2 true JP4950719B2 (ja) 2012-06-13

Family

ID=39774048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007077923A Active JP4950719B2 (ja) 2007-03-23 2007-03-23 プローブの針先位置の検出方法、アライメント方法、針先位置検出装置及びプローブ装置

Country Status (5)

Country Link
US (1) US7839156B2 (enExample)
JP (1) JP4950719B2 (enExample)
KR (1) KR100945328B1 (enExample)
CN (1) CN101285865B (enExample)
TW (1) TWI431705B (enExample)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5295588B2 (ja) * 2008-02-28 2013-09-18 東京エレクトロン株式会社 プローブカードの傾き調整方法、プローブカードの傾き検出方法及びプローブカードの傾き検出方法を記録したプログラム記録媒体
JP5260119B2 (ja) * 2008-04-02 2013-08-14 東京エレクトロン株式会社 アライメント方法
DE202008013982U1 (de) * 2008-10-20 2009-01-08 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Messsystem zum Bestimmen von Streuparametern
KR101090333B1 (ko) * 2009-06-03 2011-12-07 주식회사 쎄믹스 척의 능동적 기울기 제어가 가능한 웨이퍼 프로브 스테이션 및 그 제어방법
ITVI20110343A1 (it) * 2011-12-30 2013-07-01 St Microelectronics Srl Sistema e adattatore per testare chips con circuiti integrati in un package
JP5993649B2 (ja) * 2012-07-31 2016-09-14 東京エレクトロン株式会社 プローブカードへの基板当接装置、基板当接装置を備えた基板検査装置、及びプローブカードへの基板当接方法
JP5918682B2 (ja) * 2012-10-09 2016-05-18 東京エレクトロン株式会社 プローブカード取り付け方法
CN103091521B (zh) * 2013-01-08 2015-07-15 上海交通大学 一种探针和引脚自动对准的方法及其探针台测试系统
US9335345B1 (en) * 2013-03-18 2016-05-10 Christos Tsironis Method for planarity alignment of waveguide wafer probes
US9322843B1 (en) * 2013-03-19 2016-04-26 Christos Tsironis Method for planarity alignment of wafer probes
JP5819880B2 (ja) * 2013-05-08 2015-11-24 本田技研工業株式会社 平行度調整装置および平行度調整方法
US9347979B2 (en) * 2013-10-01 2016-05-24 Infineon Technologies Ag Touchdown monitoring for individual dies of a semiconductor wafer
TWI498565B (zh) * 2013-12-11 2015-09-01 Mpi Corp 探針點測系統、探針高度調整方法與探針位置監測方法
KR101934880B1 (ko) * 2014-05-15 2019-01-03 삼성전자주식회사 탐침 장치 및 그 운용 방법
TWI528041B (zh) * 2015-04-30 2016-04-01 The method of adjusting the displacement distance of the probe according to the horizontal position of the plurality of points to be measured
TWI560795B (en) * 2015-06-01 2016-12-01 Mpi Corp Wafer probing device
CN105097598B (zh) * 2015-08-14 2018-06-26 武汉新芯集成电路制造有限公司 一种晶圆探针卡自动检测装置
JP6406221B2 (ja) * 2015-11-17 2018-10-17 三菱電機株式会社 半導体装置の評価装置及び評価方法
EP3430349B1 (en) * 2016-03-16 2023-08-09 Hexagon Metrology, Inc Optical probe with crash protection and probe clips
JP6501726B2 (ja) 2016-04-19 2019-04-17 三菱電機株式会社 プローブ位置検査装置および半導体評価装置ならびにプローブ位置検査方法
US11262384B2 (en) 2016-12-23 2022-03-01 Intel Corporation Fine pitch probe card methods and systems
KR102799834B1 (ko) * 2017-01-11 2025-04-28 (주)테크윙 테스트핸들러용 가압장치
KR102755729B1 (ko) * 2017-01-26 2025-01-17 주식회사 탑 엔지니어링 프로브 장치
JP6869123B2 (ja) 2017-06-23 2021-05-12 東京エレクトロン株式会社 プローブ装置及び針跡転写方法
US11268983B2 (en) 2017-06-30 2022-03-08 Intel Corporation Chevron interconnect for very fine pitch probing
US10775414B2 (en) 2017-09-29 2020-09-15 Intel Corporation Low-profile gimbal platform for high-resolution in situ co-planarity adjustment
US11061068B2 (en) 2017-12-05 2021-07-13 Intel Corporation Multi-member test probe structure
US11204555B2 (en) 2017-12-28 2021-12-21 Intel Corporation Method and apparatus to develop lithographically defined high aspect ratio interconnects
US11073538B2 (en) 2018-01-03 2021-07-27 Intel Corporation Electrical testing apparatus with lateral movement of a probe support substrate
US10488438B2 (en) 2018-01-05 2019-11-26 Intel Corporation High density and fine pitch interconnect structures in an electric test apparatus
JP2019160937A (ja) * 2018-03-09 2019-09-19 東京エレクトロン株式会社 位置補正方法、検査装置及びプローブカード
CN108828425B (zh) * 2018-07-16 2024-08-27 苏州肯美特设备集成股份有限公司 一种半导体测试装置
US11543454B2 (en) 2018-09-25 2023-01-03 Intel Corporation Double-beam test probe
US10935573B2 (en) 2018-09-28 2021-03-02 Intel Corporation Slip-plane MEMS probe for high-density and fine pitch interconnects
JP7474678B2 (ja) * 2020-10-28 2024-04-25 東京エレクトロン株式会社 載置台、検査装置及び検査方法
CN114639520B (zh) * 2020-12-15 2025-07-15 泰科电子(上海)有限公司 检测机构、导线定位装置及导线加工设备

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3208734B2 (ja) * 1990-08-20 2001-09-17 東京エレクトロン株式会社 プローブ装置
US5644245A (en) * 1993-11-24 1997-07-01 Tokyo Electron Limited Probe apparatus for inspecting electrical characteristics of a microelectronic element
JPH07169801A (ja) * 1993-12-14 1995-07-04 Nec Yamaguchi Ltd プローバ
US5773987A (en) * 1996-02-26 1998-06-30 Motorola, Inc. Method for probing a semiconductor wafer using a motor controlled scrub process
JP2000260852A (ja) * 1999-03-11 2000-09-22 Tokyo Electron Ltd 検査ステージ及び検査装置
US7009415B2 (en) * 1999-10-06 2006-03-07 Tokyo Electron Limited Probing method and probing apparatus
JP2001356134A (ja) * 2000-04-13 2001-12-26 Innotech Corp プローブカード装置およびそれに用いられるプローブ
JP4339631B2 (ja) * 2003-06-20 2009-10-07 東京エレクトロン株式会社 検査方法及び検査装置
JP2005079253A (ja) * 2003-08-29 2005-03-24 Tokyo Electron Ltd 検査方法及び検査装置
JP2006339196A (ja) * 2005-05-31 2006-12-14 Tokyo Seimitsu Co Ltd プローバの移動量演算校正方法、移動量演算校正処理プログラム及びプローバ
US8311758B2 (en) * 2006-01-18 2012-11-13 Formfactor, Inc. Methods and apparatuses for dynamic probe adjustment
JP5034614B2 (ja) * 2007-03-30 2012-09-26 東京エレクトロン株式会社 プロービング方法、プローブ装置及び記憶媒体

Also Published As

Publication number Publication date
TW200845261A (en) 2008-11-16
KR100945328B1 (ko) 2010-03-08
TWI431705B (zh) 2014-03-21
JP2008243860A (ja) 2008-10-09
US7839156B2 (en) 2010-11-23
KR20080086816A (ko) 2008-09-26
CN101285865B (zh) 2011-07-20
CN101285865A (zh) 2008-10-15
US20080231300A1 (en) 2008-09-25

Similar Documents

Publication Publication Date Title
JP4950719B2 (ja) プローブの針先位置の検出方法、アライメント方法、針先位置検出装置及びプローブ装置
JP5260119B2 (ja) アライメント方法
JP5250279B2 (ja) プローブ装置
JP5295588B2 (ja) プローブカードの傾き調整方法、プローブカードの傾き検出方法及びプローブカードの傾き検出方法を記録したプログラム記録媒体
JP4451416B2 (ja) プローブ先端の検出方法、アライメント方法及びこれらの方法を記録した記憶媒体、並びにプローブ装置
JP4996119B2 (ja) プローブの先端位置の検出方法、この方法を記録した記憶媒体、及びプローブ装置
JP5571224B2 (ja) 針先位置検出装置及びプローブ装置
JP2005072143A (ja) プローブ装置
JP2005079253A (ja) 検査方法及び検査装置
JP2008028103A (ja) ウエハプローバ
JP2005123293A (ja) プローブ検査方法
KR100982343B1 (ko) 웨이퍼 프로버의 스테이지 오차 측정 및 보정 장치
JP2006023229A (ja) プローブカードの品質評価方法及びその装置、プローブ検査方法
JP2008108930A (ja) 半導体装置の検査方法およびプローブカード

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091230

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20091230

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111222

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120110

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120207

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120306

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120309

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150316

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4950719

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250