JP4940066B2 - 洗浄装置、洗浄方法、およびコンピュータ読取可能な記憶媒体 - Google Patents

洗浄装置、洗浄方法、およびコンピュータ読取可能な記憶媒体 Download PDF

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Publication number
JP4940066B2
JP4940066B2 JP2007224237A JP2007224237A JP4940066B2 JP 4940066 B2 JP4940066 B2 JP 4940066B2 JP 2007224237 A JP2007224237 A JP 2007224237A JP 2007224237 A JP2007224237 A JP 2007224237A JP 4940066 B2 JP4940066 B2 JP 4940066B2
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Japan
Prior art keywords
liquid
substrate
back surface
cleaning
rinsing
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JP2007224237A
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English (en)
Japanese (ja)
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JP2008135703A (ja
Inventor
宏光 難波
規宏 伊藤
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Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2007224237A priority Critical patent/JP4940066B2/ja
Priority to TW096139510A priority patent/TW200836251A/zh
Priority to US11/976,188 priority patent/US8043440B2/en
Priority to DE102007050594A priority patent/DE102007050594A1/de
Priority to KR1020070106922A priority patent/KR101238123B1/ko
Publication of JP2008135703A publication Critical patent/JP2008135703A/ja
Application granted granted Critical
Publication of JP4940066B2 publication Critical patent/JP4940066B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2007224237A 2006-10-23 2007-08-30 洗浄装置、洗浄方法、およびコンピュータ読取可能な記憶媒体 Active JP4940066B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007224237A JP4940066B2 (ja) 2006-10-23 2007-08-30 洗浄装置、洗浄方法、およびコンピュータ読取可能な記憶媒体
TW096139510A TW200836251A (en) 2006-10-23 2007-10-22 Cleaning apparatus, cleaning method and computer readable medium
US11/976,188 US8043440B2 (en) 2006-10-23 2007-10-22 Cleaning apparatus and method and computer readable medium
DE102007050594A DE102007050594A1 (de) 2006-10-23 2007-10-23 Reinigungseinrichtung und Verfahren sowie computerlesbares Medium
KR1020070106922A KR101238123B1 (ko) 2006-10-23 2007-10-23 세정 장치, 세정 방법, 및 컴퓨터 판독 가능한 매체

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006287758 2006-10-23
JP2006287758 2006-10-23
JP2007224237A JP4940066B2 (ja) 2006-10-23 2007-08-30 洗浄装置、洗浄方法、およびコンピュータ読取可能な記憶媒体

Publications (2)

Publication Number Publication Date
JP2008135703A JP2008135703A (ja) 2008-06-12
JP4940066B2 true JP4940066B2 (ja) 2012-05-30

Family

ID=39244595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007224237A Active JP4940066B2 (ja) 2006-10-23 2007-08-30 洗浄装置、洗浄方法、およびコンピュータ読取可能な記憶媒体

Country Status (5)

Country Link
US (1) US8043440B2 (enExample)
JP (1) JP4940066B2 (enExample)
KR (1) KR101238123B1 (enExample)
DE (1) DE102007050594A1 (enExample)
TW (1) TW200836251A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230152086A (ko) 2021-03-26 2023-11-02 가부시키가이샤 토쿄 세이미쯔 웨이퍼 이면 세정 장치

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005050724A1 (ja) * 2003-11-18 2005-06-02 Tokyo Electron Limited 基板洗浄方法、基板洗浄装置およびコンピュータ読み取り可能な記録媒体
KR100979979B1 (ko) * 2006-07-26 2010-09-03 도쿄엘렉트론가부시키가이샤 액처리 장치 및 액처리 방법
JP2012064800A (ja) * 2010-09-16 2012-03-29 Sumco Corp ウェーハ洗浄装置
JP5788349B2 (ja) * 2012-03-19 2015-09-30 東京エレクトロン株式会社 めっき処理装置、めっき処理方法および記憶媒体
KR102043811B1 (ko) * 2013-05-09 2019-11-12 에이씨엠 리서치 (상하이) 인코포레이티드 웨이퍼의 도금 및/또는 연마 장치 및 방법
JP6134673B2 (ja) 2014-03-13 2017-05-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6258132B2 (ja) * 2014-06-06 2018-01-10 東京エレクトロン株式会社 基板液処理装置
JP6392035B2 (ja) * 2014-09-02 2018-09-19 東京エレクトロン株式会社 基板液処理装置
JP6320945B2 (ja) * 2015-01-30 2018-05-09 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP6391524B2 (ja) * 2015-03-31 2018-09-19 株式会社Ｓｃｒｅｅｎホールディングス 脱酸素装置および基板処理装置
JP6618032B2 (ja) * 2015-08-27 2019-12-11 Toto株式会社 トイレ装置
JP6903441B2 (ja) * 2016-03-31 2021-07-14 芝浦メカトロニクス株式会社 基板処理装置
JP6431128B2 (ja) * 2017-05-15 2018-11-28 エーシーエム リサーチ （シャンハイ） インコーポレーテッド ウェハのメッキおよび／または研磨のための装置および方法
JP6887912B2 (ja) * 2017-08-07 2021-06-16 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP7292107B2 (ja) * 2019-05-27 2023-06-16 東京エレクトロン株式会社 基板処理方法および基板処理装置
JP7287271B2 (ja) * 2019-12-26 2023-06-06 株式会社Sumco ワークの洗浄装置および洗浄方法
TW202214358A (zh) * 2020-04-10 2022-04-16 日商東京威力科創股份有限公司 基板處理方法及基板處理裝置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3249765B2 (ja) * 1997-05-07 2002-01-21 東京エレクトロン株式会社 基板処理装置
JPH09298181A (ja) 1996-05-07 1997-11-18 Tokyo Ohka Kogyo Co Ltd 基板の裏面洗浄装置
JP3779483B2 (ja) 1998-03-23 2006-05-31 東京エレクトロン株式会社 基板の洗浄装置及び洗浄方法
JP2000138163A (ja) * 1998-10-30 2000-05-16 Tokyo Electron Ltd 液処理装置
JP3739220B2 (ja) * 1998-11-19 2006-01-25 大日本スクリーン製造株式会社 基板処理方法及びその装置
KR100887360B1 (ko) * 2001-01-23 2009-03-06 도쿄엘렉트론가부시키가이샤 기판처리장치 및 기판처리방법
JP4342324B2 (ja) * 2004-01-16 2009-10-14 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
JP4425913B2 (ja) * 2004-06-04 2010-03-03 東京エレクトロン株式会社 基板洗浄方法およびコンピュータ読取可能な記憶媒体
US7767026B2 (en) * 2005-03-29 2010-08-03 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and substrate processing method
JP4446917B2 (ja) * 2005-03-29 2010-04-07 大日本スクリーン製造株式会社 基板処理方法および基板処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230152086A (ko) 2021-03-26 2023-11-02 가부시키가이샤 토쿄 세이미쯔 웨이퍼 이면 세정 장치

Also Published As

Publication number Publication date
JP2008135703A (ja) 2008-06-12
US20080173333A1 (en) 2008-07-24
KR101238123B1 (ko) 2013-02-27
US8043440B2 (en) 2011-10-25
DE102007050594A1 (de) 2008-04-30
KR20080036542A (ko) 2008-04-28
TW200836251A (en) 2008-09-01
TWI355022B (enExample) 2011-12-21

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