JP4938272B2 - n型炭素ナノチューブ電界効果トランジスタ及びその製造方法 - Google Patents
n型炭素ナノチューブ電界効果トランジスタ及びその製造方法 Download PDFInfo
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- JP4938272B2 JP4938272B2 JP2005258904A JP2005258904A JP4938272B2 JP 4938272 B2 JP4938272 B2 JP 4938272B2 JP 2005258904 A JP2005258904 A JP 2005258904A JP 2005258904 A JP2005258904 A JP 2005258904A JP 4938272 B2 JP4938272 B2 JP 4938272B2
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims description 82
- 239000002041 carbon nanotube Substances 0.000 title claims description 82
- 229910021393 carbon nanotube Inorganic materials 0.000 title claims description 82
- 238000004519 manufacturing process Methods 0.000 title claims description 31
- 238000002353 field-effect transistor method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 claims description 25
- 230000005669 field effect Effects 0.000 claims description 17
- 229910021478 group 5 element Inorganic materials 0.000 claims description 14
- 229910052797 bismuth Inorganic materials 0.000 claims description 12
- 238000000151 deposition Methods 0.000 claims description 11
- 150000004767 nitrides Chemical class 0.000 claims description 11
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical group [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 10
- 230000008021 deposition Effects 0.000 claims description 7
- 238000007740 vapor deposition Methods 0.000 claims description 4
- BQXJLKVZTDDERJ-UHFFFAOYSA-N (Z)-butanethial oxide Chemical group CCCC=S=O BQXJLKVZTDDERJ-UHFFFAOYSA-N 0.000 claims 4
- 238000000034 method Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 7
- 238000000231 atomic layer deposition Methods 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052787 antimony Inorganic materials 0.000 description 4
- 229910052785 arsenic Inorganic materials 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 229910001414 potassium ion Inorganic materials 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000002071 nanotube Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- NPYPAHLBTDXSSS-UHFFFAOYSA-N Potassium ion Chemical compound [K+] NPYPAHLBTDXSSS-UHFFFAOYSA-N 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- HIOAKZIMACQAFD-UHFFFAOYSA-N [Si]=O.[Ti].[Bi] Chemical compound [Si]=O.[Ti].[Bi] HIOAKZIMACQAFD-UHFFFAOYSA-N 0.000 description 1
- 238000001241 arc-discharge method Methods 0.000 description 1
- 229910052454 barium strontium titanate Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/468—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
- H10K10/472—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics the gate dielectric comprising only inorganic materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/30—Doping active layers, e.g. electron transporting layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/464—Lateral top-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
- H10K85/221—Carbon nanotubes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/902—Specified use of nanostructure
- Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
- Y10S977/936—Specified use of nanostructure for electronic or optoelectronic application in a transistor or 3-terminal device
- Y10S977/938—Field effect transistors, FETS, with nanowire- or nanotube-channel region
Description
11、31 絶縁層
12、22、32、42 炭素ナノチューブ
13、23、33、43 ドレイン電極
14、24、34、44 ソース電極
15、21、35、41 ゲート酸化層
16、36 ゲート電極
20、40 導電性基板
Claims (16)
- 基板と、
前記基板上に相互離隔して形成された電極と、
前記基板上で前記電極に電気的に連結されるように形成された炭素ナノチューブと、
前記炭素ナノチューブ上に形成されたゲート酸化層と、
前記ゲート酸化層上に形成されたゲート電極と、
を備え、
前記ゲート酸化層は、前記炭素ナノチューブに電子を提供する電子ドナー原子を含み、
前記炭素ナノチューブは、前記電子ドナー原子によってn型ドーピングされたことを特徴とするn型炭素ナノチューブ電界効果トランジスタ。 - 前記ゲート酸化層は、V族元素を含む酸化物または窒化物をALD蒸着したことを特徴とする請求項1に記載のn型炭素ナノチューブ電界効果トランジスタ。
- 前記V族元素は、ビスマス元素であることを特徴とする請求項2に記載のn型炭素ナノチューブ電界効果トランジスタ。
- 前記酸化物は、BTSOであることを特徴とする請求項2に記載のn型炭素ナノチューブ電界効果トランジスタ。
- 導電性基板と、
前記導電性基板上に形成されたゲート酸化層と、
前記ゲート酸化層上に相互離隔して形成された電極と、
前記ゲート酸化層上で前記電極に電気的に連結されるように形成された炭素ナノチューブと、
を備え、
前記ゲート酸化層は、前記炭素ナノチューブに電子を提供する電子ドナー原子を含み、
前記炭素ナノチューブは、前記電子ドナー原子によってn型ドーピングされたことを特徴とするn型炭素ナノチューブ電界効果トランジスタ。 - 前記ゲート酸化層は、V族元素を含む酸化物または窒化物をALD蒸着したことを特徴とする請求項5に記載のn型炭素ナノチューブ電界効果トランジスタ。
- 前記V族元素は、ビスマス元素であることを特徴とする請求項6に記載のn型炭素ナノチューブ電界効果トランジスタ。
- 前記酸化物は、BTSOであることを特徴とする請求項6または請求項7に記載のn型炭素ナノチューブ電界効果トランジスタ。
- 基板上に各々離隔された電極を形成する段階と、
前記基板上で前記電極と電気的に連結されるように炭素ナノチューブを形成する段階と、
前記炭素ナノチューブ上に電子ドナー原子が含まれた酸化物または窒化物を蒸着してゲート酸化層を形成する段階と、
前記ゲート酸化層上にゲート電極を形成する段階と、
を含み、
前記電子ドナー原子は、前記炭素ナノチューブをn型ドーピングすることを特徴とするn型炭素ナノチューブ電界効果トランジスタの製造方法。 - 前記ゲート酸化層は、V族元素を含む酸化物または窒化物をALD蒸着することを特徴とする請求項9に記載のn型炭素ナノチューブ電界効果トランジスタの製造方法。
- 前記V族元素は、ビスマス元素であることを特徴とする請求項10に記載のn型炭素ナノチューブ電界効果トランジスタの製造方法。
- 前記酸化物は、BTSOであることを特徴とする請求項10に記載のn型炭素ナノチューブ電界効果トランジスタの製造方法。
- 導電性基板上に電子ドナー原子が含まれた酸化物または窒化物を蒸着してゲート酸化層を形成する段階と、
前記ゲート酸化層上に各々離隔された電極を形成する段階と、
前記ゲート酸化層上に前記電極と電気的に連結されるように炭素ナノチューブを形成する段階と、
を含み、
前記電子ドナー原子は、前記炭素ナノチューブをn型ドーピングすることを特徴とするn型炭素ナノチューブ電界効果トランジスタの製造方法。 - 前記ゲート酸化層は、V族元素を含む酸化物または窒化物をALD蒸着することを特徴とする請求項13に記載のn型炭素ナノチューブ電界効果トランジスタの製造方法。
- 前記V族元素は、ビスマス元素であることを特徴とする請求項14に記載のn型炭素ナノチューブ電界効果トランジスタの製造方法。
- 前記酸化物は、BTSOであることを特徴とする請求項14または請求項15に記載のn型炭素ナノチューブ電界効果トランジスタの製造方法。
Applications Claiming Priority (2)
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KR1020040078544A KR100601965B1 (ko) | 2004-10-02 | 2004-10-02 | n형 탄소 나노튜브를 구비한 n형 탄소나노튜브 전계효과트랜지스터 및 그 제조방법 |
KR10-2004-0078544 | 2004-10-02 |
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JP4938272B2 true JP4938272B2 (ja) | 2012-05-23 |
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US (2) | US7381983B2 (ja) |
JP (1) | JP4938272B2 (ja) |
KR (1) | KR100601965B1 (ja) |
CN (1) | CN100474623C (ja) |
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EP1999067B1 (en) * | 2006-02-07 | 2014-04-09 | President and Fellows of Harvard College | Gas-phase functionalization of carbon nanotubes |
US8119032B2 (en) | 2006-02-07 | 2012-02-21 | President And Fellows Of Harvard College | Gas-phase functionalization of surfaces including carbon-based surfaces |
KR100822992B1 (ko) * | 2007-03-19 | 2008-04-16 | 광주과학기술원 | 나노선 전계효과 트랜지스터 및 그 제조 방법 |
US7871851B2 (en) | 2007-05-25 | 2011-01-18 | RF Nano | Method for integrating nanotube devices with CMOS for RF/analog SoC applications |
KR100951730B1 (ko) * | 2007-05-30 | 2010-04-07 | 삼성전자주식회사 | 전도성이 개선된 카본나노튜브, 그의 제조방법 및 상기카본나노튜브를 함유하는 전극 |
JP2011522394A (ja) * | 2007-12-31 | 2011-07-28 | エータモタ・コーポレイション | 端部接触型縦型カーボンナノチューブトランジスタ |
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CN100474623C (zh) | 2009-04-01 |
JP2006108653A (ja) | 2006-04-20 |
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KR100601965B1 (ko) | 2006-07-18 |
US20070012961A1 (en) | 2007-01-18 |
CN1755942A (zh) | 2006-04-05 |
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