JP4931280B2 - シート状材料の試験方法および装置 - Google Patents

シート状材料の試験方法および装置 Download PDF

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Publication number
JP4931280B2
JP4931280B2 JP2000620661A JP2000620661A JP4931280B2 JP 4931280 B2 JP4931280 B2 JP 4931280B2 JP 2000620661 A JP2000620661 A JP 2000620661A JP 2000620661 A JP2000620661 A JP 2000620661A JP 4931280 B2 JP4931280 B2 JP 4931280B2
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JP
Japan
Prior art keywords
sheet
test
cassette
sensor
testing
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000620661A
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English (en)
Japanese (ja)
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JP2003500854A (ja
JP2003500854A5 (enExample
Inventor
アール ブルー オーステイン
アイデユコニス アリグザンダー
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Lehighton Electronics Inc
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Lehighton Electronics Inc
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Publication date
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Publication of JP2003500854A publication Critical patent/JP2003500854A/ja
Publication of JP2003500854A5 publication Critical patent/JP2003500854A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/86—Investigating moving sheets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/958—Inspecting transparent materials or objects, e.g. windscreens
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N35/00029—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor provided with flat sample substrates, e.g. slides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67363—Closed carriers specially adapted for containing substrates other than wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
JP2000620661A 1999-05-21 2000-05-19 シート状材料の試験方法および装置 Expired - Fee Related JP4931280B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/316,677 1999-05-21
US09/316,677 US6202482B1 (en) 1998-03-23 1999-05-21 Method and apparatus for testing of sheet material
PCT/US2000/013926 WO2000072361A2 (en) 1999-05-21 2000-05-19 Apparatus and method for testing of sheet material

Publications (3)

Publication Number Publication Date
JP2003500854A JP2003500854A (ja) 2003-01-07
JP2003500854A5 JP2003500854A5 (enExample) 2007-07-05
JP4931280B2 true JP4931280B2 (ja) 2012-05-16

Family

ID=23230155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000620661A Expired - Fee Related JP4931280B2 (ja) 1999-05-21 2000-05-19 シート状材料の試験方法および装置

Country Status (6)

Country Link
US (4) US6202482B1 (enExample)
EP (1) EP1194764A2 (enExample)
JP (1) JP4931280B2 (enExample)
KR (1) KR100718029B1 (enExample)
AU (1) AU5149700A (enExample)
WO (1) WO2000072361A2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6631935B1 (en) * 2000-08-04 2003-10-14 Tru-Si Technologies, Inc. Detection and handling of semiconductor wafer and wafer-like objects
US6638004B2 (en) 2001-07-13 2003-10-28 Tru-Si Technologies, Inc. Article holders and article positioning methods
US6935830B2 (en) * 2001-07-13 2005-08-30 Tru-Si Technologies, Inc. Alignment of semiconductor wafers and other articles
US6615113B2 (en) 2001-07-13 2003-09-02 Tru-Si Technologies, Inc. Articles holders with sensors detecting a type of article held by the holder
US8207748B2 (en) * 2004-08-11 2012-06-26 Lehighton Electronics, Inc. Device and handling system for measurement of mobility and sheet charge density
KR101319293B1 (ko) 2005-11-14 2013-10-29 리하이톤 일렉트로닉스, 인크. 시트 컨덕턴스 및 시트 저항 측정 시스템
MY161955A (en) * 2009-03-30 2017-05-15 Ats Automation Tooling Systems Inc Systems and methods for handling wafers
US20150316386A1 (en) 2014-04-30 2015-11-05 Toyota Motor Engineering & Manufacturing North America, Inc. Detailed map format for autonomous driving
US20150316387A1 (en) 2014-04-30 2015-11-05 Toyota Motor Engineering & Manufacturing North America, Inc. Detailed map format for autonomous driving
US10867824B2 (en) * 2018-05-29 2020-12-15 Taiwan Semiconductor Manufacturing Co., Ltd. Substrate detecting system in a substrate storage container

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250558A (ja) * 1995-03-10 1996-09-27 Tokyo Seimitsu Co Ltd ウェーハプローバ
JPH10261676A (ja) * 1997-03-17 1998-09-29 Sharp Corp 半導体のウエハテスト方法
JPH1138083A (ja) * 1997-07-14 1999-02-12 Advantest Corp Ｉｃテストハンドラ
JPH11121577A (ja) * 1997-10-08 1999-04-30 Mecs Corp 半導体ウェハの検査システム

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NL169693C (nl) 1974-10-09 1982-08-16 Nederlanden Staat Detectie-inrichting.
US4618938A (en) 1984-02-22 1986-10-21 Kla Instruments Corporation Method and apparatus for automatic wafer inspection
US4636634A (en) 1984-08-28 1987-01-13 Veeco Integrated Automation, Inc. Apparatus with intelligent bins indicating the presence and identity of stored coded articles
JPH0620922B2 (ja) * 1984-10-19 1994-03-23 株式会社東芝 被検物の搬送装置
US4856904A (en) 1985-01-21 1989-08-15 Nikon Corporation Wafer inspecting apparatus
US4818169A (en) 1985-05-17 1989-04-04 Schram Richard R Automated wafer inspection system
US4893322A (en) * 1985-11-15 1990-01-09 Medrad, Inc. Film changer
EP0256502A3 (en) * 1986-08-15 1989-09-27 Kabushiki Kaisha Toshiba Image forming apparatus with positioning-mark forming function
US4786042A (en) * 1987-04-01 1988-11-22 Xerox Corporation Adjustable size sensing sheet cassette
US4914452A (en) * 1987-05-08 1990-04-03 Ricoh Company, Ltd. Ink sheet/recording paper cassette
JPS6443458A (en) * 1987-08-11 1989-02-15 Nitto Denko Corp Stick cutter for tacky tape with respect to thin board
US5044752A (en) 1989-06-30 1991-09-03 General Signal Corporation Apparatus and process for positioning wafers in receiving devices
US5111963A (en) * 1991-05-24 1992-05-12 Frederick J. Stingel Container storage and dispensing apparatus
US5233195A (en) * 1992-02-25 1993-08-03 Abb Process Automation, Inc. Methods and apparatus for measuring characteristics of moving webs
KR940006241A (ko) 1992-06-05 1994-03-23 이노우에 아키라 기판이재장치 및 이재방법
JP3131750B2 (ja) 1992-10-20 2001-02-05 東京エレクトロン株式会社 被処理体検出装置及び方法
US5479108A (en) 1992-11-25 1995-12-26 David Cheng Method and apparatus for handling wafers
KR100291110B1 (ko) * 1993-06-19 2001-06-01 히가시 데쓰로 프로우브장치 및 그것을 사용한 피검사체의 검사방법
US5488292A (en) 1993-10-04 1996-01-30 Tokyo Seimitsu Co., Ltd. Wafer inspecting system
US5466945A (en) 1994-03-23 1995-11-14 Eaton Corporation Apparatus for detecting proper positioning of objects in a holder
US5609333A (en) 1995-10-05 1997-03-11 Xerox Corporation Sheet stack height control system
KR100193807B1 (ko) * 1995-10-20 1999-06-15 윤종용 용지감지에 따른 전사전압 자동변경장치 및 그 방법
JPH09306970A (ja) * 1996-05-10 1997-11-28 Komatsu Ltd ウエハカセット設置装置及びウエハ検査装置
US5738014A (en) * 1996-07-31 1998-04-14 Agfa Division, Bayer Corporation Method and apparatus for making lithographic printing plates in an automated computer to plate imaging system
US5961226A (en) * 1996-08-16 1999-10-05 Ricoh Company, Ltd. Printing apparatus
US5905302A (en) * 1996-11-18 1999-05-18 Applied Materials, Inc. Loadlock cassette with wafer support rails
US6421139B1 (en) * 1997-02-28 2002-07-16 Canon Kabushiki Kaisha Image forming apparatus for forming image on free-size sheet having arbitrary size
DE19728478C2 (de) * 1997-07-03 2003-08-21 Brooks Pri Automation Germany Verfahren zur optoelektronischen Erkennung von scheibenförmigen Objekten unter Nutzung derer Stirnseiten
DE19758396A1 (de) * 1997-12-23 1999-07-01 Arnold & Richter Kg Laufbildkamera-Kassetten-System
EP1066649A1 (en) * 1998-03-23 2001-01-10 Lehighton Electronics Inc. Method and apparatus for testing of sheet material
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US6280103B1 (en) * 1999-09-22 2001-08-28 Concord Camera Corp. APS camera for ensuring the cassett indicator is in the parked position

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250558A (ja) * 1995-03-10 1996-09-27 Tokyo Seimitsu Co Ltd ウェーハプローバ
JPH10261676A (ja) * 1997-03-17 1998-09-29 Sharp Corp 半導体のウエハテスト方法
JPH1138083A (ja) * 1997-07-14 1999-02-12 Advantest Corp Ｉｃテストハンドラ
JPH11121577A (ja) * 1997-10-08 1999-04-30 Mecs Corp 半導体ウェハの検査システム

Also Published As

Publication number Publication date
WO2000072361A3 (en) 2001-11-15
JP2003500854A (ja) 2003-01-07
US6443002B2 (en) 2002-09-03
US20030000302A1 (en) 2003-01-02
EP1194764A2 (en) 2002-04-10
KR20020039267A (ko) 2002-05-25
US20030000301A1 (en) 2003-01-02
WO2000072361A9 (en) 2002-08-29
US20010025528A1 (en) 2001-10-04
US6202482B1 (en) 2001-03-20
KR100718029B1 (ko) 2007-05-16
WO2000072361A2 (en) 2000-11-30
US6711948B2 (en) 2004-03-30
AU5149700A (en) 2000-12-12

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