JP4927172B2 - 確実なランドグリッドアレイソケット荷重装置 - Google Patents
確実なランドグリッドアレイソケット荷重装置 Download PDFInfo
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- JP4927172B2 JP4927172B2 JP2009529436A JP2009529436A JP4927172B2 JP 4927172 B2 JP4927172 B2 JP 4927172B2 JP 2009529436 A JP2009529436 A JP 2009529436A JP 2009529436 A JP2009529436 A JP 2009529436A JP 4927172 B2 JP4927172 B2 JP 4927172B2
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/82—Coupling devices connected with low or zero insertion force
- H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
- H01R12/88—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
- H01R33/7607—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket the parallel terminal pins having a circular disposition
- H01R33/7635—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket the parallel terminal pins having a circular disposition the terminals being collectively connected, e.g. to a PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
- H01R33/7685—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket having internal socket contact by abutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
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- Connecting Device With Holders (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
Claims (23)
- チップパッケージに荷重を加える荷重板と、
前記チップパッケージを受け入れるソケット本体と、
前記荷重板からの前記荷重に作用する作用フレームと、
前記ソケット本体及び前記作用フレームからの前記荷重を前記ソケット本体とプリント回路板との間の相互接続部に亘って均一に分配し、前記相互接続部内の引張荷重又は剪断荷重を減少するよう、前記ソケット本体をプリント回路板に結合し得る荷重分配機構とを含み、
前記荷重板は、少なくとも1つのヒンジを含み、前記荷重分配機構は、前記ソケット本体に取り付けられる、
装置。 - 前記荷重分配機構は、前記荷重を前記プリント回路板の背部表面に亘って更に分配する受板を含む、請求項1に記載の装置。
- 前記作用フレームに旋回可能に取り付けられ、前記荷重板に対して荷重を加え得る荷重レバーを更に含む、請求項1に記載の装置。
- 前記荷重分配機構は、前記プリント回路板を通じて前記ソケット本体に取り付けられる少なくとも1つの軸方向部材を含む、請求項1に記載の装置。
- 前記荷重分配機構は、前記チップパッケージの隅部に対する応力を減少するよう、前記ソケット本体の隅部に隣接して前記プリント回路板を通じて前記ソケット本体に結合される、少なくとも1つの軸方向部材を含む、請求項1に記載の装置。
- 前記ソケット本体は、900を越える接点を含む、請求項1に記載の装置。
- 前記ソケット本体は、ソルダボールグリッドアレイによって、前記プリント回路板に結合される、請求項1に記載の装置。
- 荷重を前記プリント回路板の背部表面に亘って更に分配するカム板を更に含む、請求項1に記載の装置。
- 前記荷重分配機構は、温度サイクルによって引き起こされる相互接続不良を減少する、請求項1に記載の装置。
- チップパッケージの固定における第一レベルの信頼性をもたらすために、前記チップパッケージを回路板に固定するランドグリッドアレイソケットを含み、
前記チップパッケージの固定における第二レベルの信頼性をもたらすために、前記ランドグリッドアレイソケットに取り付けられる第一の取り外し可能な素子を含み、
該第一の取り外し可能な素子は、前記チップパッケージを前記回路板に取り付けるよう前記回路板を通じて配置される軸方向部材を含み、前記第一の取り外し可能な素子は、前記ランドグリッドアレイソケットからの荷重を、前記ランドグリッドアレイソケットと前記回路板との間の相互接続部に亘って均一に分配し、前記相互接続部内の引張荷重又は剪断荷重を減少する、
装置。 - 前記チップパッケージの固定における第三レベルの信頼性をもたらすために、前記ランドグリッドアレイソケットと結合する第二の取り外し可能な素子を更に含み、該第二の取り外し可能な素子は、前記ランドグリッドアレイソケット又は前記第一の取り外し可能な素子に取り付けられるアドオン素子である、請求項10に記載の装置。
- 前記第一の取り外し可能な素子は、前記チップパッケージが前記ランドグリッドアレイソケットに固定された後、前記ランドグリッドアレイソケットと結合され得る、請求項10に記載の装置。
- 回路板と、
該回路板に結合されるグラフィックプロセッサと、
前記回路板に結合されるプロセッサ結合機構とを含み、
該プロセッサ結合機構は、
プロセッサに荷重を加える荷重板と、
前記プロセッサを受け入れるソケット本体と、
前記荷重板からの前記荷重に作用する作用フレームと、
前記ソケット本体及び前記作用フレームからの前記荷重を前記ソケット本体と前記回路板との間の相互接続部に亘って均一に分配し且つ前記プロセッサ上の前記相互接続部内の引張荷重又は剪断荷重を減少するよう、前記ソケット本体を前記回路板に結合する荷重分配機構とを含み、該荷重分配機構は、前記ソケット本体に取り付けられる、
システム。 - 前記回路板の表面に結合されるソルダボールグリッドアレイを更に含む、請求項13に記載のシステム。
- 前記ボールグリッドアレイは、少なくとも900のソルダボールを含む、請求項13に記載のシステム。
- 前記荷重分配機構は、前記荷重を前記回路板の背部表面に亘って更に分配する受板を更に含む、請求項13に記載のシステム。
- 前記プロセッサ結合機構は、前記プロセッサ結合機構を前記プリント回路板に固定し且つ追加的な荷重分配をもたらすために、前記ソケット本体又は前記作用フレームに取り付け得る取り外し可能な結合機構を更に含み、該取り外し可能な結合機構は、前記荷重分配機構によって前記回路板に結合される、請求項13に記載のシステム。
- 回路板の上にソケット本体を配置するステップと、
前記ソケット本体の上にソケット補強フレームを配置するステップと、
荷重板を前記ソケット補強フレームに取り付けるステップと、
荷重レバーを前記ソケット補強フレームに取り付けるステップと、
前記ソケット本体および前記ソケット補強フレームからの荷重を前記回路板と前記ソケット本体との間の相互接続部に亘って均一に分配し、前記相互接続部内の引張荷重又は剪断荷重を減少するよう、前記ソケット本体を前記プリント回路板に締結する荷重分配機構を取り付けるステップとを含み、
前記荷重板は、少なくとも1つのヒンジを含み、前記荷重分配機構は、前記ソケット本体に取り付けられる、
方法。 - 前記荷重分配機構に受板を取り付けるステップを更に含む、請求項18に記載の方法。
- チップパッケージを前記ソケット本体内に挿入するステップと、
荷重を前記荷重板に対して配置するために、力を前記荷重レバーに加えるステップとを更に含む、
請求項18に記載の方法。 - 前記相互接続部は、900よりも多くのソルダボールを含む、請求項21に記載の方法。
- 少なくとも1つのクリップを前記ソケット補強フレームに締結するステップを更に含む、請求項18に記載の方法。
- 前記相互接続部は、二重圧縮アレイ又はソルダグリッドアレイのいずれか1つを含む、請求項18に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/541,714 US20080081489A1 (en) | 2006-09-29 | 2006-09-29 | Reliable land grid array socket loading device |
US11/541,714 | 2006-09-29 | ||
PCT/US2007/080005 WO2008042815A1 (en) | 2006-09-29 | 2007-09-28 | Reliable land grid array socket loading device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010504620A JP2010504620A (ja) | 2010-02-12 |
JP4927172B2 true JP4927172B2 (ja) | 2012-05-09 |
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Application Number | Title | Priority Date | Filing Date |
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JP2009529436A Expired - Fee Related JP4927172B2 (ja) | 2006-09-29 | 2007-09-28 | 確実なランドグリッドアレイソケット荷重装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20080081489A1 (ja) |
JP (1) | JP4927172B2 (ja) |
CN (1) | CN101507061B (ja) |
DE (1) | DE112007001990T5 (ja) |
GB (1) | GB2454437B (ja) |
TW (1) | TWI357179B (ja) |
WO (1) | WO2008042815A1 (ja) |
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2006
- 2006-09-29 US US11/541,714 patent/US20080081489A1/en not_active Abandoned
-
2007
- 2007-09-28 WO PCT/US2007/080005 patent/WO2008042815A1/en active Application Filing
- 2007-09-28 CN CN200780031813.5A patent/CN101507061B/zh not_active Expired - Fee Related
- 2007-09-28 JP JP2009529436A patent/JP4927172B2/ja not_active Expired - Fee Related
- 2007-09-28 DE DE112007001990T patent/DE112007001990T5/de not_active Ceased
- 2007-09-28 GB GB0904295.3A patent/GB2454437B/en not_active Expired - Fee Related
- 2007-09-29 TW TW096136561A patent/TWI357179B/zh not_active IP Right Cessation
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WO2003058768A1 (en) * | 2001-12-28 | 2003-07-17 | Nhk Spring Co., Ltd. | Socket for inspection |
JP2004207184A (ja) * | 2002-10-31 | 2004-07-22 | Tyco Electronics Amp Kk | Lgaパッケージ用ソケット |
JP2004213980A (ja) * | 2002-12-27 | 2004-07-29 | Enplas Corp | 電気部品用ソケット |
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JP2006029943A (ja) * | 2004-07-15 | 2006-02-02 | Unitechno Inc | 押圧機構を備えた半導体検査用ソケット |
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Also Published As
Publication number | Publication date |
---|---|
DE112007001990T5 (de) | 2009-06-10 |
GB2454437A (en) | 2009-05-06 |
US20080081489A1 (en) | 2008-04-03 |
WO2008042815A1 (en) | 2008-04-10 |
CN101507061A (zh) | 2009-08-12 |
TWI357179B (en) | 2012-01-21 |
GB0904295D0 (en) | 2009-04-22 |
TW200832824A (en) | 2008-08-01 |
GB2454437B (en) | 2012-04-04 |
CN101507061B (zh) | 2012-09-05 |
JP2010504620A (ja) | 2010-02-12 |
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