JP4921673B2 - レーザー熱加工装置および方法 - Google Patents

レーザー熱加工装置および方法 Download PDF

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Publication number
JP4921673B2
JP4921673B2 JP2001560735A JP2001560735A JP4921673B2 JP 4921673 B2 JP4921673 B2 JP 4921673B2 JP 2001560735 A JP2001560735 A JP 2001560735A JP 2001560735 A JP2001560735 A JP 2001560735A JP 4921673 B2 JP4921673 B2 JP 4921673B2
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JP
Japan
Prior art keywords
workpiece
radiation
laser
radiation pulses
aperture stop
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2001560735A
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English (en)
Japanese (ja)
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JP2003524892A (ja
JP2003524892A5 (enExample
Inventor
アンドリュー エム． ハウリールク，
ウェイジアン ワン，
デイビッド ジー． スティテス，
ユ チュエ フォン，
Original Assignee
ウルトラテック，インコーポレイテッド
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Publication of JP2003524892A publication Critical patent/JP2003524892A/ja
Publication of JP2003524892A5 publication Critical patent/JP2003524892A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/06—Surface hardening
    • C21D1/09—Surface hardening by direct application of electrical or wave energy; by particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/34—Methods of heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2001560735A 2000-02-16 2000-12-28 レーザー熱加工装置および方法 Expired - Fee Related JP4921673B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/505,605 2000-02-16
US09/505,605 US6366308B1 (en) 2000-02-16 2000-02-16 Laser thermal processing apparatus and method
PCT/US2000/035613 WO2001061407A1 (en) 2000-02-16 2000-12-28 Laser thermal processing apparatus and method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011226032A Division JP2012023397A (ja) 2000-02-16 2011-10-13 レーザー熱加工装置および方法

Publications (3)

Publication Number Publication Date
JP2003524892A JP2003524892A (ja) 2003-08-19
JP2003524892A5 JP2003524892A5 (enExample) 2008-01-24
JP4921673B2 true JP4921673B2 (ja) 2012-04-25

Family

ID=24011035

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2001560735A Expired - Fee Related JP4921673B2 (ja) 2000-02-16 2000-12-28 レーザー熱加工装置および方法
JP2011226032A Withdrawn JP2012023397A (ja) 2000-02-16 2011-10-13 レーザー熱加工装置および方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2011226032A Withdrawn JP2012023397A (ja) 2000-02-16 2011-10-13 レーザー熱加工装置および方法

Country Status (6)

Country Link
US (1) US6366308B1 (enExample)
EP (1) EP1256030B1 (enExample)
JP (2) JP4921673B2 (enExample)
KR (1) KR100751741B1 (enExample)
DE (1) DE60041833D1 (enExample)
WO (1) WO2001061407A1 (enExample)

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Also Published As

Publication number Publication date
EP1256030A4 (en) 2007-08-01
JP2012023397A (ja) 2012-02-02
EP1256030A1 (en) 2002-11-13
US6366308B1 (en) 2002-04-02
DE60041833D1 (de) 2009-04-30
EP1256030B1 (en) 2009-03-18
KR100751741B1 (ko) 2007-08-27
KR20020093805A (ko) 2002-12-16
JP2003524892A (ja) 2003-08-19
WO2001061407A1 (en) 2001-08-23

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