JP4901154B2 - 半導体装置の検査方法および検査装置ならびに半導体装置の製造方法 - Google Patents
半導体装置の検査方法および検査装置ならびに半導体装置の製造方法 Download PDFInfo
- Publication number
- JP4901154B2 JP4901154B2 JP2005227878A JP2005227878A JP4901154B2 JP 4901154 B2 JP4901154 B2 JP 4901154B2 JP 2005227878 A JP2005227878 A JP 2005227878A JP 2005227878 A JP2005227878 A JP 2005227878A JP 4901154 B2 JP4901154 B2 JP 4901154B2
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- Prior art keywords
- probe
- electron beam
- wiring
- current
- scanning
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- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005227878A JP4901154B2 (ja) | 2005-08-05 | 2005-08-05 | 半導体装置の検査方法および検査装置ならびに半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005227878A JP4901154B2 (ja) | 2005-08-05 | 2005-08-05 | 半導体装置の検査方法および検査装置ならびに半導体装置の製造方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001174988A Division JP3955445B2 (ja) | 2001-06-11 | 2001-06-11 | 半導体装置の検査方法及び試料検査装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005347773A JP2005347773A (ja) | 2005-12-15 |
JP2005347773A5 JP2005347773A5 (fr) | 2008-07-24 |
JP4901154B2 true JP4901154B2 (ja) | 2012-03-21 |
Family
ID=35499799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2005227878A Expired - Fee Related JP4901154B2 (ja) | 2005-08-05 | 2005-08-05 | 半導体装置の検査方法および検査装置ならびに半導体装置の製造方法 |
Country Status (1)
Country | Link |
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JP (1) | JP4901154B2 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100741858B1 (ko) | 2006-05-18 | 2007-07-24 | 삼성전자주식회사 | 반도체 회로의 결함 검사용 모니터링 패턴 및 이를 이용한결함 검사 방법. |
JP5276921B2 (ja) * | 2008-08-08 | 2013-08-28 | 株式会社日立ハイテクノロジーズ | 検査装置 |
JP5908418B2 (ja) | 2013-01-31 | 2016-04-26 | 株式会社東芝 | 半導体装置の検査回路、検査方法及び検査装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01223709A (ja) * | 1988-03-02 | 1989-09-06 | Tdk Corp | コイル |
JPH02195271A (ja) * | 1989-01-25 | 1990-08-01 | Hitachi Ltd | 電圧波形計測システム |
JPH0567654A (ja) * | 1991-09-09 | 1993-03-19 | Fujitsu Ltd | 半導体試験装置及び半導体集積回路装置の試験方法 |
JPH0572234A (ja) * | 1991-09-12 | 1993-03-23 | Mitsubishi Electric Corp | 半導体装置の配線評価方法 |
US5404110A (en) * | 1993-03-25 | 1995-04-04 | International Business Machines Corporation | System using induced current for contactless testing of wiring networks |
JP2861849B2 (ja) * | 1994-08-31 | 1999-02-24 | 日本電気株式会社 | 半導体集積回路チップ上の配線試験方法及びその装置 |
JPH09223726A (ja) * | 1996-02-14 | 1997-08-26 | Hitachi Ltd | 荷電粒子ビームによる断面解析システムおよびその方法並びに荷電粒子ビーム処理装置 |
JP3577839B2 (ja) * | 1996-06-04 | 2004-10-20 | 株式会社日立製作所 | 不良検査方法および装置 |
JPH1187451A (ja) * | 1997-09-08 | 1999-03-30 | Mitsubishi Electric Corp | 半導体装置の検査方法および半導体装置検査器 |
JP3652144B2 (ja) * | 1998-11-17 | 2005-05-25 | 株式会社日立製作所 | プローブ装置 |
JP3708763B2 (ja) * | 1999-08-31 | 2005-10-19 | 株式会社東芝 | 欠陥検出方法 |
-
2005
- 2005-08-05 JP JP2005227878A patent/JP4901154B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2005347773A (ja) | 2005-12-15 |
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