JP4895936B2 - 導電性ボールの搭載方法 - Google Patents

導電性ボールの搭載方法 Download PDF

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Publication number
JP4895936B2
JP4895936B2 JP2007188630A JP2007188630A JP4895936B2 JP 4895936 B2 JP4895936 B2 JP 4895936B2 JP 2007188630 A JP2007188630 A JP 2007188630A JP 2007188630 A JP2007188630 A JP 2007188630A JP 4895936 B2 JP4895936 B2 JP 4895936B2
Authority
JP
Japan
Prior art keywords
conductive ball
flux
paste
receiving port
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007188630A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009026959A (ja
JP2009026959A5 (enExample
Inventor
秀明 坂口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2007188630A priority Critical patent/JP4895936B2/ja
Priority to US12/173,256 priority patent/US7820479B2/en
Publication of JP2009026959A publication Critical patent/JP2009026959A/ja
Publication of JP2009026959A5 publication Critical patent/JP2009026959A5/ja
Application granted granted Critical
Publication of JP4895936B2 publication Critical patent/JP4895936B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0485—Tacky flux, e.g. for adhering components during mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/074—Features related to the fluid pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2007188630A 2007-07-19 2007-07-19 導電性ボールの搭載方法 Expired - Fee Related JP4895936B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007188630A JP4895936B2 (ja) 2007-07-19 2007-07-19 導電性ボールの搭載方法
US12/173,256 US7820479B2 (en) 2007-07-19 2008-07-15 Conductive ball mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007188630A JP4895936B2 (ja) 2007-07-19 2007-07-19 導電性ボールの搭載方法

Publications (3)

Publication Number Publication Date
JP2009026959A JP2009026959A (ja) 2009-02-05
JP2009026959A5 JP2009026959A5 (enExample) 2010-06-17
JP4895936B2 true JP4895936B2 (ja) 2012-03-14

Family

ID=40264027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007188630A Expired - Fee Related JP4895936B2 (ja) 2007-07-19 2007-07-19 導電性ボールの搭載方法

Country Status (2)

Country Link
US (1) US7820479B2 (enExample)
JP (1) JP4895936B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180035676A (ko) * 2016-09-29 2018-04-06 신꼬오덴기 고교 가부시키가이샤 캐리어 기재 부착 배선 기판 및 캐리어 기재 부착 배선 기판의 제조 방법

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8735734B2 (en) 2009-07-23 2014-05-27 Lexmark International, Inc. Z-directed delay line components for printed circuit boards
US8198548B2 (en) * 2009-07-23 2012-06-12 Lexmark International, Inc. Z-directed capacitor components for printed circuit boards
US8198547B2 (en) 2009-07-23 2012-06-12 Lexmark International, Inc. Z-directed pass-through components for printed circuit boards
US8237061B2 (en) * 2009-07-23 2012-08-07 Lexmark International, Inc. Z-directed filter components for printed circuit boards
US8278568B2 (en) * 2009-07-23 2012-10-02 Lexmark International, Inc. Z-directed variable value components for printed circuit boards
US8273996B2 (en) * 2009-07-23 2012-09-25 Lexmark International, Inc. Z-directed connector components for printed circuit boards
US20110017502A1 (en) * 2009-07-23 2011-01-27 Keith Bryan Hardin Z-Directed Components for Printed Circuit Boards
US20110017504A1 (en) * 2009-07-23 2011-01-27 Keith Bryan Hardin Z-Directed Ferrite Bead Components for Printed Circuit Boards
US20110017581A1 (en) * 2009-07-23 2011-01-27 Keith Bryan Hardin Z-Directed Switch Components for Printed Circuit Boards
WO2012099602A1 (en) * 2011-01-21 2012-07-26 Lexmark International, Inc. Z-directed connector components for printed circuit boards
US8658245B2 (en) 2011-08-31 2014-02-25 Lexmark International, Inc. Spin coat process for manufacturing a Z-directed component for a printed circuit board
US9009954B2 (en) 2011-08-31 2015-04-21 Lexmark International, Inc. Process for manufacturing a Z-directed component for a printed circuit board using a sacrificial constraining material
US8752280B2 (en) 2011-09-30 2014-06-17 Lexmark International, Inc. Extrusion process for manufacturing a Z-directed component for a printed circuit board
US8790520B2 (en) 2011-08-31 2014-07-29 Lexmark International, Inc. Die press process for manufacturing a Z-directed component for a printed circuit board
US9078374B2 (en) 2011-08-31 2015-07-07 Lexmark International, Inc. Screening process for manufacturing a Z-directed component for a printed circuit board
US8943684B2 (en) * 2011-08-31 2015-02-03 Lexmark International, Inc. Continuous extrusion process for manufacturing a Z-directed component for a printed circuit board
US8822840B2 (en) 2012-03-29 2014-09-02 Lexmark International, Inc. Z-directed printed circuit board components having conductive channels for controlling transmission line impedance
US8822838B2 (en) 2012-03-29 2014-09-02 Lexmark International, Inc. Z-directed printed circuit board components having conductive channels for reducing radiated emissions
US8830692B2 (en) 2012-03-29 2014-09-09 Lexmark International, Inc. Ball grid array systems for surface mounting an integrated circuit using a Z-directed printed circuit board component
US8912452B2 (en) 2012-03-29 2014-12-16 Lexmark International, Inc. Z-directed printed circuit board components having different dielectric regions
KR102029077B1 (ko) 2013-02-04 2019-10-07 삼성전자주식회사 패키지의 외부접속단자 형성 방법 및 이를 수행하기 위한 장치
US9673131B2 (en) * 2013-04-09 2017-06-06 Intel Corporation Integrated circuit package assemblies including a glass solder mask layer
US9216469B2 (en) * 2013-10-18 2015-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Indirect printing bumping method for solder ball deposition

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5284287A (en) * 1992-08-31 1994-02-08 Motorola, Inc. Method for attaching conductive balls to a substrate
US5431332A (en) * 1994-02-07 1995-07-11 Motorola, Inc. Method and apparatus for solder sphere placement using an air knife
US5655704A (en) * 1994-08-30 1997-08-12 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component
CA2135508C (en) * 1994-11-09 1998-11-03 Robert J. Lyn Method for forming solder balls on a semiconductor substrate
JPH09107045A (ja) 1995-10-13 1997-04-22 Japan Aviation Electron Ind Ltd Ｂｇａパッケージのボール取付け方法
JPH10126046A (ja) 1996-10-18 1998-05-15 Oki Electric Ind Co Ltd ボール・グリッド・アレイの製造装置
JP2925534B1 (ja) * 1998-04-28 1999-07-28 株式会社日鉄マイクロメタル 金属球配列方法及び配列装置
US6191022B1 (en) * 1999-04-18 2001-02-20 Cts Corporation Fine pitch solder sphere placement
JP2001320160A (ja) 2000-05-12 2001-11-16 Fuji Photo Film Co Ltd クリーム半田塗布方法及び半田供給装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180035676A (ko) * 2016-09-29 2018-04-06 신꼬오덴기 고교 가부시키가이샤 캐리어 기재 부착 배선 기판 및 캐리어 기재 부착 배선 기판의 제조 방법
KR102394215B1 (ko) * 2016-09-29 2022-05-09 신꼬오덴기 고교 가부시키가이샤 캐리어 기재 부착 배선 기판 및 캐리어 기재 부착 배선 기판의 제조 방법

Also Published As

Publication number Publication date
US20090020591A1 (en) 2009-01-22
JP2009026959A (ja) 2009-02-05
US7820479B2 (en) 2010-10-26

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