JP2009026959A5 - - Google Patents

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Publication number
JP2009026959A5
JP2009026959A5 JP2007188630A JP2007188630A JP2009026959A5 JP 2009026959 A5 JP2009026959 A5 JP 2009026959A5 JP 2007188630 A JP2007188630 A JP 2007188630A JP 2007188630 A JP2007188630 A JP 2007188630A JP 2009026959 A5 JP2009026959 A5 JP 2009026959A5
Authority
JP
Japan
Prior art keywords
conductive ball
mounting
conductive
paste
receiving port
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007188630A
Other languages
English (en)
Japanese (ja)
Other versions
JP4895936B2 (ja
JP2009026959A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007188630A priority Critical patent/JP4895936B2/ja
Priority claimed from JP2007188630A external-priority patent/JP4895936B2/ja
Priority to US12/173,256 priority patent/US7820479B2/en
Publication of JP2009026959A publication Critical patent/JP2009026959A/ja
Publication of JP2009026959A5 publication Critical patent/JP2009026959A5/ja
Application granted granted Critical
Publication of JP4895936B2 publication Critical patent/JP4895936B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007188630A 2007-07-19 2007-07-19 導電性ボールの搭載方法 Expired - Fee Related JP4895936B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007188630A JP4895936B2 (ja) 2007-07-19 2007-07-19 導電性ボールの搭載方法
US12/173,256 US7820479B2 (en) 2007-07-19 2008-07-15 Conductive ball mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007188630A JP4895936B2 (ja) 2007-07-19 2007-07-19 導電性ボールの搭載方法

Publications (3)

Publication Number Publication Date
JP2009026959A JP2009026959A (ja) 2009-02-05
JP2009026959A5 true JP2009026959A5 (enExample) 2010-06-17
JP4895936B2 JP4895936B2 (ja) 2012-03-14

Family

ID=40264027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007188630A Expired - Fee Related JP4895936B2 (ja) 2007-07-19 2007-07-19 導電性ボールの搭載方法

Country Status (2)

Country Link
US (1) US7820479B2 (enExample)
JP (1) JP4895936B2 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110017504A1 (en) * 2009-07-23 2011-01-27 Keith Bryan Hardin Z-Directed Ferrite Bead Components for Printed Circuit Boards
US8198547B2 (en) * 2009-07-23 2012-06-12 Lexmark International, Inc. Z-directed pass-through components for printed circuit boards
US8198548B2 (en) * 2009-07-23 2012-06-12 Lexmark International, Inc. Z-directed capacitor components for printed circuit boards
US20110017502A1 (en) * 2009-07-23 2011-01-27 Keith Bryan Hardin Z-Directed Components for Printed Circuit Boards
US8273996B2 (en) * 2009-07-23 2012-09-25 Lexmark International, Inc. Z-directed connector components for printed circuit boards
US8278568B2 (en) * 2009-07-23 2012-10-02 Lexmark International, Inc. Z-directed variable value components for printed circuit boards
US20110017581A1 (en) * 2009-07-23 2011-01-27 Keith Bryan Hardin Z-Directed Switch Components for Printed Circuit Boards
US8735734B2 (en) 2009-07-23 2014-05-27 Lexmark International, Inc. Z-directed delay line components for printed circuit boards
US8237061B2 (en) * 2009-07-23 2012-08-07 Lexmark International, Inc. Z-directed filter components for printed circuit boards
WO2012099602A1 (en) * 2011-01-21 2012-07-26 Lexmark International, Inc. Z-directed connector components for printed circuit boards
US8790520B2 (en) 2011-08-31 2014-07-29 Lexmark International, Inc. Die press process for manufacturing a Z-directed component for a printed circuit board
US9078374B2 (en) 2011-08-31 2015-07-07 Lexmark International, Inc. Screening process for manufacturing a Z-directed component for a printed circuit board
US8943684B2 (en) * 2011-08-31 2015-02-03 Lexmark International, Inc. Continuous extrusion process for manufacturing a Z-directed component for a printed circuit board
US8658245B2 (en) 2011-08-31 2014-02-25 Lexmark International, Inc. Spin coat process for manufacturing a Z-directed component for a printed circuit board
US9009954B2 (en) 2011-08-31 2015-04-21 Lexmark International, Inc. Process for manufacturing a Z-directed component for a printed circuit board using a sacrificial constraining material
US8752280B2 (en) 2011-09-30 2014-06-17 Lexmark International, Inc. Extrusion process for manufacturing a Z-directed component for a printed circuit board
US8822838B2 (en) 2012-03-29 2014-09-02 Lexmark International, Inc. Z-directed printed circuit board components having conductive channels for reducing radiated emissions
US8912452B2 (en) 2012-03-29 2014-12-16 Lexmark International, Inc. Z-directed printed circuit board components having different dielectric regions
US8830692B2 (en) 2012-03-29 2014-09-09 Lexmark International, Inc. Ball grid array systems for surface mounting an integrated circuit using a Z-directed printed circuit board component
US8822840B2 (en) 2012-03-29 2014-09-02 Lexmark International, Inc. Z-directed printed circuit board components having conductive channels for controlling transmission line impedance
KR102029077B1 (ko) 2013-02-04 2019-10-07 삼성전자주식회사 패키지의 외부접속단자 형성 방법 및 이를 수행하기 위한 장치
US9673131B2 (en) * 2013-04-09 2017-06-06 Intel Corporation Integrated circuit package assemblies including a glass solder mask layer
US9216469B2 (en) * 2013-10-18 2015-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Indirect printing bumping method for solder ball deposition
JP6637864B2 (ja) * 2016-09-29 2020-01-29 新光電気工業株式会社 キャリア基材付き配線基板、キャリア基材付き配線基板の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5284287A (en) * 1992-08-31 1994-02-08 Motorola, Inc. Method for attaching conductive balls to a substrate
US5431332A (en) * 1994-02-07 1995-07-11 Motorola, Inc. Method and apparatus for solder sphere placement using an air knife
US5655704A (en) * 1994-08-30 1997-08-12 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component
CA2135508C (en) * 1994-11-09 1998-11-03 Robert J. Lyn Method for forming solder balls on a semiconductor substrate
JPH09107045A (ja) 1995-10-13 1997-04-22 Japan Aviation Electron Ind Ltd Ｂｇａパッケージのボール取付け方法
JPH10126046A (ja) 1996-10-18 1998-05-15 Oki Electric Ind Co Ltd ボール・グリッド・アレイの製造装置
JP2925534B1 (ja) * 1998-04-28 1999-07-28 株式会社日鉄マイクロメタル 金属球配列方法及び配列装置
US6191022B1 (en) * 1999-04-18 2001-02-20 Cts Corporation Fine pitch solder sphere placement
JP2001320160A (ja) 2000-05-12 2001-11-16 Fuji Photo Film Co Ltd クリーム半田塗布方法及び半田供給装置

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