JP2009218435A5 - - Google Patents
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- Publication number
- JP2009218435A5 JP2009218435A5 JP2008061638A JP2008061638A JP2009218435A5 JP 2009218435 A5 JP2009218435 A5 JP 2009218435A5 JP 2008061638 A JP2008061638 A JP 2008061638A JP 2008061638 A JP2008061638 A JP 2008061638A JP 2009218435 A5 JP2009218435 A5 JP 2009218435A5
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- mount device
- mounting
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims 5
- 230000008018 melting Effects 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008061638A JP5078683B2 (ja) | 2008-03-11 | 2008-03-11 | プリント基板、及び表面実装デバイスの実装構造体 |
| US12/401,247 US8218333B2 (en) | 2008-03-11 | 2009-03-10 | Printed circuit board and mounting structure for surface mounted device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008061638A JP5078683B2 (ja) | 2008-03-11 | 2008-03-11 | プリント基板、及び表面実装デバイスの実装構造体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009218435A JP2009218435A (ja) | 2009-09-24 |
| JP2009218435A5 true JP2009218435A5 (enExample) | 2011-01-27 |
| JP5078683B2 JP5078683B2 (ja) | 2012-11-21 |
Family
ID=41061774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008061638A Expired - Fee Related JP5078683B2 (ja) | 2008-03-11 | 2008-03-11 | プリント基板、及び表面実装デバイスの実装構造体 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8218333B2 (enExample) |
| JP (1) | JP5078683B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5229267B2 (ja) | 2010-05-06 | 2013-07-03 | 株式会社デンソー | 電子装置 |
| JP5704177B2 (ja) * | 2011-01-25 | 2015-04-22 | 株式会社村田製作所 | 電子部品 |
| KR20140067380A (ko) * | 2012-11-26 | 2014-06-05 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
| WO2014171890A1 (en) * | 2013-04-15 | 2014-10-23 | Heptagon Micro Optics Pte. Ltd. | Accurate positioning and alignment of a component during processes such as reflow soldering |
| CN103633058A (zh) * | 2013-12-12 | 2014-03-12 | 矽力杰半导体技术(杭州)有限公司 | 封装组件及其制造方法 |
| KR102688571B1 (ko) | 2019-06-20 | 2024-07-25 | 삼성전자주식회사 | 반도체 패키지 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0499394A (ja) | 1990-08-17 | 1992-03-31 | Cmk Corp | 多層プリント配線板 |
| JP2000174410A (ja) * | 1998-12-08 | 2000-06-23 | Denso Corp | 電子部品の実装構造および電子部品の実装方法 |
| US6653219B2 (en) * | 2000-01-13 | 2003-11-25 | Hitachi, Ltd. | Method of manufacturing bump electrodes and a method of manufacturing a semiconductor device |
| KR100333627B1 (ko) * | 2000-04-11 | 2002-04-22 | 구자홍 | 다층 인쇄회로기판 및 그 제조방법 |
| JP2004055660A (ja) * | 2002-07-17 | 2004-02-19 | Shinko Electric Ind Co Ltd | 配線基板及び半導体装置 |
| KR100523745B1 (ko) * | 2003-03-24 | 2005-10-25 | 주식회사 유니테스트 | 전자소자 검사용 마이크로 프로브 및 그 제조 방법 |
| EP1962569A1 (en) * | 2005-12-16 | 2008-08-27 | Ibiden Co., Ltd. | Multilayer printed wiring plate, and method for fabricating the same |
| US20080136004A1 (en) * | 2006-12-08 | 2008-06-12 | Advanced Chip Engineering Technology Inc. | Multi-chip package structure and method of forming the same |
-
2008
- 2008-03-11 JP JP2008061638A patent/JP5078683B2/ja not_active Expired - Fee Related
-
2009
- 2009-03-10 US US12/401,247 patent/US8218333B2/en active Active