MY162137A - Method and apparatus for mounting conductive balls - Google Patents
Method and apparatus for mounting conductive ballsInfo
- Publication number
- MY162137A MY162137A MYPI20082098A MYPI20082098A MY162137A MY 162137 A MY162137 A MY 162137A MY PI20082098 A MYPI20082098 A MY PI20082098A MY PI20082098 A MYPI20082098 A MY PI20082098A MY 162137 A MY162137 A MY 162137A
- Authority
- MY
- Malaysia
- Prior art keywords
- conductive balls
- ball
- mount
- mounting
- holding
- Prior art date
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A CONDUCTIVE BALL MOUNTING METHOD FOR MOUNTING CONDUCTIVE BALLS (1) ON A MOUNT (2) USING AN ARRAYING MASK (3), IN WHICH THE MOUNT INCLUDES MOUNTING POSITIONS FORMED IN A PREDETERMINED PATTERN, AND THE ARRAYING MASK IS PROVIDED ABOVE THE MOUNT AND INCLUDES THROUGH HOLES (31) PROVIDED IN POSITIONS CORRESPONDING TO THE MOUNTING POSITIONS. THE METHOD INCLUDES PROVIDING A BALL SUCTION UNIT (5) FOR SUCKING SOLDER BALLS, THE BALL SUCTION UNIT INCLUDING A BALL HOLDING MEMBER (52) CAPABLE OF HOLDING THE CONDUCTIVE BALLS, SUCKING UP THE CONDUCTIVE BALLS BELOW THE BALL SUCTION UNIT, HOLDING THE CONDUCTIVE BALLS ON A LOWER SURFACE OF THE BALL HOLDING MEMBER WHILE SUCKING UP THE CONDUCTIVE BALLS, AND AFTER THE HOLDING THE CONDUCTIVE BALLS, FALLING THE CONDUCTIVE BALLS HELD BY THE BALL HOLDING MEMBER TO THE MOUNT.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006338146A JP4899125B2 (en) | 2006-12-15 | 2006-12-15 | Method and apparatus for mounting conductive ball |
Publications (1)
Publication Number | Publication Date |
---|---|
MY162137A true MY162137A (en) | 2017-05-31 |
Family
ID=39655225
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI20082098A MY162137A (en) | 2006-12-15 | 2008-06-12 | Method and apparatus for mounting conductive balls |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4899125B2 (en) |
MY (1) | MY162137A (en) |
TW (1) | TWI409013B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010027765A (en) * | 2008-07-17 | 2010-02-04 | Shibuya Kogyo Co Ltd | Ball loading apparatus |
JP5453636B2 (en) * | 2009-11-30 | 2014-03-26 | 澁谷工業株式会社 | Conductive ball mounting device |
JP5639360B2 (en) * | 2009-12-21 | 2014-12-10 | アスリートFa株式会社 | Ball guiding device, ball guiding method, and ball mounting device |
JP5598705B2 (en) * | 2010-06-03 | 2014-10-01 | 澁谷工業株式会社 | Conductive ball feeder |
JP6069723B2 (en) | 2012-06-06 | 2017-02-01 | 澁谷工業株式会社 | Repair equipment for workpieces with small balls |
KR101576722B1 (en) * | 2014-01-13 | 2015-12-10 | 미나미 가부시키가이샤 | Conductive Ball Mounting Head |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5284287A (en) * | 1992-08-31 | 1994-02-08 | Motorola, Inc. | Method for attaching conductive balls to a substrate |
JPH1126630A (en) * | 1997-07-02 | 1999-01-29 | Shinko Electric Ind Co Ltd | Method and apparatus for mounting balls for forming outer connection terminals |
JP2003273146A (en) * | 2002-03-13 | 2003-09-26 | Sekisui Chem Co Ltd | Manufacturing device for film arranged with conductive grain |
JP3933560B2 (en) * | 2002-11-14 | 2007-06-20 | シャープ株式会社 | Ball mounting apparatus and ball mounting method |
JP4118283B2 (en) * | 2004-08-04 | 2008-07-16 | イビデン株式会社 | Solder ball mounting method and solder ball mounting apparatus |
-
2006
- 2006-12-15 JP JP2006338146A patent/JP4899125B2/en active Active
-
2008
- 2008-06-12 TW TW97121868A patent/TWI409013B/en active
- 2008-06-12 MY MYPI20082098A patent/MY162137A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP4899125B2 (en) | 2012-03-21 |
TWI409013B (en) | 2013-09-11 |
JP2008153336A (en) | 2008-07-03 |
TW200952586A (en) | 2009-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY162137A (en) | Method and apparatus for mounting conductive balls | |
EP1776004A4 (en) | Method and device for mounting solder ball | |
SG161263A1 (en) | An improved ball mounting apparatus and method | |
EP2019575A3 (en) | Conductor ball mounting apparatus, conductor ball mounting method, mask used for mounting conductor ball, and mask manufacturing method | |
EP2019422A3 (en) | Apparatus and method for arranging magnetic solder balls | |
WO2008140019A1 (en) | Method and apparatus for mounting solder ball | |
GB2441265A (en) | Method for manufacturing a circuit board structure, and a circuit board structure | |
SG144725A1 (en) | Apparatus for mounting component | |
EP1800337A4 (en) | Grooved substrates for uniform underfilling solder ball assembled electronic devices | |
WO2008014194A3 (en) | Methods and apparatus for releasably mounting a semiconductor device to a printed circuit board | |
EP2012569A4 (en) | Method for mounting solder ball and apparatus for mounting solder ball | |
SG139625A1 (en) | Structure of image sensor module and a method for manufacturing of wafer level package | |
TWI315553B (en) | Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device | |
TW200739770A (en) | System, apparatus, and method for advanced solder bumping | |
EP2037493A3 (en) | Method of mounting conductive ball and conductive ball mounting apparatus | |
WO2006088113A3 (en) | Electronic component mounting system and electronic component mounting method | |
TW200746964A (en) | Method of manufacturing printed wiring board | |
TW200732683A (en) | Method and apparatus for automatic test equipment | |
EP2072167A3 (en) | Conductive ball removing method, conductive ball mounting method, conductive ball removing apparatus, and conductive ball mounting apparatus | |
TW200721216A (en) | Packaging method of electronic component module, method for manufacturing electronic apparatus using it, and electronic component module | |
TW200746965A (en) | Method and apparatus for mounting solder ball | |
SG129405A1 (en) | Manufacturing method for electronic substrate, manufacturing method for electro-optical device, and manufacturing method for electronic device | |
JP2004363546A5 (en) | ||
JP2006019741A5 (en) | ||
TWI347158B (en) | Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device |