JP5639360B2 - Ball guiding device, ball guiding method, and ball mounting device - Google Patents

Description

  The present invention relates to a ball guiding device, a ball guiding method, and a ball mounting device that move a ball together with a ball guiding head in a state where the ball is enclosed in a ball surrounding region by a blown gas flow.

  Various methods are disclosed in which a ball is supplied onto a mask in which an opening corresponding to the substrate electrode is formed, and the ball is moved by a gas flow to be arranged on the substrate electrode. Patent Document 1 is a method of blowing column-like air and blowing and moving the ball. However, there is a problem that the ball is not enclosed in a predetermined area and is scattered.

Patent Literature 2 and Patent Literature 3 disclose a method of sucking air from the upper part of a cylindrical head and holding the ball in the head. However, there is a problem that the mask is lifted by the air flow.
Patent Document 4 overcomes the above-mentioned drawbacks by opening a dummy hole in the mask. However, in a semiconductor substrate, for example, since the distance between the openings opened in the mask is narrow, the dummy holes that act effectively can be opened in the mask. There is no problem.

 Patent Document 5 discloses a method of moving a ball while collecting the ball in the ball surrounding region by a sweeper in which air nozzles for blowing air are arranged in a direction perpendicular to the tangent to the ball surrounding region. However, in this apparatus, since the air blowing direction is directed toward the center of the ball enclosing area and the opening for discharging the blown air is not provided, the ball is placed between the sweeper and the sweeper. There is a problem of flowing out.

USP. 5,431,322 JP 2006-073999 A JP 2008-153336 A JP 2009-016552 A WO2006 / 004000

  The first problem to be solved is that it is difficult to accurately arrange the balls on the substrate electrode without damaging the balls supplied on the mask and moving the balls in a predetermined area. It is. The second problem is that the ball deviates out of the head by riding on the gas flow flowing out of the head. The third problem is that the mask floats due to the negative pressure generated by the gas flow.

The ball guiding device according to the present invention includes a ball supply device for supplying a ball to a ball surrounding area on a mask and a ball surrounding the ball by blowing gas to a hollow portion of a ball guiding head having an upper opening for discharging gas. It has a ball guiding head that is enclosed in the entrapment region, a gas supply device that supplies gas to the ball guiding head, and a head drive device that moves the ball guiding head in the horizontal direction.

In the ball guiding device of the present invention, the ball guiding head includes a hollow member having an upper surface opening, a lower surface opening, and a hollow portion, a gas supply port and a discharge port, and a gas flow path connecting the supply port and the discharge port. A plurality of grooves formed on the lower surface, and the gas introduced from the gas supply device through the supply port passes through the gas flow path, the discharge port, and the groove to the ball enclosing region on the mask. It is characterized by being discharged and discharged from the upper surface opening.

Furthermore, in the ball guiding device of the present invention, the gas blown out through the groove to the hollow portion includes a gas flowing in a tangential direction of the lower surface opening.
Furthermore, in the ball guiding device of the present invention, the gas blown through the groove to the hollow portion forms a vortex in the hollow portion and is discharged from the upper surface opening.
Furthermore, in the ball guiding apparatus according to the present invention, the ball supply head rotates about the vertical direction.

  In addition, in the ball guiding method of the present invention, the gas supplied from the gas supply device is blown out from a plurality of grooves formed on the lower surface of the ball guiding head to the hollow portion of the ball guiding head and formed on the upper surface of the ball guiding head. The ball discharged from the upper surface opening and moved from the ball supply device to the ball surrounding area on the mask is moved together with the ball guiding head.

Furthermore, the ball mounting device of the present invention is a ball mounting device comprising a substrate loader / unloader device, a substrate transfer robot, a stage, a flux printing device, and a ball transfer device having a ball guiding device. By moving the substrate horizontally, the substrate transfer robot arranges the balls on the electrodes of the substrate placed on the stage from the substrate loader / unloader device through the opening of the mask.

  The ball guiding device of the present invention dissipates the ball from the ball enclosing region by providing an air outlet for blowing out gas on the lower surface of the hollow member used for the ball guiding head and an upper surface opening for exhausting the gas to the outside. The ball was guided without causing damage to the ball, and the ball could be accurately arranged on the substrate electrode.

Further, by providing a groove or the like on the lower surface of the hollow member and blowing gas toward the mask, it was possible to suppress the floating of the mask. Furthermore, the gas blown out from the groove formed in the tangential direction of the lower surface opening was able to guide the ball supplied to the ball enclosing area and the movement of the ball guiding head without floating the mask. .

In addition, the vortex generated along the inner surface of the hollow member can enclose the ball in the ball enclosing area and suppress the ball from flowing out of the ball enclosing area.
Since the ball is moved by a vortex that is a flow along the inner surface of the hollow member, a decrease in the air pressure at the center of the hollow portion is reduced, and the mask can be prevented from rising.
Further, by rotating the ball supply head, it was possible to reduce the gas flow rate and the number of grooves, and to prevent the ball from departing from the ball enclosing region.

In addition, the ball guiding method of the present invention suppresses the floating of the mask and the deviation of the ball by blowing out gas from a groove provided on the lower surface of the ball guiding head and discharging it from the upper surface opening of the ball guiding head. I was able to.
Furthermore, the ball mounting apparatus according to the present invention can be put to practical use by using the above-described ball guiding apparatus, suppressing the mask floating and the ball deviation, and greatly reducing ball mounting errors. It was.

FIG. 1 is an explanatory view showing a ball mounting apparatus. FIG. 2 is a view for explaining the ball guiding device. FIG. 3 is a view for explaining a hollow member of the ball guiding head. FIG. 4 is a diagram for explaining the eddy current. FIG. 5 is a diagram for explaining the distribution of balls in the ball enclosing area. FIG. 6 is a diagram for explaining the substrate. FIG. 7 is a diagram for explaining the array mask. FIG. 8 is a view for explaining the ball supply device. FIG. 9 is a view for explaining a ball guiding apparatus according to a second embodiment. FIG. 10 is a diagram for explaining a third embodiment of the ball guiding apparatus. FIG. 11 is a diagram for explaining the print mask.

  Balls supplied to the ball enclosing area are ejected from a plurality of gas outlets in a tangential direction of the ball enclosing area to generate a vortex flow, and the gas that has become the vortex flow is discharged from the upper surface opening. A ball guiding device, a ball guiding method, and a ball mounting device that do not deviate from the enclosed area are realized.

  FIG. 1 is a diagram for explaining a ball mounting device 1 and FIG. 2 is a diagram for explaining a ball guiding device 30. The substrate loader / unloader 2 includes a substrate loader 2a for storing a substrate 19 on which no ball is mounted and a substrate unloader 2b for storing a substrate after the ball mounting process. The substrate 19 is taken out from the substrate loader 2a by the substrate transfer robot 3, placed on the pre-aligner 4 and coarsely adjusted in its azimuth and position, and then transferred onto the substrate stage 5 moving to the substrate mounting position. Placed by the robot 3. The placed substrate 19 is adsorbed by the substrate placing table 5a under reduced pressure while being pressed by the substrate pressing device 6 to correct the warpage of the substrate.

The substrate stage 5 can move on an X table 17 and a Y table 18 orthogonal to the X table. The X table 17 extends below the flux printing device 7 and the ball transfer device 8. Accordingly, the substrate stage 5 can move below the flux printing device 7 and the ball transfer device 8 with the substrate 19 adsorbed. Furthermore, the substrate stage 5 incorporates a Z-axis drive device (not shown) and a θ-axis drive device (not shown). With such a configuration, the mask opening 50 of the array mask 57 and the electrode of the substrate 19 can be aligned. The same applies to the alignment of the printing mask and the substrate.

The flux printing device 7 is a device that prints the flux 51 on the electrode 52 formed on the surface of the substrate 19. The flux printing apparatus 7 has two squeegees (not shown) attached to a squeegee support 11 that straddles the two Y-axis rails 14, and squeegees the flux (not shown) supplied on the printing mask. The flux 51 is printed on the substrate while being moved by. The print mask cleaner 9 cleans the flux adhered to the print mask while the substrate is retracted.

  After the flux 51 is printed on the substrate 19, the substrate 19 is lowered to a position where it does not interfere with other components using the Z-axis drive device of the substrate stage 5. Thereafter, the substrate stage 5 is moved below the array mask 57 to align the array mask 57 with the substrate 19.

The ball transfer device 8 exemplifies a ball guiding head 12 mounted with two units in a horizontal (X-axis direction) line. The number of ball guiding heads 12 is preferably the same as or half the number of rows of electrode groups 53 (see FIG. 6) formed on the substrate. When the substrate is a semiconductor substrate or a printed wiring board in which electrode groups are densely arranged, balls are transferred to a plurality of rows of electrode groups 53 with one ball guiding head. When the electrode group is nectar and the substrate size is large, the ball transfer time can be shortened by setting the ball guide heads to three or more rows. Furthermore, the ball guiding heads may be arranged vertically and horizontally in a matrix form arranged in the vertical direction (Y-axis direction).

  The ball guiding head 12 is fixed to the mounting plate 39 and is movably connected to the Z table 20. The Z table 20 is movably connected to the Y-axis rail and further to the X-axis rail. With this configuration, the ball guiding head 12 can move in three dimensions.

  The ball guiding head 12 supplied with the ball 54 moves on the array mask 57 aligned with the substrate 19 along a predetermined trajectory, transfers the ball 54 to the mask opening 50, and after the transfer is completed, the standby position on the mask. Move to (region where no opening is formed). The substrate 19 into which the balls have been transferred descends and is separated from the array mask 57 and returns to the substrate mounting position. At this time, the pressing head portion of the substrate pressing device 6 is retracted to a position where it does not interfere with the substrate. The substrate 19 returned to the substrate placement position is stored in the substrate unloader 2b by the substrate transfer robot 3.

The arrangement mask 57 has a flux escape and spacer structure in order to prevent the flux 51 from adhering to the back surface thereof. However, the flux printed at an illegal place due to a printing mistake or the like may adhere to the back surface of the array mask 57. The flux attached to the back surface of the array mask 57 attaches the balls when the balls are mounted and causes various defects. The array mask cleaner 10 is an apparatus for cleaning the flux adhering to the array mask 57.

FIG. 2 shows a ball guiding device 30 including a substrate tee 5 related to ball mounting, a substrate 19, an array mask 57, and the like. The ball guiding device 30 includes a ball guiding head 12 that guides the ball 54, a ball supplying device 31, a gas supplying device 32, and a moving mechanism that moves the ball guiding head 12 in the XYZ directions. FIG. 2 shows a state in which the ball guiding head 12 is moving from the right to the left in the drawing. The gas 49 blown from the lower part of the hollow member 21 to the hollow part 22 swings the ball 54 onto the flux 51 through the mask opening 50 while moving the ball 54.

The ball guiding head 12 includes a hollow member 21, a motor 33 that rotates the hollow member 21, and attachment members thereof. The mounting member includes a support column 35, a mounting plate 36, and a mounting plate 39. The hollow member 21 is fixed to the mounting plate 36 via the support column 35. The mounting plate 36 is coupled to the motor rotating shaft 34, and the mounting plate 39 is coupled to the Z table 20 so as to be movable up and down while fixing the motor 33. The Z table 20 is movably connected to the Y-axis rail 16 and the X-axis rail 15. The X-axis rail, Y-axis rail, and Z-axis rail, and the X table, Y table, and Z table are driven by a servo motor 38 or a linear motor, respectively. With such a configuration, the ball guiding head 12 can move in the XYZ axial directions while freely rotating in a horizontal plane.

The hollow member 12 is provided with gas introduction ports 23 at eight locations, and a gas (indicated by ←) can be introduced from the gas supply device 32 into the inside through a pipe 32a and a joint (not shown). . The introduced gas is blown out from the eight gas outlets 28 to the hollow portion 22. The gas is blown into the hollow portion 22 to enclose the ball in the ball enclosing region 43.

The ball supply device 31 is fixed to the mounting plate 39 and can be moved together with the ball guiding head 12. The ball supply device 31 drops the ball through the guide tube 31 a regardless of whether the ball feeding device 31 is moving or stationary. 22, the ball 54 can be supplied to the ball enclosing region 43 on the arrangement mask 57. When the ball guiding head 12 moves, the balls 54 supplied onto the arrangement mask 57 are caused to flow into the ball enclosing area 43 by the blown gas 49 and do not deviate outside the ball enclosing area 43. ing.

The ball surrounding region 43 is defined as a region on the mask 9 b corresponding to the lower surface opening 43, that is, a region illustrated by a circle having a diameter A. Therefore, the ball surrounding area 43 moves together with the ball guiding head 12 and is not an area having physically fixed coordinates. Further, the region is substantially smaller than the lower surface opening 43. Furthermore, the size and shape of the substantial area in which the ball is enclosed vary depending on the outflow amount of the gas, the moving speed of the ball guiding head, the ball amount, and the like.

The height position of the ball guiding head 12 can be set by the Z table 20. Therefore, the ball guiding head 12 is designed so as to be able to move horizontally on the mask without contacting the array mask 57 (non-contact). If the distance between the arrangement mask 57 and the lower surface 41 of the ball guiding head is so narrow that the ball is sandwiched between them, the ball is damaged, which is not preferable. On the other hand, if the interval is too large, balls that do not move are generated by the blown gas and the balls remain on the array mask, which is not preferable. For this reason, the distance between the array mask 57 and the lower surface 41 of the ball guiding head depends on the size of the balls, the flow velocity of the blown gas, the moving speed of the ball guiding head, and the like. It ’s fine if you do n’t touch Considering the unevenness of the mask and the vibration of the ball guiding head, the diameter is preferably greater than the ball diameter and less than 20 times the ball diameter. The interval is more preferably 1.5 to 10 times the ball diameter.

The gas supply device 32 is a device that can supply pressurized gas with a pressurized cylinder such as nitrogen gas, argon gas, dry air, or an air compressor. The gas inlet 23 may be disposed on the upper surface 40 of the hollow member 21 and other places as long as mechanical interference with other parts does not occur. When the hollow member 21 is rotated, a rotatable gas joint is fixed at the center of the hollow member 21, and a pipe for distributing the gas to the gas inlet 23 is laid from there.

  As will be described in detail with reference to FIG. 8, the ball supply device 31 is a device capable of continuously or intermittently feeding a predetermined amount of balls. The ball 54 supplied to the hollow portion intermittently from the ball supply device 3, whether it is stationary or being transferred, is dropped and accumulated on the array mask 57. The purpose of supplying the ball 54 during ball transfer is to reduce the ball amount due to ball mounting, ball dissipation, etc., so that the ball amount remaining in the ball enclosing region 43 is controlled within a predetermined range, and the balls are arranged in a mask. This is to prevent mistakes when arranging the electrodes on the substrate electrode through the openings. The predetermined amount of the ball corresponds to an amount reduced when the ball is transferred into the mask opening, and is the amount of the ball supplied to keep the amount of the ball remaining in the ball enclosing region substantially constant. .

FIG. 3 is a diagram of the hollow member 21 for explaining the flow of gas that encloses the ball 54 in the ball enclosing region 43. The hollow member 21 has a rotationally symmetric shape. Fig.3 (a) is a front view of the hollow member 21, and shows the left side in AA cross section of FIG.3 (b). FIG. 3B is a bottom view of the hollow member 21.

The hollow member 21 has a substantially cylindrical shape, and is manufactured by dividing it into an upper member 21a and a lower member 21b in order to facilitate processing of a gas flow path. The two members are combined to form the lower member 21b. A screw (not shown) is fixed from the lower surface 41. The internal shape of the hollow member 21 is not limited to a circle, and may be a polygon or an ellipse. By making the shape away from the circle, the flow of gas in the ball enclosing region 43 can be variously changed.

In FIG. 3A, the cross section of the upper member 21a is indicated by a 45 ° oblique line, and the lower member 21b is indicated by the oblique line of 135 °. The gas introduced from the gas introduction port 23 passes through the gas flow path 24, the gas reservoir 25, and the gap 29, and flows to the groove 27 and the ring-shaped opening 29a. The gas flow is indicated by →. The gas flow path 24 is a tubular hole connected to the gas inlet 23. The gas storage part 25 is a cylindrical space for storing a gas formed by a cylindrical hole formed in the upper member 21a and a small cylindrical protrusion formed in the lower member 21b. The gas storage part 25 is for relieving gas breathing (fluctuation in the blowout amount). The gas flow path 24 and the gas storage part 25 are electrically connected by a horizontal hollow disk-shaped gap.

The gap 29 is a gap between the upper member 21a and the lower member 21b, and has a thin cylindrical shape. The gap extends in the vertical direction on the inner side of the gas reservoir 25, and is inclined slightly above the groove 27 to reach the lower surface 41. A region where the gap 29 overlaps the groove 27 is the gas discharge port 26, and a ring-shaped opening formed by the gap 29 reaching the lower surface is a ring-shaped opening 29a. The ring-shaped opening has a discrete ring shape because a portion overlapping the groove 27 is excluded. The gas discharged from the gas outlet 26 passes through the groove 27 and is blown out from the gas outlet 28 to the hollow portion 22. On the other hand, gas is also blown obliquely downward from the ring-shaped opening 29a that faces the lower surface 41. Each blown-out gas presses the arrangement mask 57 and suppresses the arrangement mask from being lifted by the gas flow. Further, the gas blown out from the ring-shaped opening 29a mainly flows in the direction of the hollow portion 22, and works to return the ball that has flowed out from the ball enclosing region 43 into the ball enclosing region.

FIG. 3B is a bottom view of the hollow member 21. Eight grooves 27 are formed in the lower surface 41. The gas outlet 28 that blows gas from the groove 27 to the hollow portion 22 is a hole formed by the vortex forming slope 45 that is an inclined surface and the groove 27 that is rectangular and extends in the tangential direction of the lower surface opening 43. Inclined, the shape is not a rectangle but an elongated shape consisting of four sides.

The hollow member 21 has an upper surface 40 and a lower surface 41, and a hollow portion 22 is formed therein. The upper surface 40 is formed with an upper surface opening 42 for discharging gas and supplying a ball. The lower surface 41 is formed with a lower surface opening 43 for enclosing the supplied ball, and gas can be blown out to the lower surface opening 43. In addition, although the upper surface opening 42 and the lower surface opening 43 are round surfaces, the code | symbol is attached | subjected to the outer periphery of each opening. The inner surface 44 of the hollow member 21 has an inwardly convex rotating body shape, and includes a vortex forming slope 45 and a gas discharge slope 46.

The shape of the eddy current forming inclined surface 45 is downward and has an acute angle (10 to 45 degrees) with respect to the array mask 57 in order to make the gas blown from the gas discharge port 26 through the groove 27 to the lower surface opening 43 into a vortex. Designed to. Gas flowing in a small angle between the array mask 57 and the vortex forming slope 45 in the tangential direction of the ball enclosing region 43 merges with the gas flowing through the other grooves 27 one after another, and rotates along the vortex forming slope. It rises and forms a vortex (see FIG. 4). The swirled gas rises on the gas discharge slope 46 while swirling, and is discharged out of the ball guiding head 12 from the upper surface opening 42. Even if the ball guiding head 12 moves, the ball 54 in the ball surrounding region 43 remains in the ball surrounding region 43 by being swept by this vortex.

The upper surface opening 42 may be a hole (not shown) provided on the gas discharge slope 46 instead of the upper surface, and a mesh may be stretched on the opening or the hole so that the ball does not deviate from the upper surface opening by riding on a vortex. . Furthermore, the gas that has become a vortex flow in the present invention may be exhausted to the outside of the ball guiding head through the hollow portion and may be forcibly exhausted. In the case of forced exhaust, there is an advantage that the area of the exhaust port can be reduced. Without the exhaust port, the vortex generation is incomplete, the air flow becomes turbulent, the ball is incompletely enclosed, and the ball is dissipated out of the induction head on the gas flowing out of the ball enclosure area. To do.

The groove 27 has a width of 5 mm and a depth of 2 mm. In the width direction of the groove, the cross section of the groove is divided into an outer side (viewed from the center of the ball enclosing region 43), a center and an inner side, and the outer side is defined as a tangential direction of the lower surface opening 43. The gas flowing outside the groove cross section flows along the tangent line of the lower surface opening 43, and the gas flowing through the center and the inner side flows toward the inside of the lower surface opening 43, hits the vortex forming slope 45 and flows along the vortex forming slope. And rises while forming a vortex (see FIG. 4).

In the present embodiment, eight grooves 27 are illustrated, but the number of grooves is larger and the width of the grooves is narrower, the better the generation of vortices. However, the number of grooves may be one as long as the head can rotate. . Although the upper limit of the number of grooves depends on the size of the ball guiding head, it is 36 or less (10-degree interval or more), and 2 to 12 is more suitable. The gas blowing amount is adjusted according to the moving speed of the ball guiding head so that the ball enclosed in the ball surrounding area does not collide with the lower part of the ball guiding head 12 due to the movement of the ball guiding head.

The gas 49 blown out from the gas outlet 28 may have a function of surrounding the ball and a function of stirring the ball in the ball surrounding area 43. The two functions generated by the gas flow, the function of enclosing the ball and the function of stirring the ball vary depending on the angle formed by the groove 27 and the tangential direction of the ball enclosing area 43 and the width of the groove. By directing the direction of the groove 27 from the tangential direction 47 to the inside of the ball enclosing region 43, the ability to agitate the ball increases. In addition, by reducing the width of the groove 27, the ability to stir the ball can be reduced and the ability to surround the ball can be increased. In order to strengthen the stirring of the ball, for example, it is effective not to direct all eight grooves 27 in the tangential direction 47 of the lower surface opening 43 but to direct the two grooves 27 to the inside of the lower surface opening 43, for example. It is. It is also effective to change the cross-sectional shape of some of the grooves 27. On the other hand, it is also effective to optimize the agitation of the ball by adjusting the flow rate of the gas blown out from the gas outlet. In this case, if the moving speed of the stirred ball is too high, the ball will not fall into the mask opening 50, so it is preferable to decrease the moving speed of the ball as the ball weight decreases.

FIG. 4 shows the result of numerical analysis of the gas flow. For the convenience of analysis, the gas introduction port is an external opening 27 a of the groove 27. The gas introduced from the external opening 27a becomes a vortex 76 as shown by an arrow. The gas that rises as a vortex 76 on the vortex forming slope 45 diffuses upward along the upward gas discharge slope 46, flows to the upper surface opening 42 while decreasing the flow velocity, and is discharged from the hollow portion 22. Since the vortex 76 flows along the inner surface 44 of the hollow member 21, the influence of the vortex at the center of the hollow portion 22 is small, and the movement of the ball is small. However, since the ball surrounding area 43 is moved by moving the ball guiding head 12 in the horizontal direction, the vortex is brought into contact with the ball existing in the area, and the ball is moved.

When the velocity of the gas blown out from the gas outlet 28 and the velocity of the vortex 76 generated in the hollow portion 22 are increased, the outside air (atmosphere outside the hollow member 21) is sent from the external opening 27a to the arrangement mask 57. And a suction phenomenon from the gap between the lower surface 41 of the hollow member 21 also occurs. When the outside air is sucked from the gap or the like, the balls scattered in the area other than the ball surrounding area 43 and the hollow member 21 can be guided into the ball surrounding area 43. By utilizing this phenomenon, after the ball is transferred, the ball remaining on the mask can be sucked and cleaned.

The balls 54 in the ball enclosing region 43 take various distributions by the gas blown out from the gas outlets 28. FIG. 5 is an example of a ball distribution generated in the ball enclosing area. 5A shows a case where the flow of gas other than the vortex 76 is large and the ball is agitated, and FIG. 5B shows a case where there is little flow other than the vortex 76.

The ball distribution takes various forms depending on the direction of the groove, the width of the groove, and the flow rate of the gas. When the flow rate of gas is increased and a high-speed vortex is generated, the ball rises with the vortex. Since the vortex discharge slope 45 of the hollow portion is an obtuse angle rotation surface, the flow velocity of the vortex flow 76 becomes slower toward the upper portion of the hollow portion. The ball soared has a lower vortex flow velocity on the vortex discharge slope 46, and therefore the ball falls to the vortex discharge slope. When the vortex velocity further increases, the ball flows out of the upper surface opening 42 together with the gas.

  FIG. 6 is an example of a plan view of the substrate 55 on which the ball 54 is mounted. The substrate is a printed wiring board. The electrode 52 is formed in a rectangle indicated by a broken line 53 and includes an electrode group 53 (broken line) composed of 20 electrodes 52. Although the electrode group 53 of an Example is six groups, the number of electrodes and the number of electrode groups are not limited to these. The electrodes of the electrode group 53 correspond to external output electrodes of one semiconductor integrated circuit. A rectangle 53 indicated by a broken line roughly corresponds to a figure of a semiconductor integrated circuit mounted on the back side of the substrate 55. The present invention can be applied not only to a printed wiring board but also to a semiconductor substrate (wafer). Wafer dimensions of 8 inches and 12 inches are frequently used, but the dimensions are not particularly limited.

  7 is an example of the ball arrangement mask unit 56, FIG. 7 (a) is a plan view of the arrangement mask unit 56, and FIG. 7 (b) is an AA sectional view of FIG. 7 (a). 7 (c) is an example of the shape of the opening. The arrangement mask unit 56 is obtained by attaching an arrangement mask 57 to a frame 58. The array mask 57 is a laminated film of a metal opening forming film 60 and a spacer 61. The spacer 61 is for preventing the flux printed on the substrate from adhering to the mask, and the shape of the spacer 61 is a film that avoids the post and the portion on which the flux is printed. The opening forming film 60 and the spacer 61 may be integrally formed. An adhesive film (not shown) is used to bond the frame 58 and the alignment mask 57 together. Since burrs may remain on the peripheral edge of the substrate 55, the array mask 57 has a burr escape portion 62. By providing the burr escape portion 62, the array mask 57 can be brought into close contact with the substrate 55. This prevents illegal balls from entering between the array mask and the substrate when the balls are mounted.

FIG. 7C illustrates four types of shapes of the opening 59 opened in the mask 57. The right end is a circular and commonly used shape. The other three types of shapes are rounded squares with a circular diameter as one side. The rounding size is smaller on the left side. When the pitch interval of the openings is constant, the ease of transfer of the ball is probabilistically proportional to the area of the opening, and the square opening is the highest. However, it is preferable to round the corners to prevent deterioration of the mask strength due to the corners and facilitate cleaning. Further, the shape of these openings 59 is not a quadrangular shape, but may be a regular polygon having four or more corners such as a 5, 6, 7, octagon, etc., and it is better to round those corners. The size (radius) for rounding the corners may be within a range in which the mask strength is not deteriorated and the corners may be easily cleaned. The diameter of the inscribed circle is 0.01 to 0.9, and 0.1 to 0.3. Is better. If the thickness of the array mask 57 is approximately ½ or more of the diameter of the ball and the diameter of the opening and the length of one side of the square are the same, the ball transferred to the circular opening and the transfer to the square opening The positions of the balls that are placed are within the same variation in the calculation. Since the probability that the ball is transferred into the opening is proportional to the area of the opening, the probability that the ball is transferred into the opening can be improved by up to about 30%. Furthermore, the ease of transfer of balls can be further improved by chamfering the opening on the upper surface of the array mask.

  FIG. 8 shows an example of a ball supply device 31 that measures and supplies balls. The ball supply device 31 includes a ball storage unit 64, a ball measuring unit 65, a connecting unit 66 that connects the ball storing unit 64 and the ball measuring unit 65, and a rotation driving unit (not shown). In addition, the ball filling amount of the ball storage unit 64 is preferably less than half of the volume.

The ball supply device 31 can be tilted between an upward vertical direction (state shown in FIG. 8), a horizontal direction, and a downward vertical direction by a rotation driving unit. First, when setting a new ball storage unit 65, the ball storage unit 65 is rotated downward to replace the ball storage unit 65. After the replacement, when the ball supply device 31 is rotated upward, the balls in the ball storage section 64 are filled up to the measurement flow path 67 through the flow path 70 of the ball measurement section 65. Next, when it is rotated 90 degrees clockwise and turned horizontally, the ball filled in the metering channel 67 moves to the ball temporary storage unit 68, and the ball above the metering channel 67 passes through the channel and passes through the ball. Return to the reservoir 64.

Next, when the ball supply device 31 is rotated 90 degrees counterclockwise to the top, the ball moved to the temporary storage unit 68 passes through the outlet 69, passes through the guide tube (not shown), and passes to the ball guide device 30. Sent. On the other hand, the balls in the ball storage section 64 are filled up to the measurement flow path 67 through the flow path 70. By repeating the above operation, the ball supply device 31 can supply a predetermined amount of balls to the ball guiding device 30 at predetermined intervals. The ball supply amount per unit time can be changed by controlling the volume of the metering channel 67 or the supply time interval. By shortening the rotation interval of the ball supply device, pseudo continuous supply can be achieved. The ball supply device 31 is not limited to the above example, and may be a parts feeder that sends a ball by vibration, a method of mechanically opening and closing the ball supply pipe, or the like.

The guide tube 32 a is disposed in a hollow motor rotating shaft 34. Alternatively, the guide tube 32a may be shortened and the motor rotation shaft 34 may be set to a predetermined length. In this case, for example, the position in the ball enclosing region for supplying the ball may be changed by bending the tip of the motor rotation shaft. This makes it possible to increase the probability that the ball is intentionally scattered and the ball is transferred to the mask opening by changing the position of the ball to fall without changing the position where the ball falls.

FIG. 9 is a diagram for explaining the ball guiding device according to the second embodiment, and illustrates the hollow member 21 with the mounting member omitted. A mesh 71 is disposed on the upper portion of the hollow portion 22 so that the ball wound up by the gas does not jump out of the hollow portion 22. The opening of the mesh 71 is made smaller than the ball.

FIG. 10 is a view for explaining a third embodiment of the ball guiding device, in which a part of the ball guiding head 12 is illustrated, and a gas stirring device 72 for stirring the hollow portion 22 is provided. The gas stirrer 72 includes a screw 73, a rotating shaft 74, and a motor 75. The motor 75 is fixed to the hollow member mounting plate 36, and a rotating shaft 74 having a screw 73 disposed at the tip is attached. The screw 73 is disposed in the hollow portion 22. The balls on the array masks fall into the openings while the balls move slowly without interfering with each other. If the balls interfere with each other or jump over the opening, the ball does not fall into the opening. The moving speed of the ball by the stirring of the gas stirring device 72 is preferably a speed at which the ball in the ball enclosing area moves to the mask opening while moving. However, the degree of agitation is suitable as long as the rate at which the balls fall into the openings is large even at a high speed at which some balls jump without jumping to the mask openings. As a method for measuring a phenomenon such as a ball jumping without falling into an opening, there is a method of analyzing an image based on a moving image taken from below using a transparent mask and a substrate. The stirring of the hollow portion 22 by the screw 73 is performed so as to satisfy the above conditions. Accordingly, the number of screws provided is 1 to 4, and the rotating shaft 73 may be inclined not only in the vertical direction.

The gas supplied from the outer periphery of the ball enclosing region 43 becomes a vortex and is exhausted from the upper surface opening 42 along the inner surface 44 of the hollow member. Become slow. Accordingly, the balls in the ball enclosing area are deposited in a plurality of layers in the area where the flow velocity is low, depending on the amount of the balls. The deposited balls interfere with each other and prevent the balls from falling from the mask opening. Balls that easily fall from the openings 59 are sparsely scattered in one layer around the group of stacked balls.

In the present invention, the shape of the mask opening other than the circle used in the ball mounting device is not limited to the ball mounting device using the ball guiding device by the blown-out gas, but is a ball mounting device that guides the ball by suction air or squeegee Is also applicable. Furthermore, it is obvious that it can be applied to a mask used in a flux printing process. In particular, it is extremely effective in the case of a mask having a small opening.

In the present invention, the printable flux thickness is at most about 30% of the diameter of the printing mask opening, and when the ball diameter is reduced to 80 μm or less, the flux thickness becomes thin as shown in FIG. Therefore, it is preferable to use a printing mask 78 having an electrode group opening 79 larger than the electrodes shown in FIG. 11A and 11B show an example of a printing mask 78 in which an electrode group opening 79 is formed. FIG. 11A is a plan view of the printing mask unit 77, and FIG. 19 is illustrated. The print mask unit 77 is a unit in which a print mask 78 in which an electrode group opening 79 is formed is fixed to a frame 80. A flux 81 is printed on the entire surface of the electrode group. Since the electrode group opening 79 has a particularly large opening area compared to the electrode, the flux 81 having a necessary thickness can be printed. The electrode group opening 79 roughly corresponds to the shape of a semiconductor chip mounted on one surface of a substrate that is a printed wiring board.

In the present invention, the term “ball” refers to a conductive ball such as a lead-free solder ball, a lead-containing solder ball, a copper ball, or a gold ball, a ceramic or plastic non-conductive ball, or a non-conductive ball whose surface is modified to be conductive. It can be applied to conductive balls and semiconductor balls such as silicon balls. The diameter of the ball is preferably 20 μm to 750 μm, more preferably 30 μm to 300 μm.

  Further, the ball guiding device of the present invention is not limited to guiding a ball made of an electrical material for circuit connection, but may be a ceramic other than for circuit connection, a plastic non-conductive ball, a silicon ball used for photoelectric conversion, or the like. It can be applied to induction of semiconductor balls and the like.

DESCRIPTION OF SYMBOLS 1 Ball mounting apparatus 2 Substrate loader / unloader 3 Substrate transport robot 5 Substrate stage 7 Flux printing device 8 Ball transfer device 12 Ball guiding head 19 Substrate 21 Hollow member 22 Hollow portion 24 Gas flow path 26 Gas discharge port 27 Groove 30 Ball guiding device 31 Ball supply device 32 Gas supply device 42 Upper surface opening 43 Lower surface opening (ball enclosing region)
47 Tangent direction 57 Array mask 71 Mesh 72 Gas stirrer 76 Swirl

Claims (3)

A ball supply device for supplying a ball to a ball enclosing area on the mask;
The ball guiding head for enclosing the ball in the ball enclosing region by blowing gas to a hollow portion of the ball guiding head having an upper surface opening for discharging gas;
A gas supply device for supplying the gas to the ball guiding head;
A head driving device for moving the ball guiding head in a horizontal direction;
Have
The ball guiding head is
A hollow member in which the upper surface opening, the lower surface opening, a plurality of gas inlets, a plurality of gas outlets for discharging gas into the groove, and a gas flow path connecting the inlet and the gas outlet are formed. Have
The groove is formed on the lower surface of the ball guiding head so as to extend in a tangential direction of the lower surface opening,
The plurality of discharge ports are arranged around the hollow portion,
The gas introduced from the gas supply device into the introduction port passes through the gas flow path, the discharge port, and the groove, and then the ball enclosing region on the mask from the gas outlet of the groove. The ball guiding device is characterized in that the ball guiding device is discharged from the upper surface opening. The ball guiding apparatus according to claim 1, wherein the ball guiding head rotates about a vertical direction. In a ball mounting device comprising a substrate loader / unloader device, a substrate transfer robot, a stage, a flux printing device, and a ball transfer device having the ball guiding device,
By moving the ball guiding device according to claim 1 or 2 in a horizontal direction, the substrate transfer robot passes the opening of the mask on the electrode of the substrate placed on the stage from the substrate loader / unloader device. A ball mounting device, wherein the balls are arranged.