KR101409663B1 - Solder ball mounting apparatus, solder ball mounting system and method for mounting solder ball using the same - Google Patents

Abstract

A solder ball mounting apparatus according to the present invention includes a table mounted on a top surface of a printed circuit board and having a predetermined angle of inclination and an opening corresponding to each pad of the printed circuit board, And a plurality of solder balls which are attached to both sides of the mounting mask and mounted on the table so as to suck a plurality of solder balls at one end of the mounting mask and discharge the solder balls to the other end of the mounting mask, Ball circulator.

Description

Technical Field [0001] The present invention relates to a solder ball mounting apparatus, a solder ball mounting system including the same, and a solder ball mounting method using the solder ball mounting apparatus,

The present invention relates to a solder ball mounting apparatus, a solder ball mounting system including the same, and a solder ball mounting method using the solder ball mounting apparatus.

2. Description of the Related Art Conventionally, a flip chip method for forming a solder bump on a PCB (Printed Circuit Board) and mounting a device thereon is gradually increasing.

Particularly, in the case of a CPU and a graphic computing device that computes a large amount of data at a high speed, conventionally, a substrate and a device are connected to each other by a solder bump using a Au wire, The transition to the flip chip method in which the connection resistance is improved is rapidly increasing.

Such a solder bump may be formed by printing a solder paste on a substrate and reflowing it, a method of forming a fine solder ball by mounting the solder ball on a substrate, And then injected using the above method. Thus, the solder bumps formed on the substrate are melted for connection with the Cu pad or solder bump formed on the chip, and the metal bonds are formed.

As a method of forming such a solder bump, an opening having the same size is formed in a mask as described in Korean Patent Laid-Open Publication No. 2008-0014143 (published on Feb. 13, 2008), and solder balls are formed by using a squeegee A ball placing method in which a solder ball is mounted on an input / output pad of a substrate through a mask opening by squeegeeing or a vacuum hole is formed in a jig in the same manner as a substrate pattern, (pick-up) and mounted on a substrate.

In the pick-up method, as the number of the solder balls increases and the pitch between the balls decreases, the machining cost of the vacuum hole sharply increases in forming the vacuum holes of the jig by mechanically processing and chemically etching. In addition, there is a limitation in size when forming a vacuum hole of a jig, and a ball can not be picked up sufficiently by vacuum, and the ball may fall off the jig and cause a defect.

In addition, when the solder ball is picked up and mounted, if the jig is contaminated by the flux previously coated on the substrate, the undesired solder ball is picked up in the jig portion contaminated with flux and mounted on the substrate, .

On the other hand, in the case of the ballplacing method, the solder ball is pressed by the squeegee to block the hole of the mask during the process of inserting the solder ball into the mask and squeegee it with the squeegee to mount the solder ball, The solder balls hit each other and the surface is broken, so that oxidation may occur rapidly.

Accordingly, the defects cause defects because the solder balls can not be metal-bonded to the input / output pads of the substrate during the reflow process.

An aspect of the present invention is to provide a solder ball mounting apparatus capable of mounting a solder ball in a forced circulation manner without squeeze in order to solve the above problems.

Another aspect of the present invention is to provide a solder ball mounting system capable of mounting a solder ball in a forced circulation manner without squeeze in order to solve the above problems.

Another aspect of the present invention is to provide a solder ball mounting method using a solder ball mounting apparatus capable of mounting a solder ball in a forced circulation manner without squeeze in order to solve the above problems.

A solder ball mounting apparatus according to an embodiment of the present invention includes a table mounted on a top surface of a printed circuit board and converted to a predetermined tilt angle; A mounting mask having an opening corresponding to each pad of the printed circuit board, the mounting mask being superimposed on the table on the printed circuit board; And a solder ball circulator which is engaged with both ends of the mounting mask and mounted on the table, and sucks a plurality of solder balls at one end of the mounting mask and discharges the solder balls to the other end of the mounting mask .

In the solder ball mounting apparatus according to an embodiment of the present invention, the solder ball circulator includes: a first suction port connected to a suction end for sucking the solder ball through a suction path and connected to the air suction pump; A first prevention member provided at a front end portion of the first suction port to filter the solder ball; A transfer path to which a solder ball, which is connected to one side of the first suction port portion provided with the first prevention member, is conveyed by the first prevention member; A second suction port connected to the air suction pump at the other side of the transfer path; A second prevention member provided at a front end portion of the second suction port to filter the solder ball; And a discharge path having one end connected to a second suction port portion provided with the second prevention member and a discharge end on the other side of which the solder ball filtered by the second prevention member is discharged.

The solder ball mounting apparatus according to an embodiment of the present invention further includes a position adjusting unit for contacting the lower side of the table to generate an inclination in the left and right directions of the table.

In the solder ball mounting apparatus according to an embodiment of the present invention, the table is inclined at an acute angle to the suction end.

In the solder ball mounting apparatus according to an embodiment of the present invention, the first prevention member and the second prevention member include a net made of a metal or a plastic material.

In the solder ball mounting apparatus according to an embodiment of the present invention, the position adjusting unit is displaced in the axial direction by using the cylinder or the motor.

According to another aspect of the present invention, there is provided a solder ball mounting system comprising: a solder ball mounting apparatus capable of sucking and discharging a solder ball in a forced circulation manner and mounting the solder ball on a printed circuit board; A controller connected to the solder ball mounting apparatus; An image pickup unit provided at one side of the solder ball mounting apparatus to transmit an image picked up to the control unit; And a display unit connected to the control unit.

In the solder ball mounting system according to another embodiment of the present invention, the solder ball mounting apparatus includes a table mounted on the upper surface of the printed circuit board and converted to a predetermined tilt angle under the control of the controller; A mounting mask having an opening corresponding to each pad of the printed circuit board, the mounting mask being superimposed on the table on the printed circuit board; And a plurality of solder balls which are mounted on the upper portion of the table and which are engaged with both side ends of the mounting mask and which suck a plurality of solder balls at one end of the mounting mask under the control of the control unit and discharge the solder balls to the other end of the mounting mask. And a ball circulator.

The solder ball mounting system according to another embodiment of the present invention further includes a position adjusting unit for contacting the lower side of the table to generate a tilt in the left and right directions of the table.

In a solder ball mounting system according to another embodiment of the present invention, the solder ball circulator includes a first suction port connected to a suction end for sucking the solder ball through a suction path and connected to an air suction pump; A first prevention member provided at a front end portion of the first suction port to filter the solder ball; A transfer path to which a solder ball, which is connected to one side of the first suction port portion provided with the first prevention member, is conveyed by the first prevention member; A second suction port connected to the air suction pump at the other side of the transfer path; A second prevention member provided at a front end portion of the second suction port to filter the solder ball; And a discharge path having one end connected to a second suction port portion provided with the second prevention member and a discharge end on the other side of which the solder ball filtered by the second prevention member is discharged.

In the solder ball mounting system according to another embodiment of the present invention, the table is inclined at an acute angle to the suction end.

In the solder ball mounting system according to another embodiment of the present invention, the position adjusting unit is displaced in the axial direction by using the cylinder or the motor.

In the solder ball mounting system according to another embodiment of the present invention, the image pickup unit is provided at one side of the outer lower surface of the conveyance path corresponding to the mounting mask.

According to another aspect of the present invention, there is provided a solder ball mounting method including: (A) providing a printed circuit board on which a solder ball is to be mounted; (B) mounting the printed circuit board between a table of a solder ball mounting apparatus and a mounting mask; (C) forcibly circulating a plurality of the solder balls to the mounting mask using the solder ball circulator of the solder ball mounting apparatus under the control of the control unit; (D) determining whether each of the solder balls is completely mounted on the opening of the mounting mask by the controller; (E) According to the determination result, the controller recycles the solder balls remaining in the mounting mask by using the solder ball circulator, and supplies the solder balls to the mounting mask again. And (F) reflowing the solder ball filled in the opening of the mounting mask.

In the solder ball mounting method according to another embodiment of the present invention, the step (A) includes the steps of: (A-1) forming a dry film pattern on a substrate having openings corresponding to pads and other circuit patterns; (A-2) filling the dry film pattern with copper; (A-3) peeling off the dry film pattern; And (A-4) forming an SR (Solder Resist) pattern surrounding each of the pads and embedding the other circuit patterns.

In the solder ball mounting method according to another embodiment of the present invention, in the step (B), the suction end of the solder ball circulator is engaged with the upper end of the upper portion of the mounting mask, And the other end of the upper part of the mask.

In the solder ball mounting method according to another embodiment of the present invention, in the step (C), the solder ball is sucked and transferred from one end of the mounting mask by air suction, and the other end of the mounting mask And the transferred solder ball is discharged at the end.

In the solder ball mounting method according to another embodiment of the present invention, the step (C) comprises slanting the table at an acute angle to the suction end direction under the control of the controller.

In the solder ball mounting method according to another embodiment of the present invention, in the step (D), the controller analyzes the image information of the mounting mask received from the upper portion of the solder ball circulator, It is determined whether or not the ball is completely mounted.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to this, terms and words used in the present specification and claims should not be construed in a conventional, dictionary sense, and should not be construed as defining the concept of a term appropriately in order to describe the inventor in his or her best way. It should be construed in accordance with the meaning and concept consistent with the technical idea of the present invention.

The solder ball mounting system according to the present invention can easily mount a plurality of solder balls on a printed circuit board without damage by using a solder ball circulator that sucks and discharges a plurality of solder balls in a forced circulation manner.

The solder ball mounting method according to the present invention is capable of easily mounting a plurality of solder balls on a printed circuit board without damaging the solder balls in a forced circulation manner using a solder ball circulator without a squeeze.

1 is a block diagram showing a system including a solder ball mounting apparatus according to an embodiment of the present invention;
2 is a sectional view of a solder ball mounting apparatus according to an embodiment of the present invention;
FIGS. 3A to 3E are cross-sectional views illustrating a solder ball mounting method according to another embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The objects, particular advantages and novel features of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. It should be noted that, in the present specification, the reference numerals are added to the constituent elements of the drawings, and the same constituent elements are assigned the same number as much as possible even if they are displayed on different drawings. Also, the terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a view illustrating a system including a solder ball mounting apparatus according to an embodiment of the present invention, and FIG. 2 is a sectional view of a solder ball mounting apparatus according to an embodiment of the present invention.

1, the solder ball mounting system according to an embodiment of the present invention includes a solder ball mounting apparatus 400 capable of mounting the solder ball 250 in a forced circulation manner, a solder ball mounting apparatus 400, An image pickup unit 600 provided at one side of the solder ball mounting apparatus 400 to transmit an image of the sensed image to the control unit 500 and a display unit 700 connected to the control unit 200 .

The solder ball mounting apparatus is a device for mounting the solder ball on the printed circuit board 300 in a forced circulation manner. The solder ball mounting apparatus mounts the printed circuit board 300 on the upper surface, The position adjustment units 131 and 132 for generating tilting in the left and right directions of the table 100 by abutting both sides of the printed circuit board 100 and the openings 210 corresponding to the pads of the printed circuit board 300, The mounting mask 200 is mounted on the table 100 on the mounting mask 200 and the upper surface of the table 100 in engagement with both side ends of the mounting mask 200, And a solder ball circulator 400 for sucking and discharging the balls.

The table 100 is a member for mounting and supporting the printed circuit board 300 on the upper surface and includes a table 100 and a mounting mask 200 The printed circuit board 300 can be fixedly interposed therebetween.

The table 100 has an inclined shaft 110 at the center and is inclined in the lateral direction by the position adjusting units 131 and 132 operated under the control of the control unit 400. [

The position adjusting units 131 and 132 are provided to abut on both sides of the table 100 using a cylinder or an electric motor and can be moved up and down along the axial direction under the control of the controller 400, Thereby converting the table 100 into an inclined shape having an acute angle in the lateral direction.

The mounting mask 200 may be formed of one or a mixture of materials such as metal, synthetic resin, and dry film, and may be formed by coating a metal film with a dry film. The mounting mask 200 has a plurality of openings 210 corresponding to the respective pads of the printed circuit board 300.

The solder ball circulator 400 is connected to an external air suction pump or an air discharge pump at at least one side as in the cross section shown in FIG. 2, and has a structure in which the solder ball circulator 400 is engaged with the upper surface of the mounting mask 200 Respectively.

The solder ball circulator 400 sucks the solder ball 250 left on one side of the mounting mask 200 by the air suction force under the control of the controller 500 and discharges the solder ball 250 The solder ball 250 can be mounted on the opening 210 of the mounting mask 200 by transferring the mask 200 to the other side of the mounting mask 200.

2, the solder ball circulator 400 includes a first suction port 420 and a second suction port 430 connected to the air suction pump, and a transfer path 433 And a discharge passage 440. The discharge passage 440 is provided with a discharge passage 440.

A first prevention member 421 for preventing the solder ball 250 from entering the first suction port 420 and the second suction port 430 is provided at the front end of the first suction port 420 and the front end of the second suction port 430, And a second prevention member 431. [ The first prevention member 421 and the second prevention member 431 may be formed of a mesh network formed of a metal or a plastic material. The first prevention member 421 and the second prevention member 431 may be formed of a mesh network, (440).

The solder ball circulator 400 includes a suction path 410 connected to the first suction port 420 and a suction end 411 mounted to one side of the mounting mask 200 as an end of the suction path 410 A plurality of solder balls 250 on the mounting mask 200 are sucked through the suction end 411 by the first suction port 420.

The plurality of sucked solder balls 250 are filtered by the first prevention member 421 to be transmitted to the feed path 433 and the suction force of the air suction pump connected to the second suction port 430 or the suction force of the air suction pump connected to one side The air is discharged to the second prevention member 431 by air discharge of the air discharge pump connected to the second air vent.

Thereafter, the solder ball 250 filtered by the second preventing member 431 is sent to the discharge path 440 and discharged through the discharge end 441 by the air discharge of the air discharge pump connected to one side of the discharge path 440 And can be supplied again to the upper surface of the mounting mask 200.

At this time, the table 100 is converted into a tilted state by the position adjusting units 131 and 132 in the right direction, i.e., the suction end 411 direction, so that the mounting mask 200 is also tilted.

The solder balls 250 supplied to the tilted mounting mask 200 are respectively filled in the openings 210 while moving along the upper surface of the mounting mask 200 inclined by the gravity, The surplus solder ball 250 is gathered near the suction end 411 and sucked into the suction end 411.

The process of sucking and discharging the solder ball 250 using the solder ball circulator 400 is repeatedly performed until the solder ball 250 is completely mounted on the opening 210 of the mounting mask 200 .

Whether or not the solder ball 250 is fully mounted on the opening 210 of the mounting mask 200 can be detected by detecting the position of the solder ball 250 on one side of the solder ball circulator 400, The control unit 500 can analyze and determine image information detected by the image sensing unit 600 provided on the lower surface of the road 433.

The control unit 500 analyzes the image information of the mounting mask 200 received from the imaging unit 600 to determine whether the solder ball 250 is mounted on the opening 210 of the mounting mask 200 The suction and discharge processes of the solder ball 250 using the solder ball circulator 400 can be repeatedly performed.

If the solder ball 250 is mounted on the opening 210 of the mounting mask 200, the controller 500 controls the solder ball 250 to be mounted on the mounting mask 200 (Not shown).

The control unit 500 performs a reflow process on the solder ball 250 mounted on the opening 210 of the mounting mask 200 so that the solder ball 250 is electrically connected to the printed circuit board 300, Respectively.

The solder ball mounting system according to an embodiment of the present invention is configured such that a solder ball circulator 400 for sucking and discharging the solder ball 250 in a forced circulation manner is used to mount the solder ball 250 on the printed circuit board (300).

Hereinafter, a solder ball mounting method according to another embodiment of the present invention will be described with reference to FIGS. 3A to 3E. FIGS. 3A to 3E are cross-sectional views illustrating a solder ball mounting method according to another embodiment of the present invention.

The solder ball mounting method according to another embodiment of the present invention will be explained by mounting solder balls 250 on the printed circuit board 300 by using the solder ball mounting system shown in FIG.

First, a solder ball mounting method according to another embodiment of the present invention includes the steps of forming an SR pattern layer 320 on the substrate 300 shown in FIG. 3A and exposing the upper surface of a plurality of pads 310 and filling another circuit pattern .

Specifically, in order to form a circuit pattern different from the plurality of pads 310 on the substrate 300, a dry film pattern having an opening corresponding to a circuit pattern different from the pad 310 is formed on the upper surface of the substrate 300 .

Thereafter, an additive method using chemical vapor deposition (CVD), physical vapor deposition (PVD), a subtractive method, electroless copper plating or electrolytic copper plating, Semi-Additive Process) and MSAP (Modified Semi-Additive Process).

As described above, when the dry film pattern is filled with copper and the dry film pattern is peeled off, a large number of pads 310 and other circuit patterns are formed on the substrate 300.

A solder resist is applied to the plurality of pads 310 and the substrate 300 having another circuit pattern and the upper surface of the pad 310 is exposed by the patterning process including the exposure and the etching process for the applied solder resist The SR pattern layer 320 for embedding another circuit pattern can be formed.

After the SR pattern layer 320 is formed, the mounting mask 200 exposing the upper surface of the pad 310 is provided on the upper surface of the SR pattern layer 320 as shown in FIG. 3A, The printed circuit board 300 is mounted between the upper surface of the mounting mask 100 and the lower surface of the mounting mask 200.

3B, in the state where the table 100 and the mounting mask 200 are mounted via the printed circuit board 300, suction terminals 411 (411) are formed on both sides of the upper surface of the mounting mask 200, The solder ball circulator 400 is mounted on the upper portion of the mounting mask 200 so that the solder ball circulator 400 and the discharge end 441 correspond to each other.

Then, a plurality of solder balls 250 are mounted on the printed circuit board 300 in a forced circulation manner using the solder ball circulator 400.

For example, when the table 100 and the solder ball circulator 400 are tilted at an acute angle with respect to the horizontal plane in the right direction, that is, toward the suction end 411, The ball 250 is sucked from the suction end 411 and discharged from the discharge end 441 through the suction path 410, the transfer path 433, and the discharge path 440. [

The plurality of solder balls 250 discharged from the discharge end 441 are filled in the opening 210 of the mounting mask 200 while moving along the upper surface of the mounting mask 200.

At this time, the surplus solder ball 250 left unfilled in the opening 210 of the mounting mask 200 is again sucked at the suction end 411 under the control of the controller 500, and the suction paths 410, The transfer path 433, and the discharge path 440, and is discharged again through the discharge end 441. [

Whether or not the solder ball 250 is completely filled in the opening 210 of the mounting mask 200 can be detected by detecting the position of the solder ball circulator 400 on the side of the solder ball circulator 400, The control unit 500 can analyze and determine image information detected by the image sensing unit 600 provided on the lower surface of the display unit 433.

The control unit 500 analyzes the image information of the mounting mask 200 received from the imaging unit 600 to determine whether the solder ball 250 is mounted on the opening 210 of the mounting mask 200 The suction and discharge processes of the solder ball 250 using the solder ball circulator 400 can be repeatedly performed.

The solder ball 250 is filled in the opening 210 of the mounting mask 200 and then the solder ball 250 is filled in the opening 210 of the mounting mask 200 as shown in FIG. Thereby performing a low process.

Accordingly, the solder ball 250 filled in the opening 210 is melted, accumulated in the pad 310, and adhered to the solder ball pattern 251.

Then, the mounting mask 200 is removed to form a structure having the same height t from the upper surface of the substrate 300 to the solder ball pattern 251 as shown in FIG. 3D.

Next, as shown in FIG. 3E, the chip 20 is mounted on the solder ball pattern 251 having the same height t from the upper surface of the substrate 300 by using the solder 21. Next, as shown in FIG.

A plurality of solders 21 covering the solder ball pattern 251 are provided between the pads 310 on the substrate 300 and the chip 20 to electrically connect them.

As described above, the solder ball mounting method according to another embodiment of the present invention is a method for mounting a plurality of solder balls 250 on a printed circuit board 300 without damaging the solder balls 250 in a forced circulation manner using a solder ball circulator 400 without a squeeze .

Therefore, in the solder ball mounting method according to another embodiment of the present invention, the chip 20 is mounted at the same height by using the solder ball 250 mounted on the printed circuit board 300 without damage, Can be improved.

Although the technical idea of the present invention has been specifically described according to the above preferred embodiments, it is to be noted that the above-described embodiments are intended to be illustrative and not restrictive.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention.

100: Table 110: Tilt axis
131, 132: position adjusting section 200: mounting mask
210: opening 250: solder ball
300: printed circuit board 310: pad
320: SR pattern layer 400: solder ball circulator
410: suction path 411: suction port
420: first suction port 421: first prevention member
430: second suction port 431: second prevention member
433: Feeding path 440:
441: Discharge stage

Claims (20)

A table mounted on the upper surface of the printed circuit board and converted into a predetermined tilt angle;
A mounting mask having an opening corresponding to each pad of the printed circuit board, the mounting mask being superimposed on the table on the printed circuit board; And
A solder ball circulator which is engaged with both side ends of the mounting mask and mounted on an upper portion of the table and sucks a plurality of solder balls at one end of the mounting mask and discharges the solder balls to the other end of the mounting mask;
The solder ball mounting device comprising:
The method according to claim 1,
The solder ball circulator
A first suction port connected to a suction end for sucking the solder ball through a suction path and connected to the air suction pump;
A first prevention member provided at a front end portion of the first suction port to filter the solder ball;
A transfer path to which a solder ball, which is connected to one side of the first suction port portion provided with the first prevention member, is conveyed by the first prevention member;
A second suction port connected to the air suction pump at the other side of the transfer path;
A second prevention member provided at a front end portion of the second suction port to filter the solder ball; And
A discharge path having one end connected to a second suction port portion provided with the second prevention member and having a discharge end on which the solder ball filtered by the second prevention member is discharged;
The solder ball mounting device comprising:
The method according to claim 1,
Further comprising a position adjusting section for contacting the lower side of the table to generate a tilt in the left and right directions of the table.
The method of claim 2,
Wherein the table is inclined at an acute angle to the suction end.
The method of claim 2,
Wherein the first prevention member and the second prevention member include a mesh formed of a metal or a plastic material.
The method of claim 3,
Wherein the position adjusting section is displaced in the axial direction by using a cylinder or a motor.
A mounting mask mounted on the table on the printed circuit board and having an opening corresponding to each pad of the printed circuit board and a table mounted on an upper surface of the printed circuit board and converted to a predetermined tilt angle; And a solder ball circulator mounted on an upper portion of the table so as to engage with both ends of the mask to suck a plurality of solder balls at one end of the mounting mask and discharge the solder balls to the other end of the mounting mask, A solder ball mounting device capable of sucking and discharging solder balls and mounting the solder balls on a printed circuit board;
A controller connected to the solder ball mounting apparatus;
An image pickup unit provided at one side of the solder ball mounting apparatus to transmit an image picked up to the control unit; And
A display unit connected to the control unit;
The solder ball mounting system comprising:
The method of claim 7,
The table of the solder ball mounting apparatus is converted to a predetermined tilt angle under the control of the control unit,
Wherein the solder ball circulator of the solder ball mounting apparatus sucks a plurality of solder balls at one end of the mounting mask under control of the controller and discharges the solder balls to the other end of the mounting mask.
The method of claim 7,
Further comprising: a position adjustment unit that contacts the lower side of the table to generate a tilt in the left and right directions of the table.
The method of claim 8,
The solder ball circulator
A first suction port connected to a suction end for sucking the solder ball through a suction path and connected to the air suction pump;
A first prevention member provided at a front end portion of the first suction port to filter the solder ball;
A transfer path to which a solder ball, which is connected to one side of the first suction port portion provided with the first prevention member, is conveyed by the first prevention member;
A second suction port connected to the air suction pump at the other side of the transfer path;
A second prevention member provided at a front end portion of the second suction port to filter the solder ball; And
A discharge path having one end connected to a second suction port portion provided with the second prevention member and having a discharge end on which the solder ball filtered by the second prevention member is discharged;
The solder ball mounting system comprising:
The method of claim 10,
Wherein the table is inclined at an acute angle to the suction end.
The method of claim 9,
Wherein the position adjustment unit is displaced in the axial direction by using a cylinder or a motor.
The method of claim 10,
Wherein the first and second prevention members include a mesh formed of a metal or a plastic material.
The method of claim 10,
Wherein the imaging unit is provided at one side of the outer lower surface of the transfer path corresponding to the mounting mask.
(A) providing a printed circuit board on which solder balls are to be mounted;
(B) mounting the printed circuit board between a table of a solder ball mounting apparatus and a mounting mask;
(C) According to the control of the control unit, a plurality of solder balls are sucked from one end of the mounting mask by using a solder ball circulator of the solder ball mounting apparatus and discharged to the other end of the mounting mask, Circulating and supplying a plurality of the solder balls;
(D) determining whether each of the solder balls is completely mounted on the opening of the mounting mask by the controller;
(E) According to the determination result, the controller circulates the solder balls remaining in the mounting mask again using the solder ball circulator and supplies the solder balls to the mounting mask again. And
(F) reflowing the solder ball filled in the opening of the mounting mask;
Wherein the solder ball mounting method comprises:
16. The method of claim 15,
The step (A)
(A-1) forming a dry film pattern on a substrate having openings corresponding to pads and other circuit patterns;
(A-2) filling the dry film pattern with copper;
(A-3) peeling off the dry film pattern; And
(A-4) forming an SR (Solder Resist) pattern surrounding each of the pads and embedding the other circuit patterns;
Wherein the solder ball mounting method comprises:
16. The method of claim 15,
The step (B)
Wherein a suction end of the solder ball circulator is engaged with an upper end of an upper portion of the mounting mask and a discharge end of the solder ball circulator is engaged with the other end of the upper portion of the mounting mask.
16. The method of claim 15,
The step (C)
The solder ball is sucked and conveyed at one end of the mounting mask by air suction, and the transferred solder ball is discharged to the other end of the mounting mask by air discharge.
18. The method of claim 17,
The step (C)
Wherein the table is inclined at an acute angle with respect to the suction stroke direction under the control of the controller.
16. The method of claim 15,
The step (D)
Wherein the control unit analyzes the image information of the mounting mask received from the imaging unit provided at one side of the solder ball circulator to determine whether or not the mounting of the solder ball is completed.

Images