JP5411340B1 - Solder ball mounting apparatus, solder ball mounting system including the same, and solder ball mounting method using the same - Google Patents

Abstract

A solder ball mounting apparatus capable of easily mounting a large number of solder balls on a printed circuit board without damage, a solder ball mounting system including the solder ball mounting system, and a solder ball mounting method using the same.
A solder ball mounting apparatus according to the present invention includes a table 100 on which a printed circuit board 300 is mounted on an upper surface and converted into a predetermined inclination angle, and an opening 210 corresponding to each pad of the printed circuit board 300. A mounting mask 200 superimposed on the table 100 and mounted on the printed circuit board 300, and is mounted on the upper side of the table 100 by engaging with both side edges of the mounting mask 200. A solder ball circulator 400 that sucks a large number of solder balls 250 at the side end and discharges the solder balls 250 to the other end of the mounting mask 200.
[Selection] Figure 1

Description

  The present invention relates to a solder ball mounting apparatus, a solder ball mounting system including the same, and a solder ball mounting method using the same.

  2. Description of the Related Art Conventionally, the application of a flip chip method in which a solder bump is formed on a PCB (Printed Circuit Board) and a device is mounted thereon is increasing.

  In particular, in the case of CPUs and graphic computing devices that calculate large amounts of data at high speed, the conventional method of connecting a substrate and a device using Au wire is used to connect the substrate and the device to a solder bump. However, the shift to the flip chip method with improved connection resistance is increasing rapidly.

  Such solder bumps are formed by printing a solder paste on the substrate and reflowing it, forming a fine solder ball on the substrate, and melting the solder bump. It can be classified into a method of injecting the formed solder directly into the substrate or using a mask. The solder bumps formed on the substrate in this way are melted to connect with the Cu pads or solder bumps formed on the chip, and bond between the metals.

  As disclosed in Patent Document 1, after forming openings of the same size in a mask (Mask), the method of forming such solder bumps is performed by squeezing the solder balls using a squeegee, A ball placing method for mounting on an input / output pad of a substrate through a mask opening, or a vacuum hole is formed in a jig (Jig) in the same manner as a substrate pattern, and a solder ball is picked up in a vacuum (pick) -Up) and mounting on a substrate.

  In the case of the pick-up method, the vacuum hole of the jig is first mechanically processed and chemically etched to increase the number of solder balls, and the pitch between the balls (Pitch) decreases. The processing cost of vacuum holes increases rapidly. In addition, since there is a size restriction when forming the vacuum hole of the jig, the ball cannot be sufficiently picked up by vacuum, and the ball may fall from the jig and cause a defect.

  In the pickup method, when a solder ball is picked up and mounted, if the jig is contaminated by a flux (Flux) previously applied to the substrate, an undesired solder ball is picked up by the jig portion contaminated by the flux. May be attached to the board and cause defects.

  On the other hand, in the case of the ball-plating method, a solder ball is thrown into the mask and squeezed with a squeegee to mount the solder ball, and the solder ball is pressed by the squeegee to close the hole of the mask. Or, during squeezing, solder balls may collide with each other and the surface may be cracked and oxidized rapidly.

  Therefore, due to such defects, the solder balls are not metal-bonded with the input / output pads of the substrate during the reflow process, which causes defects.

Korean Published Patent No. 2008-0014143

  An object of the present invention is to provide a solder ball mounting apparatus capable of mounting a solder ball by a forced circulation method without performing squeezing in order to solve the above problems.

  Another object of the present invention is to provide a solder ball mounting system capable of mounting solder balls by forced circulation without performing squeezing in order to solve the above-mentioned problems.

  Another object of the present invention is to provide a solder ball mounting method using a solder ball mounting apparatus capable of mounting a solder ball by forced circulation without performing squeezing in order to solve the above-mentioned problems. There is.

  A solder ball mounting apparatus according to an embodiment of the present invention includes a table on which a printed circuit board is mounted and converted into a predetermined inclination angle, and an opening corresponding to each pad of the printed circuit board, A mounting mask that is mounted on the printed circuit board so as to overlap the table, and that is mounted on the upper portion of the table by engaging both side ends of the mounting mask, and at one end of the mounting mask. A solder ball circulator that sucks a large number of solder balls and discharges them to the other end of the mounting mask.

  In a solder ball mounting apparatus according to an embodiment of the present invention, the solder ball circulator is connected to a suction end for sucking the solder ball through a suction path, and a first suction port connected to an air suction pump; A first prevention member that is provided at a front end portion of the first suction port and that sorts the solder balls, and one side is connected to a first suction port portion that is provided with the first prevention member, and the first prevention member A transfer path through which the selected solder balls are transferred, a second suction port disposed on the other side of the transfer path and connected to the air suction pump, and a front end portion of the second suction port, A second prevention member for sorting the solder balls, and a discharge end from which one side is connected to the second suction port portion provided with the second prevention member and the solder balls sorted by the second prevention member are discharged. Be prepared on the side Includes a discharge path was, the.

  The solder ball mounting apparatus according to an embodiment of the present invention further includes a position adjusting unit that abuts on the lower side of the table and tilts the table leftward or rightward.

  In the solder ball mounting apparatus according to an embodiment of the present invention, the table is provided in a state inclined at an acute angle in the suction end direction.

  In the solder ball mounting apparatus according to an embodiment of the present invention, the first prevention member and the second prevention member include a net formed of metal or plastic material.

  In the solder ball mounting apparatus according to the embodiment of the present invention, the position adjusting unit is displaced in the vertical axis direction using a cylinder or a motor.

In addition, a solder ball mounting system according to another embodiment of the present invention includes a solder ball mounting device that sucks and discharges solder balls in a forced circulation manner and mounts them on a printed circuit board, and a control connected to the solder ball mounting device. and parts, provided on one side of the solder ball mounting apparatus, an imaging unit for transmitting the captured image to the control unit, anda display unit coupled to the controller, the solder ball mounting apparatus, the A table having a printed circuit board mounted on the upper surface and converted into a predetermined inclination angle by the control of the control unit, and an opening corresponding to each pad of the printed circuit board, the table on the printed circuit board A mounting mask mounted in an overlapping manner, and mounted on the upper portion of the table by engaging with both end portions of the mounting mask, and controlled by the control unit Thus inhalation of large number of solder balls in one end of the mounting masks, including a solder ball circulation unit for discharging the other side end portion of the mounting mask.

  The solder ball mounting system according to another embodiment of the present invention further includes a position adjusting unit that abuts on the lower side of the table and tilts the table leftward or rightward.

  In a solder ball mounting system according to another embodiment of the present invention, the solder ball circulator is connected to a suction end that sucks the solder ball through a suction path, and a first suction port connected to an air suction pump; A first prevention member that is provided at a front end portion of the first suction port and that sorts the solder balls, and one side is connected to a first suction port portion that is provided with the first prevention member, and the first prevention member A transfer path through which the solder balls selected by the transfer are transferred, a second suction port disposed on the other side of the transfer path and connected to the air suction pump, and a front end portion of the second suction port, A second prevention member for sorting the solder balls, and a discharge end from which one side is connected to a second suction port portion provided with the second prevention member, and the solder balls sorted by the second prevention member are discharged. other Including a discharge passage having a.

  In a solder ball mounting system according to another embodiment of the present invention, the table is provided in a state inclined at an acute angle toward the suction end.

  In a solder ball mounting system according to another embodiment of the present invention, the position adjusting unit is displaced in the vertical axis direction using a cylinder or a motor.

  In the solder ball mounting system according to another embodiment of the present invention, the imaging unit is provided on one side of the lower surface outside the transfer path corresponding to the mounting mask.

In addition, a solder ball mounting method according to another embodiment of the present invention includes (A) a step of preparing a printed circuit board on which a solder ball is mounted, and (B) mounting the printed circuit board on a table of a solder ball mounting apparatus. And (C) supplying a large number of solder balls to the mounting mask by forced circulation using the solder ball circulator of the solder ball mounting device under the control of the control unit. And (D) the control unit determines whether each of the solder balls has been completely attached to the opening of the mounting mask; and (E) the control unit determines whether the solder ball has been installed in the opening of the mounting mask. A step of forcibly circulating the solder balls remaining in the mounting mask using a ball circulator and supplying the solder balls again to the mounting mask; (F) opening of the mounting mask; Comprises the steps of performing a reflow process on the filled solder balls, step (B) is engaged with one end of the upper portion of the solder ball circulator suction end the mounting mask The solder ball circulator has a discharge end engaged with the other end of the upper portion of the mounting mask. In the step (C), the table is moved toward the suction end under the control of the control unit. Prepare in a state of being inclined at an acute angle .

  In the solder ball mounting method according to another embodiment of the present invention, the step (A) includes (A-1) forming a dry film pattern having openings corresponding to pads and other circuit patterns on the substrate. (A-2) filling the dry film pattern with copper, (A-3) peeling the dry film pattern, and (A-4) wrapping each of the pads, Forming an SR (Solder Resist) pattern to be embedded.

  In the solder ball mounting method according to another embodiment of the present invention, in the step (C), the solder ball is sucked and transferred at one end of the mounting mask by air suction, and the mounting is performed by air discharge. The transferred solder balls are discharged to the other end of the mask for use.

  In the solder ball mounting method according to another embodiment of the present invention, in the step (D), the control unit receives image information of the mounting mask received from an imaging unit provided on one side of the solder ball circulator. To determine whether or not the solder ball has been mounted.

  The solder ball mounting system according to the present invention can be easily mounted on a printed circuit board without damaging a large number of solder balls using a solder ball circulator that sucks and discharges a large number of solder balls in a forced circulation manner. Have

  The solder ball mounting method according to the present invention has an effect that it can be easily mounted on a printed circuit board without damaging a large number of solder balls by a forced circulation method using a solder ball circulator without performing conventional squeezing. Have.

1 is a configuration diagram illustrating a system including a solder ball mounting apparatus according to an embodiment of the present invention; It is sectional drawing of the solder ball mounting apparatus by one Example of this invention. It is process sectional drawing for demonstrating the solder ball mounting method by the other Example of this invention. It is process sectional drawing for demonstrating the solder ball mounting method by the other Example of this invention. It is process sectional drawing for demonstrating the solder ball mounting method by the other Example of this invention. It is process sectional drawing for demonstrating the solder ball mounting method by the other Example of this invention. It is process sectional drawing for demonstrating the solder ball mounting method by the other Example of this invention.

  Objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and preferred embodiments with reference to the accompanying drawings. In this specification, when adding reference numerals to the components of each drawing, it is noted that the same components are given the same number as much as possible even if they are shown in different drawings. There must be. The terms “one side”, “other side”, “first”, “second” and the like are used to distinguish one component from another component, and the component is the term It is not limited by. Hereinafter, in describing the present invention, detailed descriptions of known techniques that may obscure the subject matter of the present invention are omitted.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a configuration diagram illustrating a system including a solder ball mounting apparatus according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the solder ball mounting apparatus according to an embodiment of the present invention.

  As shown in FIG. 1, a solder ball mounting system according to an embodiment of the present invention includes a solder ball mounting device capable of mounting a solder ball 250 in a forced circulation manner, and a control connected to the solder ball mounting device. Unit 500, an image pickup unit 600 that is provided on one side of the solder ball mounting apparatus and transmits a pickup image to control unit 500, and a display unit 700 connected to control unit 500.

  The solder ball mounting apparatus is an apparatus for mounting a solder ball on the printed circuit board 300 by a forced circulation method. The table 100 is attached to the upper surface of the printed circuit board 300 and converted into a predetermined inclination angle; Position adjustment units 131 and 132 that abut against both sides of the table 100 and tilt the table 100 in the left-right direction, and respective opening portions 210 corresponding to the pads of the printed circuit board 300 are provided on the table 100 on the printed circuit board 300. The mounting mask 200 mounted in a superposed manner and the solder balls that are mounted on the upper portion of the table 100 by engaging with both side ends of the mounting mask 200 and suck and discharge a large number of solder balls on the mounting mask 200. And a circulator 400.

  The table 100 is a member that mounts and supports the printed circuit board 300 on the upper surface, and is mounted with the mounting mask 200 superimposed using a coupling means such as a clamp, and the table 100 and the mounting mask 200 are connected to each other. The printed circuit board 300 can be fixedly interposed between them.

  Such a table 100 includes a tilt shaft 110 at the center, and is tilted in the left-right direction by position adjusting units 131 and 132 operated by the control of the control unit 500.

  The position adjustment units 131 and 132 are provided in contact with both sides of the table 100 using, for example, a cylinder or an electric motor, and can be moved up and down along the axial direction under the control of the control unit 500. Thus, the table 100 is converted into a shape inclined at an acute angle in the left-right direction.

  The mounting mask 200 can be formed by using one or a mixture of materials such as metal, synthetic resin, and dry film. In particular, the mounting mask 200 is formed into a shape in which a dry film is coated on a metal plate. be able to. Such a mounting mask 200 includes a large number of openings 210 corresponding to the pads of the printed circuit board 300.

  2, the solder ball circulator 400 has an external air suction pump or an air discharge pump connected to at least one side as shown in the cross section shown in FIG. It has an engaging structure.

  Such a solder ball circulator 400 sucks the solder ball 250 remaining on one side of the mounting mask 200 by air suction input under the control of the control unit 500, and discharges the solder ball 250 to the mounting mask 200 by air discharge. The solder ball 250 can be attached to the opening 210 of the mounting mask 200.

  Specifically, as shown in FIG. 2, the solder ball circulator 400 includes a first suction port 420 and a second suction port 430 connected to an air suction pump, and one side is connected to the air discharge pump. A transfer path 433 and a discharge path 440 are provided.

  A first prevention member 421 and a second prevention member that prevent the solder ball 250 from entering the first suction port 420 and the second suction port 430 at the front end of the first suction port 420 and the front end of the second suction port 430, respectively. 431. Here, the first prevention member 421 and the second prevention member 431 are formed of a mesh net made of metal or plastic material, and the solder balls 250 are sorted and transferred to the transfer path 433 and the discharge path 440. be able to.

  The solder ball circulator 400 includes a suction path 410 connected to the first suction port 420, and a suction end 411 attached to one side of the mounting mask 200 as an end of the suction path 410. A large number of solder balls 250 on the mounting mask 200 are sucked by the suction port 420 via the suction end 411.

  The large number of solder balls 250 sucked in this way are sorted by the first prevention member 421 and transmitted to the transfer path 433, and the suction input of the air suction pump connected to the second suction port 430 or one of the transfer paths 433. The air is discharged to the second prevention member 431 by the air discharge of the air discharge pump connected to the side and further sorted.

  Thereafter, the solder balls 250 selected by the second prevention member 431 are transferred to the discharge path 440 and are mounted on the mounting mask 200 via the discharge end 441 by air discharge of an air discharge pump connected to one side of the discharge path 440. Can also be supplied to the upper side of the.

  At this time, the table 100 is converted into a state of being inclined in the right direction, that is, in the direction of the suction end 411 by the position adjusting units 131 and 132, whereby the mounting mask 200 is also converted into an inclined state.

  The solder balls 250 supplied to the mounting mask 200 in the tilted state as described above are filled in the openings 210 while moving along the upper surface of the mounting mask 200 tilted by its own weight (gravity). The solder balls 250 gather around the suction end 411 and are sucked into the suction end 411.

  As described above, the process of sucking and discharging the solder balls 250 using the solder ball circulator 400 is repeatedly performed until the solder balls 250 are all attached to the openings 210 of the mounting mask 200.

  Here, whether or not the solder balls 250 are all attached to the opening 210 of the mounting mask 200 is determined based on one side of the solder ball circulator 400, for example, the transfer path 433 corresponding to the mounting mask 200. The control unit 500 can analyze and determine the image information detected by the imaging unit 600 provided on the lower surface.

  The control unit 500 analyzes the image information for the mounting mask 200 received from the imaging unit 600 in this way, and if the solder ball 250 is not completely attached to the opening 210 of the mounting mask 200, the solder ball The process of sucking and discharging the solder balls 250 using the circulator 400 can be repeated.

  On the other hand, if the solder balls 250 are all attached to the openings 210 of the mounting mask 200, the controller 500 attaches all the solder balls 250 to the openings 210 of the mounting mask 200 via the display unit 700. Can be shown.

  Thereafter, the controller 500 performs a reflow process on the solder balls 250 attached to the openings 210 of the mounting mask 200 to mount the solder balls 250 on the printed circuit board 300.

  The solder ball mounting system according to an embodiment of the present invention thus configured is a printed circuit board using the solder ball circulator 400 that sucks and discharges the solder balls 250 in a forced circulation manner without damaging the solder balls 250. 300 can be easily mounted.

  Hereinafter, a solder ball mounting method according to another embodiment of the present invention will be described with reference to FIGS. 3A to 3E.

  3A to 3E are process cross-sectional views for explaining a solder ball mounting method according to another embodiment of the present invention.

  A solder ball mounting method according to another embodiment of the present invention will be described with reference to an example in which a solder ball 250 is mounted on a printed circuit board 300 using the solder ball mounting system illustrated in FIG.

  First, a solder ball mounting method according to another embodiment of the present invention includes an SR pattern layer 320 that exposes upper surfaces of a plurality of pads 310 on a printed circuit board 300 illustrated in FIG. 3A and embeds other circuit patterns. Form.

  Specifically, in order to form a large number of pads 310 and other circuit patterns on the printed circuit board 300, a dry film pattern having openings corresponding to the pads 310 and other circuit patterns is formed on the upper surface of the printed circuit board 300. To form.

  Then, for example, CVD (chemical vapor deposition), PVD (Physical Vapor Deposition), subtractive method, additive method using electroless copper plating or electrolytic copper plating, SAP (chemical vapor deposition), SAP ( Copper can be filled by methods such as Semi-Additive Process (MSAP) and Modified Semi-Additive Process (MSAP).

  Thus, when the dry film pattern is filled with copper and the dry film pattern is peeled off, a large number of pads 310 and other circuit patterns are formed on the printed circuit board 300.

  A solder resist is applied to the printed circuit board 300 having a large number of pads 310 and other circuit patterns, and an upper surface of the pad 310 is formed by a patterning process including exposure and etching processes on the applied solder resist. An SR pattern layer 320 which is exposed and embeds other circuit patterns can be formed.

  After the SR pattern layer 320 is formed, as shown in FIG. 3A, a mounting mask 200 that exposes the upper surface of the pad 310 is provided on the upper surface of the SR pattern layer 320, and the upper surface of the table 100 and the mounting surface are mounted. A printed circuit board 300 is interposed between the lower surface of the mask 200 and mounted.

  With the printed circuit board 300 interposed between the table 100 and the mounting mask 200, the suction end 411 and the discharge end are respectively provided on both sides of the upper surface of the mounting mask 200 as shown in FIG. 3B. The solder ball circulator 400 is mounted on the top of the mounting mask 200 so that 441 corresponds to each other.

  Thereafter, a large number of solder balls 250 are mounted on the printed circuit board 300 by a forced circulation method using the solder ball circulator 400.

  For example, a large number of solder balls 250 supplied around the suction end 411 together with the table 100 in a state where the solder ball circulator 400 is inclined at an acute angle in the right direction with respect to the horizontal plane, that is, in the direction of the suction end 411. The air is sucked at the suction end 411 and discharged from the discharge end 441 through the suction path 410, the transfer path 433, and the discharge path 440.

  A large number of solder balls 250 discharged from the discharge end 441 fill the opening 210 of the mounting mask 200 while moving along the upper surface of the mounting mask 200.

  At this time, surplus solder balls 250 remaining without being filled in the opening 210 of the mounting mask 200 are again sucked by the suction end 411 under the control of the control unit 500, and the suction path 410, the transfer path 433, and the discharge path 440. Then, the ink is discharged again via the discharge end 441.

  Here, whether or not the solder ball 250 is completely filled in the opening 210 of the mounting mask 200 is determined based on one side of the solder ball circulator 400, for example, below the transfer path 433 corresponding to the mounting mask 200. The control unit 500 can analyze and determine image information detected by the imaging unit 600 provided on the surface.

  Therefore, when the control unit 500 analyzes the image information received from the imaging unit 600 with respect to the mounting mask 200 and the solder balls 250 are not completely attached to the openings 210 of the mounting mask 200, the solder ball circulator The process of sucking and discharging the solder balls 250 using 400 can be repeated.

  After all the solder balls 250 are filled in the openings 210 of the mounting mask 200, a reflow process is performed on the solder balls 250 filled in the openings 210 of the mounting mask 200 as shown in FIG. 3C. .

  As a result, the solder balls 250 filled in the openings 210 are melted, accumulated in the pads 310, and bonded to the solder ball patterns 251.

  Thereafter, the mounting mask 200 is removed, and a structure having the same height t from the upper surface of the printed circuit board 300 to the solder ball pattern 251 is formed as shown in FIG. 3D.

  Next, as illustrated in FIG. 3E, the chip 20 is mounted on the solder ball pattern 251 having the same height t from the upper surface of the printed circuit board 300 using the solder 21.

  Accordingly, a large number of solders 21 covering the solder ball patterns 251 are provided between the pads 310 on the printed circuit board 300 and the chips 20 and are electrically connected.

  As described above, the solder ball mounting method according to another embodiment of the present invention does not perform conventional squeezing, and does not damage a large number of solder balls 250 by a forced circulation method using the solder ball circulator 400. It can be easily mounted on the substrate 300.

  Therefore, in the solder ball mounting method according to another embodiment of the present invention, the chip 20 is mounted at the same height using the solder ball 250 mounted on the printed circuit board 300 without damage, and the reliability of the chip package is improved. Can be made.

  As described above, the present invention has been described in detail based on the specific embodiments. However, the present invention is only for explaining the present invention, and the present invention is not limited thereto. It will be apparent to those skilled in the art that modifications and improvements within the technical idea of the present invention are possible.

  All simple variations and modifications of the present invention belong to the scope of the present invention, and the specific scope of protection of the present invention will be apparent from the appended claims.

  The present invention is applicable to a solder ball mounting apparatus, a solder ball mounting system including the same, and a solder ball mounting method using the same.

20 chip 21 solder 100 table 110 tilt axis 131, 132 position adjusting unit 200 mounting mask 210 opening 250 solder ball 251 solder ball pattern 300 printed circuit board 310 pad 320 SR pattern layer 400 solder ball circulator 410 suction path 411 suction end 420 first suction port 421 first prevention member 430 second suction port 431 second prevention member 433 transfer path 440 discharge path 441 discharge end 500 control unit 600 imaging unit 700 display unit

Claims (17)

A table that is attached to the upper surface of the printed circuit board and converted into a predetermined inclination angle;
An opening mask corresponding to each pad of the printed circuit board, and a mounting mask mounted on the table so as to overlap the printed circuit board;
The mounting mask engages with both side end portions and is mounted on the upper portion of the table. A large number of solder balls are sucked into one end portion of the mounting mask and discharged to the other end portion of the mounting mask. Solder ball circulator
Solder ball mounting device including. The solder ball circulator is
A first suction port connected to a suction end for sucking the solder ball through a suction path and connected to an air suction pump;
A first prevention member provided at a front end portion of the first suction port and for sorting the solder balls;
A transfer path in which one side is connected to a first suction port portion provided with the first prevention member, and a solder ball selected by the first prevention member is transferred;
A second suction port disposed on the other side of the transfer path and connected to the air suction pump;
A second prevention member provided at a front end portion of the second suction port for sorting the solder balls;
A discharge path having one side connected to a second suction port portion provided with the second prevention member and having a discharge end on the other side from which the solder balls selected by the second prevention member are discharged;
The solder ball mounting apparatus according to claim 1, comprising:   The solder ball mounting apparatus according to claim 1, further comprising a position adjusting unit that abuts on one lower side of the table and tilts the table leftward or rightward.   The solder ball mounting apparatus according to claim 2, wherein the table is provided in a state inclined at an acute angle in the suction end direction.   The solder ball mounting apparatus according to claim 2, wherein the first prevention member and the second prevention member include a net formed of a metal or a plastic material.   The solder ball mounting apparatus according to claim 3, wherein the position adjusting unit is displaced in a vertical axis direction using a cylinder or a motor. A solder ball mounting device that sucks and discharges solder balls by a forced circulation method and mounts them on a printed circuit board;
A control unit coupled to the solder ball mounting device;
An imaging unit that is provided on one side of the solder ball mounting apparatus and that transmits an imaging image to the control unit;
A display unit connected to the control unit ,
The solder ball mounting apparatus includes:
A table that is mounted on the upper surface of the printed circuit board and converted into a predetermined inclination angle by the control of the control unit;
An opening mask corresponding to each pad of the printed circuit board, and a mounting mask mounted on the table so as to overlap the printed circuit board;
The mounting mask is mounted on the upper portion of the table by engaging with both side end portions, and a plurality of solder balls are sucked into one end portion of the mounting mask under the control of the control portion. A solder ball circulator for discharging to the other end,
Including solder ball mounting system.   The solder ball mounting system according to claim 7, further comprising a position adjusting unit that abuts on one lower side of the table and tilts the table leftward or rightward. The solder ball circulator is
A first suction port connected to a suction end for sucking the solder ball through a suction path and connected to an air suction pump;
A first prevention member provided at a front end portion of the first suction port and for sorting the solder balls;
A transfer path in which one side is connected to a first suction port portion provided with the first prevention member, and a solder ball selected by the first prevention member is transferred;
A second suction port disposed on the other side of the transfer path and connected to the air suction pump;
A second prevention member provided at a front end portion of the second suction port for sorting the solder balls;
A discharge path having one side connected to a second suction port portion provided with the second prevention member and having a discharge end on the other side from which the solder balls selected by the second prevention member are discharged;
The solder ball mounting system according to claim 7 , comprising: The solder ball mounting system according to claim 7 , wherein the table is provided in a state inclined at an acute angle toward the suction end. The solder ball mounting system according to claim 8 , wherein the position adjusting unit is displaced in a vertical axis direction using a cylinder or a motor. The solder ball mounting system according to claim 9 , wherein the first prevention member and the second prevention member include a net formed of a metal or a plastic material. The solder ball mounting system according to claim 9 , wherein the imaging unit is provided on one side of a lower surface outside the transfer path corresponding to the mounting mask. (A) preparing a printed circuit board for mounting solder balls;
(B) mounting the printed circuit board between a table of a solder ball mounting apparatus and a mounting mask;
(C) a step of forcibly supplying a large number of the solder balls to the mounting mask using a solder ball circulator of the solder ball mounting apparatus under the control of the control unit;
(D) The control unit determines whether each of the solder balls has been attached to the opening of the mounting mask; and
(E) according to the determination result, the control unit forcibly circulates the solder balls remaining in the mounting mask using the solder ball circulator, and re-supplys the mounting masks;
(F) performing a reflow process on the solder balls filled in the openings of the mounting mask ,
In step (B),
The suction end of the solder ball circulator is engaged with one end of the upper portion of the mounting mask, and the discharge end of the solder ball circulator is engaged with the other end of the upper portion of the mounting mask. In preparation for
In step (C),
A solder ball mounting method comprising the table in a state inclined at an acute angle toward the suction end by the control of the control unit . In step (A),
(A-1) forming a dry film pattern having openings corresponding to pads and other circuit patterns on a substrate;
(A-2) filling the dry film pattern with copper;
(A-3) peeling the dry film pattern;
(A-4) forming an SR (Solder Resist) pattern that wraps each of the pads and embeds the other circuit pattern;
Solder ball mounting method according to claim 1 4, including a. In step (C),
Transported by suction the solder balls in one end of the mounting masked by air inhalation, to claim 1 4 for discharging the transfer solder balls on the other side end portion of the mounting masked by air discharge The solder ball mounting method described. In step (D),
Analyzing the image information of the mounting mask received from the imaging unit provided on one side of the control unit the solder balls circulator, to claims 1 to 4, wherein the solder balls determines whether the completed attached The solder ball mounting method described.

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