KR20140023075A - Solder ball mounting apparatus, solder ball mounting system and method for mounting solder ball using the same - Google Patents

Abstract

A solder ball mounting device according to the present invention includes a table having a printed circuit board on the upper surface and converted at a predetermined inclination angle; a surface-mounted mask mounted on the table to be overlapped on the printed circuit board and including an opening corresponding to each pad of the printed circuit board; and a solder ball circulating device mounted on the upper part of the table by being interlocked with both ends of the surface-mounted mask and discharging a plurality of solder balls to one end of the surface-mounted mask by sucking the solder balls on the other end. [Reference numerals] (500) Control unit; (700) Display unit

Description

Solder ball mounting apparatus, solder ball mounting system including the same and solder ball mounting method using the same {Solder ball mounting apparatus, solder ball mounting system and method for mounting solder ball using the same}

The present invention relates to a solder ball mounting apparatus, a solder ball mounting system including the same, and a solder ball mounting method using the same.

Background Art Conventionally, applications of a flip chip method of forming solder bumps on a printed circuit board (PCB) and mounting a device thereon are gradually increasing.

In particular, in the case of a CPU and graphics computing device that computes large amounts of data at high speed, a board and a device are connected by solder bumps using a Au wire. There is a rapid increase in the transition to the flip chip method with improved connection resistance.

These solder bumps are formed by printing and reflowing solder paste onto a substrate, by forming microscopic solder balls on a substrate, and by directly or masking molten solder onto the substrate. It can be classified into a method of injecting and forming using. The solder bumps formed on the substrate are melted to be connected to the Cu pads or solder bumps formed on the chip to bond between the metals.

A method of forming such a solder bump is as described in Korean Patent Laid-Open Publication No. 2008-0014143 (published on February 13, 2008), and after forming openings having the same size in a mask, the solder balls are squeeged. By squeezing, ball holes are mounted through the mask opening to the input / output pads of the substrate, or in the jig, vacuum holes are formed in the same manner as the substrate pattern, and the solder balls are picked up by vacuum. An example is a method of mounting on a substrate by picking up.

In the case of the pick-up method, in the process of first forming the vacuum holes of the jig by mechanical processing and chemically etching, as the number of solder balls increases and the pitch between the balls decreases, the processing ratio of the vacuum holes increases rapidly. In addition, there is a size constraint when forming the vacuum hole of the jig, and the ball may not be picked up sufficiently by the vacuum, causing the ball to fall off the jig and cause defects.

In addition, when picking up and mounting solder balls, when the jig is contaminated by flux applied to the substrate, unwanted solder balls are picked up on the jig part contaminated with the flux and are mounted on the substrate. It also causes.

On the other hand, in the case of the ball placing method, the solder ball is pressed by the squeegee during the process of mounting the solder ball by squeezing the solder ball into the mask and squeeging it, or blocking the hole of the mask, or during squeegeeing. Solder balls may hit each other, breaking the surface, causing rapid oxidation.

Therefore, this defect causes solder balls to fail to metal bond with the input / output pads of the substrate during the reflow process.

An aspect of the present invention is to provide a solder ball mounting apparatus capable of mounting a solder ball in a forced circulation method without a squeeze to solve the above problems.

Another aspect of the present invention is to provide a solder ball mounting system capable of mounting a solder ball in a forced circulation method without a squeeze to solve the above problems.

Another aspect of the present invention is to provide a solder ball mounting method using a solder ball mounting apparatus capable of mounting the solder ball in a forced circulation method without a squeeze to solve the above problems.

Solder ball mounting apparatus according to an embodiment of the present invention comprises a table for mounting a printed circuit board on the upper surface and converted to a predetermined tilt angle; A mounting mask having an opening corresponding to each pad of the printed circuit board, the mounting mask being superimposed on the table on the printed circuit board; And a solder ball circulator engaged with both ends of the mounting mask and mounted on an upper portion of the table, and sucking a plurality of solder balls from one end of the mounting mask and discharging the solder balls to the other end of the mounting mask. .

In the solder ball mounting apparatus according to an embodiment of the present invention, the solder ball circulator may include a first suction port connected to a suction end for sucking the solder ball through a suction path and connected to an air suction pump; A first prevention member provided at a front end portion of the first suction port to filter the solder ball; A transfer path having one side connected to the first suction port part provided with the first prevention member, and the solder ball filtered by the first prevention member; A second suction port connected to the air suction pump on the other side of the transfer path; A second prevention member provided at a front end of the second suction port to filter the solder ball; And a discharge path having one side connected to a second suction port part having the second prevention member and having a discharge end at the other side discharged from the solder balls filtered by the second prevention member.

Solder ball mounting apparatus according to an embodiment of the present invention further includes a position adjusting unit for abutting the lower side of the table to generate an inclination in the left and right directions.

In the solder ball mounting apparatus according to an embodiment of the present invention, the table is provided in a state inclined toward the suction end with an inclination of an acute angle.

In the solder ball mounting apparatus according to an embodiment of the present invention, the first and second prevention members include a net formed of a metal or plastic material.

In the solder ball mounting apparatus according to the embodiment of the present invention, the position adjusting unit is displaced in the up and down axial direction by using a cylinder or a motor.

In addition, the solder ball mounting system according to another embodiment of the present invention is a solder ball mounting device that can be mounted on a printed circuit board by suction and discharge the solder ball in a forced circulation method; A control unit connected to the solder ball mounting apparatus; An imaging unit provided at one side of the solder ball mounting apparatus to transfer a captured image to the controller; And a display unit connected to the control unit.

In the solder ball mounting system according to another embodiment of the present invention, the solder ball mounting apparatus includes a table mounted on the upper surface of the printed circuit board and converted to a predetermined inclination angle under the control of the controller; A mounting mask having an opening corresponding to each pad of the printed circuit board, the mounting mask being superimposed on the table on the printed circuit board; And a solder that is engaged with both ends of the mounting mask and is mounted on the upper portion of the table, and sucks a plurality of solder balls from one end of the mounting mask under the control of the controller and discharges the solder balls to the other end of the mounting mask. Ball circulator.

Solder ball mounting system according to another embodiment of the present invention further includes a position adjusting unit for abutting the lower side of the table to create a slope in the left and right directions.

In the solder ball mounting system according to another embodiment of the present invention, the solder ball circulator may include a first suction port connected to an intake end for sucking the solder ball through a suction path and connected to an air suction pump; A first prevention member provided at a front end portion of the first suction port to filter the solder ball; A transfer path having one side connected to the first suction port part provided with the first prevention member, and the solder ball filtered by the first prevention member; A second suction port connected to the air suction pump on the other side of the transfer path; A second prevention member provided at a front end of the second suction port to filter the solder ball; And a discharge path having one side connected to a second suction port part having the second prevention member and having a discharge end at the other side discharged from the solder balls filtered by the second prevention member.

In the solder ball mounting system according to another embodiment of the present invention, the table is provided in a state inclined toward the suction end with an inclination of an acute angle.

In the solder ball mounting system according to another embodiment of the present invention, the position adjusting portion is displaced in the up and down axial direction by using a cylinder or a motor.

In the solder ball mounting system according to another embodiment of the present invention, the imaging unit is provided on one side of the outer lower surface of the transfer path in correspondence with the mounting mask.

In addition, the solder ball mounting method according to another embodiment of the present invention includes the steps of (A) preparing a printed circuit board on which the solder ball is to be mounted; (B) mounting the printed circuit board between the table of the solder ball mounting apparatus and the mounting mask; (C) forcibly circulating and supplying a plurality of the solder balls to the mounting mask using the solder ball circulator of the solder ball mounting apparatus under control of a controller; (D) the control unit determining whether each of the solder balls is completely mounted in the opening of the mounting mask; (E) according to the determination result, the control unit using the solder ball circulator forcibly recirculating the solder ball remaining in the mounting mask to re-supply to the mounting mask; And (F) reflowing the solder balls filled in the openings of the mounting mask.

In the solder ball mounting method according to another embodiment of the present invention, the step (A) may include forming a dry film pattern on the substrate having an opening corresponding to a circuit pattern different from the pad (A-1); (A-2) filling copper into the dry film pattern; (A-3) peeling off the dry film pattern; And (A-4) forming an SR (Solder Resist) pattern surrounding each of the pads and filling the other circuit pattern.

In the solder ball mounting method according to another embodiment of the present invention, the step (B) is such that the suction end of the solder ball circulator is engaged with an upper end of the mounting mask, and the discharge end of the solder ball circulator is mounted. It is provided to engage with the other end of the upper portion of the mask.

In the solder ball mounting method according to another embodiment of the present invention, the step (C) is performed by suctioning the solder ball from one end of the mounting mask by air suction, and transferring the other side of the mounting mask by air discharge. At the end, the transferred solder balls are discharged.

In the solder ball mounting method according to another embodiment of the present invention, the step (C) includes the table in a state inclined in the direction of the suction end at an acute angle under the control of the controller.

In the solder ball mounting method according to another embodiment of the present invention, the step (D) is performed by the controller analyzing the image information of the mounting mask received from the scratches provided on one side of the solder ball circulator, Determine whether the ball is complete.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to this, terms and words used in the present specification and claims should not be construed in a conventional, dictionary sense, and should not be construed as defining the concept of a term appropriately in order to describe the inventor in his or her best way. It should be construed in accordance with the meaning and concept consistent with the technical idea of the present invention.

The solder ball mounting system according to the present invention has an effect of easily mounting a plurality of solder balls on a printed circuit board without damage by using a solder ball circulator that sucks and discharges a plurality of solder balls in a forced circulation method.

The solder ball mounting method according to the present invention has an effect of easily mounting a plurality of solder balls on a printed circuit board without damage by a forced circulation method using a solder ball circulator without a squeeze.

1 is a block diagram showing a system including a solder ball mounting apparatus according to an embodiment of the present invention.
2 is a cross-sectional view of a solder ball mounting apparatus according to an embodiment of the present invention.
3A to 3E are cross-sectional views for describing a solder ball mounting method according to another embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The objects, particular advantages and novel features of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. It should be noted that, in the present specification, the reference numerals are added to the constituent elements of the drawings, and the same constituent elements are assigned the same number as much as possible even if they are displayed on different drawings. Also, the terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. 1 is a block diagram showing a system including a solder ball mounting apparatus according to an embodiment of the present invention, Figure 2 is a cross-sectional view of a solder ball mounting apparatus according to an embodiment of the present invention.

As shown in FIG. 1, the solder ball mounting system according to an exemplary embodiment of the present invention may include a solder ball mounting apparatus 400 and a solder ball mounting apparatus 400 capable of mounting the solder balls 250 in a forced circulation method. A control unit 500 connected to the control unit, an image capture unit 600 provided on one side of the solder ball mounting apparatus 400 to transfer the captured image to the control unit 500, and a display unit 700 connected to the control unit 200. .

The solder ball mounting apparatus is a device for mounting solder balls on a printed circuit board 300 by a forced circulation method, and includes a table 100 and a table mounted on the upper surface of the printed circuit board 300 and converted to a predetermined inclination angle. A position adjusting unit (131, 132) which abuts on both sides of the table (100) to generate an inclination in the left and right directions of the table (100), and respective openings (210) corresponding to each pad of the printed circuit board (300). The mounting mask 200 superimposed on the table 100 on the 300, and the upper side of the table 100 is engaged with both ends of the mounting mask 200, and a plurality of solders are mounted on the mounting mask 200. And a solder ball circulator 400 that sucks and discharges the balls.

Table 100 is a member for mounting and supporting the printed circuit board 300 on the upper surface, while the mounting mask 200 is superimposed and mounted using a coupling means such as a clamp, the table 100 and the mounting mask 200 The printed circuit board 300 may be fixedly interposed therebetween.

The table 100 has an inclination shaft 110 at the center thereof, and is inclined in the left and right directions by the position adjusting units 131 and 132 operated by the control of the controller 400.

The position adjusting units 131 and 132 may be provided to contact both sides of the table 100 using, for example, a cylinder or an electric motor, and may be moved up and down along the axial direction under the control of the controller 400. Accordingly, the table 100 is converted into an inclined form having an acute angle in the left and right directions.

The mounting mask 200 may be formed by using one or a mixture of metals, synthetic resins, and dry films, and the like, and in particular, may be formed by coating a dry film on a metal plate. The mounting mask 200 includes a plurality of openings 210 corresponding to each pad of the printed circuit board 300.

The solder ball circulator 400 is connected to an external air intake pump or an air discharge pump on at least one side of the solder ball circulator 400 so as to be engaged with the upper surface of the mounting mask 200 in a form having a curved cross section as a whole. It is provided.

The solder ball circulator 400 sucks the solder ball 250 remaining on one side of the mounting mask 200 by air suction force under the control of the controller 500, and sucks the solder ball 250 by air discharge. The solder ball 250 may be mounted on the opening 210 of the mounting mask 200 by transferring to the other side of the mounting mask 200.

Specifically, the solder ball circulator 400 includes a first suction port 420 and a second suction port 430 connected to the air suction pump as shown in FIG. 2, and a transfer path 433 having one side connected to the air discharge pump. ) And a discharge path 440.

The first prevention member 421 which prevents the solder ball 250 from entering the first suction port 420 and the second suction port 430 at the front end of the first suction port 420 and the second suction port 430, respectively. And a second prevention member 431. Here, the first prevention member 421 and the second prevention member 431 may be provided with a mesh net formed of a metal or plastic material, and filter the solder ball 250 to transfer the path 433 and the discharge path. (440).

In addition, the solder ball circulator 400 includes a suction path 410 connected to the first suction port 420 and a suction end 411 mounted to one side of the mounting mask 200 as an end of the suction path 410. The plurality of solder balls 250 on the mounting mask 200 are sucked through the suction end 411 by the first suction port 420.

The plurality of sucked solder balls 250 are filtered by the first prevention member 421 and transferred to the transfer path 433, and one side of the suction force or the transfer path 433 of the air suction pump connected to the second suction port 430. The air is discharged from the air discharge pump connected to the second prevention member 431 to be filtered again.

Thereafter, the solder balls 250 filtered by the second prevention member 431 are sent to the discharge path 440 and through the discharge end 441 by the air discharge of the air discharge pump connected to one side of the discharge path 440. The upper surface of the mounting mask 200 may be supplied again.

At this time, the table 100 is converted to the inclined state by the position adjusting units 131 and 132 in the right direction, that is, the suction end 411, and thus the mounting mask 200 is also converted into the inclined state.

The solder balls 250 supplied to the mounting mask 200 in the inclined state are respectively filled in the openings 210 while moving along the upper surface of the mounting mask 200 inclined by the gravity. The excess solder ball 250 is collected near the suction end 411 and sucked into the suction end 411.

The suction and discharge processes of the solder ball 250 using the solder ball circulator 400 are repeatedly performed until the solder balls 250 are all mounted in the openings 210 of the mounting mask 200. .

Here, whether or not the solder balls 250 are all mounted in the openings 210 of the mounting mask 200 is transferred to one side of the solder ball circulator 400, for example, the mounting mask 200. The controller 500 may analyze and determine image information detected by the imaging unit 600 provided on the lower surface of the furnace 433.

The control unit 500 analyzes the image information of the mounting mask 200 received from the imaging unit 600, so that the solder balls 250 are not all mounted in the openings 210 of the mounting mask 200. If the back, the suction and discharge process of the solder ball 250 using the solder ball circulator 400 may be repeated.

On the other hand, when the solder balls 250 are all mounted in the openings 210 of the mounting mask 200, the controller 500 may allow the solder balls 250 to mount the mounting mask 200 through the display unit 700. It can be displayed that the state is all mounted in the opening 210 of the).

Subsequently, the controller 500 performs a reflow process on the solder balls 250 mounted on the openings 210 of the mounting mask 200, so that the solder balls 250 are printed on the printed circuit board 300. Mount on

Solder ball mounting system according to an embodiment of the present invention configured as described above is a printed circuit board without damaging the solder ball 250 by using a solder ball circulator 400 for suctioning and discharging the solder ball 250 in a forced circulation method It can be mounted in the 300 easily.

Hereinafter, a solder ball mounting method according to another embodiment of the present invention will be described with reference to FIGS. 3A to 3E. 3A to 3E are cross-sectional views illustrating a solder ball mounting method according to another embodiment of the present invention.

The solder ball mounting method according to another embodiment of the present invention will be described using the solder ball 250 mounted on the printed circuit board 300 by using the solder ball mounting system shown in FIG.

First, the solder ball mounting method according to another embodiment of the present invention exposes the SR pattern layer 320 that exposes a plurality of pads 310 upper surfaces and embeds other circuit patterns on the substrate 300 shown in FIG. 3A. Form.

Specifically, in order to form a circuit pattern different from the plurality of pads 310 on the substrate 300, a dry film pattern having an opening corresponding to the circuit pattern different from the pad 310 is formed on the upper surface of the substrate 300. Form.

Then, for example, the additive method using the chemical vapor deposition (CVD), the physical vapor deposition (PVD), the subtractive method, the electroless copper plating or the electrolytic copper plating on the dry film pattern, and the SAP ( Copper may be filled by methods such as semi-additive process (MSD) and modified semi-additive process (MSAP).

When the dry film pattern is filled with copper and the dry film pattern is peeled off, a plurality of pads 310 and other circuit patterns are formed on the substrate 300.

Solder resist is applied to the substrate 300 having a plurality of pads 310 and other circuit patterns, and the top surface of the pad 310 is exposed by a patterning process including an exposure and etching process on the applied solder resist. An SR pattern layer 320 may be formed to fill another circuit pattern.

After the SR pattern layer 320 is formed, a mounting mask 200 exposing the top surface of the pad 310 is provided on the top surface of the SR pattern layer 320 as shown in FIG. The printed circuit board 300 is interposed between the upper surface of the 100 and the lower surface of the mounting mask 200.

With the printed circuit board 300 interposed between the table 100 and the mounting mask 200, suction ends 411 on both sides of the upper surface of the mounting mask 200 as shown in FIG. 3B. The solder ball circulator 400 is mounted on the mounting mask 200 to correspond to each other.

Thereafter, a plurality of solder balls 250 are mounted on the printed circuit board 300 by a forced circulation method using the solder ball circulator 400.

For example, the plurality of solders supplied near the suction end 411 in a state in which the table 100 and the solder ball circulator 400 are inclined at a right angle with respect to the horizontal plane, that is, in the direction of the suction end 411. The ball 250 is sucked by the suction end 411 and discharged from the discharge end 441 via the suction path 410, the transfer path 433, and the discharge path 440.

The plurality of solder balls 250 discharged from the discharge end 441 are filled in the openings 210 of the mounting mask 200 while moving along the upper surface of the mounting mask 200.

At this time, the excess solder ball 250 which is not filled in the opening 210 of the mounting mask 200 is sucked again by the suction end 411 under the control of the controller 500, and the suction path 410, The liquid is discharged again through the discharge path 441 via the transfer path 433 and the discharge path 440.

Here, whether or not the solder ball 250 is filled in all the openings 210 of the mounting mask 200 may include a transfer path corresponding to one side of the solder ball circulator 400, for example, the mounting mask 200 ( The controller 500 may analyze and determine image information detected by the imaging unit 600 provided on the lower surface of the 433.

Therefore, the controller 500 analyzes the image information of the mounting mask 200 received from the imaging unit 600, so that the solder balls 250 are not all mounted in the openings 210 of the mounting mask 200. In this state, the suction and discharge of the solder ball 250 using the solder ball circulator 400 may be repeated.

After the solder balls 250 are all filled in the openings 210 of the mounting mask 200, the ripples with respect to the solder balls 250 filled in the openings 210 of the mounting mask 200 are shown in FIG. 3C. Perform a low process.

Accordingly, the solder ball 250 filled in the opening 210 is melted and accumulated in the pad 310 to be bonded to the solder ball pattern 251.

Thereafter, the mounting mask 200 is removed to form a structure having the same height t from the upper surface of the substrate 300 to the solder ball pattern 251, as shown in FIG. 3D.

3E, the chip 20 is mounted using the solder 21 on the solder ball pattern 251 having the same height t from the upper surface of the substrate 300.

Accordingly, a plurality of solders 21 covering the solder ball patterns 251 are provided between the pad 310 and the chip 20 on the substrate 300 to be electrically connected to each other.

As described above, the solder ball mounting method according to another embodiment of the present invention is a forced circulation method using the solder ball circulator 400 without a squeeze in the past, so that a plurality of solder balls 250 are easily damaged on the printed circuit board 300. Can be implemented.

Therefore, in the solder ball mounting method according to another embodiment of the present invention, the chip 20 is mounted at the same height using the solder ball 250 mounted on the printed circuit board 300 without damage, thereby improving reliability of the chip package. Can be improved.

Although the technical idea of the present invention has been specifically described according to the above preferred embodiments, it is to be noted that the above-described embodiments are intended to be illustrative and not restrictive.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention.

100: table 110: tilt axis
131,132: position adjusting unit 200: mounting mask
210: opening 250: solder ball
300: printed circuit board 310: pad
320: SR pattern layer 400: solder ball circulator
410: suction path 411: suction stage
420: first suction port 421: first prevention member
430: second suction port 431: second prevention member
433: transfer path 440: discharge path
441: discharge stage

Claims (20)

A table mounted on the upper surface of the printed circuit board and converted to a predetermined inclination angle;
A mounting mask having an opening corresponding to each pad of the printed circuit board, the mounting mask being superimposed on the table on the printed circuit board; And
A solder ball circulator engaged with both ends of the mounting mask and mounted on an upper portion of the table, and sucking a plurality of solder balls from one end of the mounting mask and discharging the solder balls to the other end of the mounting mask;
Solder ball mounting device comprising a.
The method according to claim 1,
The solder ball circulator
A first suction port connected to an suction end for sucking the solder ball through a suction path and connected to an air suction pump;
A first prevention member provided at a front end portion of the first suction port to filter the solder ball;
A transfer path having one side connected to the first suction port part provided with the first prevention member, and the solder ball filtered by the first prevention member;
A second suction port connected to the air suction pump on the other side of the transfer path;
A second prevention member provided at a front end of the second suction port to filter the solder ball; And
A discharge path having one side connected to a second suction port part having the second prevention member and having a discharge end at the other side to discharge the solder balls filtered by the second prevention member;
Solder ball mounting device comprising a.
The method according to claim 1,
The solder ball mounting apparatus further comprises a position adjusting unit for abutting the lower side of the table to generate an inclination in the left and right directions.
The method according to claim 2,
The table is provided with a solder ball mounting apparatus inclined in the direction of the suction end at an acute angle.
The method according to claim 2,
And the first and second prevention members comprise a net formed of a metal or plastic material.
The method according to claim 3,
Solder ball mounting apparatus for displacing the position adjustment portion in the axial direction up and down using a cylinder or a motor.
Solder ball mounting device that can be mounted on the printed circuit board by suction and discharge solder ball in a forced circulation method;
A control unit connected to the solder ball mounting apparatus;
An imaging unit provided at one side of the solder ball mounting apparatus to transfer a captured image to the controller; And
A display unit connected to the control unit;
Solder ball mounting system comprising a.
The method of claim 7,
The solder ball mounting device is
A table mounted on the upper surface of the printed circuit board and converted to a predetermined inclination angle under the control of the controller;
A mounting mask having an opening corresponding to each pad of the printed circuit board, the mounting mask being superimposed on the table on the printed circuit board; And
Solder balls are engaged with both ends of the mounting mask and mounted on an upper portion of the table, and the plurality of solder balls are sucked from one end of the mounting mask under the control of the controller and discharged to the other end of the mounting mask. cycle;
Solder ball mounting system comprising a.
The method of claim 7,
The solder ball mounting system further comprises a position adjusting unit for abutting the lower side of the table to create a slope in the left and right directions.
The method according to claim 8,
The solder ball circulator
A first suction port connected to an suction end for sucking the solder ball through a suction path and connected to an air suction pump;
A first prevention member provided at a front end portion of the first suction port to filter the solder ball;
A transfer path having one side connected to the first suction port part provided with the first prevention member, and the solder ball filtered by the first prevention member;
A second suction port connected to the air suction pump on the other side of the transfer path;
A second prevention member provided at a front end of the second suction port to filter the solder ball; And
A discharge path having one side connected to a second suction port part having the second prevention member and having a discharge end at the other side to discharge the solder balls filtered by the second prevention member;
Solder ball mounting system comprising a.
The method according to claim 8,
The table is provided with a solder ball mounting system inclined in the direction of the suction end at an acute angle.
The method of claim 9,
Solder ball mounting system for displacing the positioning portion in the axial direction up and down using a cylinder or a motor.
The method of claim 10,
And the first and second prevention members comprise a mesh formed of metal or plastic material.
The method of claim 10,
The image pickup unit is a solder ball mounting system provided on one side of the outer lower surface of the transfer path corresponding to the mounting mask.
(A) preparing a printed circuit board on which solder balls are to be mounted;
(B) mounting the printed circuit board between the table of the solder ball mounting apparatus and the mounting mask;
(C) forcibly circulating and supplying a plurality of the solder balls to the mounting mask using the solder ball circulator of the solder ball mounting apparatus under control of a controller;
(D) the control unit determining whether each of the solder balls is completely mounted in the opening of the mounting mask;
(E) according to the determination result, the control unit using the solder ball circulator forcibly recirculating the solder ball remaining in the mounting mask to re-supply to the mounting mask; And
(F) reflowing the solder balls filled in the openings of the mounting mask;
Solder ball mounting method comprising a.
16. The method of claim 15,
The step (A)
(A-1) forming a dry film pattern having an opening corresponding to a circuit pattern different from the pad on the substrate;
(A-2) filling copper into the dry film pattern;
(A-3) peeling off the dry film pattern; And
(A-4) forming a SR (Solder Resist) pattern surrounding each of the pads and filling the other circuit patterns;
Solder ball mounting method comprising a.
16. The method of claim 15,
The step (B)
And a suction end of the solder ball circulator is engaged with an upper end of the mounting mask, and a discharge end of the solder ball circulator is engaged with an upper end of the mounting mask.
16. The method of claim 15,
The step (C)
The solder ball mounting method of sucking and transferring the solder ball at one end of the mounting mask by air suction, and discharges the transferred solder ball to the other end of the mounting mask by air discharge.
18. The method of claim 17,
The step (C)
Solder ball mounting method comprising the table in a state inclined in the direction of the suction end at an acute angle under the control of the controller.
16. The method of claim 15,
The step (D)
And the control unit analyzes the image information of the mounting mask received from the scratches provided on one side of the solder ball circulator, and determines whether the solder ball is completely mounted.

Images