JP5078683B2 - プリント基板、及び表面実装デバイスの実装構造体 - Google Patents

プリント基板、及び表面実装デバイスの実装構造体 Download PDF

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Publication number
JP5078683B2
JP5078683B2 JP2008061638A JP2008061638A JP5078683B2 JP 5078683 B2 JP5078683 B2 JP 5078683B2 JP 2008061638 A JP2008061638 A JP 2008061638A JP 2008061638 A JP2008061638 A JP 2008061638A JP 5078683 B2 JP5078683 B2 JP 5078683B2
Authority
JP
Japan
Prior art keywords
mounting
via hole
printed circuit
circuit board
surface mount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008061638A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009218435A (ja
JP2009218435A5 (enExample
Inventor
正人 宇高
誠治 時井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2008061638A priority Critical patent/JP5078683B2/ja
Priority to US12/401,247 priority patent/US8218333B2/en
Publication of JP2009218435A publication Critical patent/JP2009218435A/ja
Publication of JP2009218435A5 publication Critical patent/JP2009218435A5/ja
Application granted granted Critical
Publication of JP5078683B2 publication Critical patent/JP5078683B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09572—Solder filled plated through-hole in the final product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
    • Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
    • Y10T29/49213—Metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2008061638A 2008-03-11 2008-03-11 プリント基板、及び表面実装デバイスの実装構造体 Expired - Fee Related JP5078683B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008061638A JP5078683B2 (ja) 2008-03-11 2008-03-11 プリント基板、及び表面実装デバイスの実装構造体
US12/401,247 US8218333B2 (en) 2008-03-11 2009-03-10 Printed circuit board and mounting structure for surface mounted device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008061638A JP5078683B2 (ja) 2008-03-11 2008-03-11 プリント基板、及び表面実装デバイスの実装構造体

Publications (3)

Publication Number Publication Date
JP2009218435A JP2009218435A (ja) 2009-09-24
JP2009218435A5 JP2009218435A5 (enExample) 2011-01-27
JP5078683B2 true JP5078683B2 (ja) 2012-11-21

Family

ID=41061774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008061638A Expired - Fee Related JP5078683B2 (ja) 2008-03-11 2008-03-11 プリント基板、及び表面実装デバイスの実装構造体

Country Status (2)

Country Link
US (1) US8218333B2 (enExample)
JP (1) JP5078683B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5229267B2 (ja) 2010-05-06 2013-07-03 株式会社デンソー 電子装置
WO2012101978A1 (ja) * 2011-01-25 2012-08-02 株式会社村田製作所 電子部品
KR20140067380A (ko) * 2012-11-26 2014-06-05 삼성전기주식회사 인쇄회로기판 및 그 제조방법
WO2014171890A1 (en) * 2013-04-15 2014-10-23 Heptagon Micro Optics Pte. Ltd. Accurate positioning and alignment of a component during processes such as reflow soldering
CN103633058A (zh) * 2013-12-12 2014-03-12 矽力杰半导体技术(杭州)有限公司 封装组件及其制造方法
KR102688571B1 (ko) 2019-06-20 2024-07-25 삼성전자주식회사 반도체 패키지

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0499394A (ja) 1990-08-17 1992-03-31 Cmk Corp 多層プリント配線板
JP2000174410A (ja) * 1998-12-08 2000-06-23 Denso Corp 電子部品の実装構造および電子部品の実装方法
US6653219B2 (en) * 2000-01-13 2003-11-25 Hitachi, Ltd. Method of manufacturing bump electrodes and a method of manufacturing a semiconductor device
KR100333627B1 (ko) * 2000-04-11 2002-04-22 구자홍 다층 인쇄회로기판 및 그 제조방법
JP2004055660A (ja) * 2002-07-17 2004-02-19 Shinko Electric Ind Co Ltd 配線基板及び半導体装置
KR100523745B1 (ko) * 2003-03-24 2005-10-25 주식회사 유니테스트 전자소자 검사용 마이크로 프로브 및 그 제조 방법
KR101049390B1 (ko) * 2005-12-16 2011-07-14 이비덴 가부시키가이샤 다층 프린트 배선판 및 그 제조 방법
US20080136004A1 (en) * 2006-12-08 2008-06-12 Advanced Chip Engineering Technology Inc. Multi-chip package structure and method of forming the same

Also Published As

Publication number Publication date
US8218333B2 (en) 2012-07-10
US20090229879A1 (en) 2009-09-17
JP2009218435A (ja) 2009-09-24

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