JP4889326B2 - 処理装置および蓋体の開閉機構 - Google Patents
処理装置および蓋体の開閉機構 Download PDFInfo
- Publication number
- JP4889326B2 JP4889326B2 JP2006067733A JP2006067733A JP4889326B2 JP 4889326 B2 JP4889326 B2 JP 4889326B2 JP 2006067733 A JP2006067733 A JP 2006067733A JP 2006067733 A JP2006067733 A JP 2006067733A JP 4889326 B2 JP4889326 B2 JP 4889326B2
- Authority
- JP
- Japan
- Prior art keywords
- lid
- adjustment
- processing
- processing container
- shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 239000007789 gas Substances 0.000 description 33
- 230000005540 biological transmission Effects 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 5
- 238000011282 treatment Methods 0.000 description 5
- 239000010453 quartz Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 230000000644 propagated effect Effects 0.000 description 3
- 229910017083 AlN Inorganic materials 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000005121 nitriding Methods 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910004541 SiN Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 150000002835 noble gases Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006067733A JP4889326B2 (ja) | 2006-03-13 | 2006-03-13 | 処理装置および蓋体の開閉機構 |
| KR1020070023916A KR100886030B1 (ko) | 2006-03-13 | 2007-03-12 | 처리 장치 및 덮개의 개폐 기구 |
| US11/684,717 US7707965B2 (en) | 2006-03-13 | 2007-03-12 | Processing apparatus and lid opening/closing mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006067733A JP4889326B2 (ja) | 2006-03-13 | 2006-03-13 | 処理装置および蓋体の開閉機構 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007250568A JP2007250568A (ja) | 2007-09-27 |
| JP2007250568A5 JP2007250568A5 (enExample) | 2009-02-12 |
| JP4889326B2 true JP4889326B2 (ja) | 2012-03-07 |
Family
ID=38575880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006067733A Expired - Fee Related JP4889326B2 (ja) | 2006-03-13 | 2006-03-13 | 処理装置および蓋体の開閉機構 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7707965B2 (enExample) |
| JP (1) | JP4889326B2 (enExample) |
| KR (1) | KR100886030B1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5196474B2 (ja) * | 2008-01-29 | 2013-05-15 | サムコ株式会社 | 薄膜製造装置 |
| BRPI0907579A2 (pt) * | 2008-02-18 | 2015-07-21 | Sharp Kk | Montagem de chassi, dispositivo de iluminação, dispositivo de exibição e aparelho receptor de televisão |
| JP5357486B2 (ja) | 2008-09-30 | 2013-12-04 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| CN102414794B (zh) * | 2009-04-21 | 2015-01-28 | 应用材料公司 | 改良膜厚度不均匀性与粒子表现的cvd设备 |
| KR101066033B1 (ko) * | 2009-07-28 | 2011-09-20 | 엘아이지에이디피 주식회사 | 화학기상 증착장치 및 기판 처리장치 |
| KR101136728B1 (ko) * | 2010-10-18 | 2012-04-20 | 주성엔지니어링(주) | 기판처리장치와 그의 분해 및 조립방법 |
| US8826857B2 (en) * | 2011-11-21 | 2014-09-09 | Lam Research Corporation | Plasma processing assemblies including hinge assemblies |
| US12106934B2 (en) | 2017-08-17 | 2024-10-01 | Beijing Naura Microelectronics Equipment Co., Ltd. | Liner, reaction chamber and semiconductor processing equipment |
| JP7360305B2 (ja) * | 2019-11-13 | 2023-10-12 | 株式会社日立ハイテク | 真空処理装置 |
| JP7350907B2 (ja) * | 2022-01-24 | 2023-09-26 | 株式会社Screenホールディングス | 処理チャンバおよび基板処理装置 |
| KR102747906B1 (ko) * | 2022-12-22 | 2024-12-31 | 주식회사 에스에프에이 | Oled 증착용 대형 마스크와 캐리어의 탈부착장치 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0369757A (ja) * | 1989-08-07 | 1991-03-26 | Mitsuo Kumabe | アンテナ取付部付屋根裏換気装置 |
| JP2970891B2 (ja) * | 1992-08-08 | 1999-11-02 | 東京エレクトロン株式会社 | プラズマ装置の真空チャンバー |
| TW295677B (enExample) * | 1994-08-19 | 1997-01-11 | Tokyo Electron Co Ltd | |
| JPH11101345A (ja) * | 1997-09-30 | 1999-04-13 | Tokyo Electron Ltd | 真空処理装置の開閉蓋ヒンジ機構 |
| JPH11354457A (ja) * | 1998-06-08 | 1999-12-24 | Kokusai Electric Co Ltd | 半導体基板処理装置 |
| WO2000045425A1 (en) * | 1999-02-01 | 2000-08-03 | Tokyo Electron Limited | Etching system and etching chamber |
| JP2004055614A (ja) * | 2002-07-16 | 2004-02-19 | Tokyo Electron Ltd | プラズマ処理装置 |
| JP2004293649A (ja) * | 2003-03-26 | 2004-10-21 | Ts Corporation | 蓋の開閉装置 |
| KR100544490B1 (ko) * | 2003-11-11 | 2006-01-23 | 주식회사 디엠에스 | 기판의 진공처리장치 |
| JP4550554B2 (ja) * | 2004-11-11 | 2010-09-22 | 株式会社日立ハイテクノロジーズ | 試料処理装置 |
-
2006
- 2006-03-13 JP JP2006067733A patent/JP4889326B2/ja not_active Expired - Fee Related
-
2007
- 2007-03-12 US US11/684,717 patent/US7707965B2/en not_active Expired - Fee Related
- 2007-03-12 KR KR1020070023916A patent/KR100886030B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US7707965B2 (en) | 2010-05-04 |
| KR20070093350A (ko) | 2007-09-18 |
| US20070238307A1 (en) | 2007-10-11 |
| KR100886030B1 (ko) | 2009-02-26 |
| JP2007250568A (ja) | 2007-09-27 |
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