JP4871378B2 - 半導体発光素子アレイ装置、画像露光装置、画像形成装置、及び画像表示装置 - Google Patents

半導体発光素子アレイ装置、画像露光装置、画像形成装置、及び画像表示装置 Download PDF

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JP4871378B2
JP4871378B2 JP2009193065A JP2009193065A JP4871378B2 JP 4871378 B2 JP4871378 B2 JP 4871378B2 JP 2009193065 A JP2009193065 A JP 2009193065A JP 2009193065 A JP2009193065 A JP 2009193065A JP 4871378 B2 JP4871378 B2 JP 4871378B2
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emitting element
semiconductor light
light emitting
substrate
thin film
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JP2011044643A5 (cg-RX-API-DMAC7.html
JP2011044643A (ja
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貴人 鈴木
光彦 荻原
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株式会社沖データ
株式会社沖デジタルイメージング
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Priority to US12/805,618 priority patent/US20110042689A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2009193065A 2009-08-24 2009-08-24 半導体発光素子アレイ装置、画像露光装置、画像形成装置、及び画像表示装置 Active JP4871378B2 (ja)

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Application Number Priority Date Filing Date Title
JP2009193065A JP4871378B2 (ja) 2009-08-24 2009-08-24 半導体発光素子アレイ装置、画像露光装置、画像形成装置、及び画像表示装置
US12/805,618 US20110042689A1 (en) 2009-08-24 2010-08-10 Semiconductor light-emitting element array device, image exposing device, image forming apparatus, and image display apparatus

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Application Number Priority Date Filing Date Title
JP2009193065A JP4871378B2 (ja) 2009-08-24 2009-08-24 半導体発光素子アレイ装置、画像露光装置、画像形成装置、及び画像表示装置

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JP2011044643A JP2011044643A (ja) 2011-03-03
JP2011044643A5 JP2011044643A5 (cg-RX-API-DMAC7.html) 2011-06-16
JP4871378B2 true JP4871378B2 (ja) 2012-02-08

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JP (1) JP4871378B2 (cg-RX-API-DMAC7.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5584645B2 (ja) * 2011-03-31 2014-09-03 株式会社沖データ 半導体発光装置およびヘッドマウントディスプレイ装置
US9773945B2 (en) * 2015-01-30 2017-09-26 Osram Opto Semiconductors Gmbh Method for producing a semiconductor component and a semiconductor component
JP6289718B1 (ja) * 2017-01-02 2018-03-07 ルーメンス カンパニー リミテッド Ｌｅｄディスプレイ装置
CN107611243B (zh) * 2017-09-26 2024-03-26 利亚德光电股份有限公司 显示单元以及显示设备
US10593852B2 (en) * 2018-06-20 2020-03-17 Innolux Corporation Display device having a plurality of main pads, a plurality of redundant pads, and a light-emitting device
JP7469150B2 (ja) * 2020-06-18 2024-04-16 豊田合成株式会社 発光素子
JP2022079295A (ja) * 2020-11-16 2022-05-26 沖電気工業株式会社 複合集積フィルム、複合集積フィルム供給ウェハ及び半導体複合装置
CN115148887A (zh) * 2021-03-31 2022-10-04 中强光电股份有限公司 发光二极管线路基板及其制造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63237968A (ja) * 1987-03-26 1988-10-04 Nec Corp Ｌｅｄプリンタヘツド
JPH05235257A (ja) * 1992-02-21 1993-09-10 Hitachi Ltd 半導体装置及びその製造方法
US7408566B2 (en) * 2003-10-22 2008-08-05 Oki Data Corporation Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device
US7932111B2 (en) * 2005-02-23 2011-04-26 Cree, Inc. Substrate removal process for high light extraction LEDs
US20070069225A1 (en) * 2005-09-27 2007-03-29 Lumileds Lighting U.S., Llc III-V light emitting device
JP2008060222A (ja) * 2006-08-30 2008-03-13 Seiko Epson Corp 発光素子駆動装置およびその方法
JP4279304B2 (ja) * 2006-08-31 2009-06-17 株式会社沖データ 半導体装置、ｌｅｄプリントヘッドおよび画像形成装置
JP2008263126A (ja) * 2007-04-13 2008-10-30 Oki Data Corp 半導体装置、該半導体装置の製造方法、ｌｅｄヘッド、及び画像形成装置
WO2008142911A1 (en) * 2007-05-18 2008-11-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP2009147352A (ja) * 2009-01-19 2009-07-02 Oki Data Corp 半導体装置、ｌｅｄヘッド及び画像形成装置

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US20110042689A1 (en) 2011-02-24
JP2011044643A (ja) 2011-03-03

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