JP4855880B2 - アンテナ回路、アンテナ回路の製造方法、icインレット、icタグ - Google Patents
アンテナ回路、アンテナ回路の製造方法、icインレット、icタグ Download PDFInfo
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- JP4855880B2 JP4855880B2 JP2006255069A JP2006255069A JP4855880B2 JP 4855880 B2 JP4855880 B2 JP 4855880B2 JP 2006255069 A JP2006255069 A JP 2006255069A JP 2006255069 A JP2006255069 A JP 2006255069A JP 4855880 B2 JP4855880 B2 JP 4855880B2
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- Japan
- Prior art keywords
- connection portion
- antenna circuit
- external connection
- jumper
- conductor pattern
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Credit Cards Or The Like (AREA)
- Details Of Aerials (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Waveguide Connection Structure (AREA)
Description
〔6〕 〔5〕に記載のICインレットを有するICタグ。
図7は、ICインレット110の一例を示す平面図で、図1に示される前記アンテナ回路100の両対向電極16、18の間にICチップ22が実装されている。このICチップ22と両対向電極16、18とは、電気的に接続される。
図8は、第1の形態のICタグの一例を示す側面断面図である。図8において、130はいわゆるラベル状に形成され、管理するべき被着体に貼付して使用するICタグである。このICタグは、図7に示されるICインレット110の絶縁基材2及び前記絶縁基材2の一面2Aに形成された表面回路部及びICチップ22を覆って、接着剤層52が形成されている。更に接着剤層52の上面には剥離材54が剥離自在に貼着されている。
本発明のICタグは、更に、以下に述べる構成にすることができる。
実施例1に示すアンテナ回路を以下に記載する方法で製造した。
作製したアンテナ回路100にRFIDーICチップ(フィリップス社製、ICode)を実装した。実装はフリップチップ実装機(九州松下製、FB30T−M)を用いた。接着材料には、異方導電性接着剤(京セラケミカル社製、TAP0402E)を使用し、220℃、1.96N(200gf)、7秒の条件で熱圧着し、ICインレットを形成した。
両接続部4、8の凹部の開口面積を0.5mm2 とした以外は実施例1と同様にして、22枚のアンテナ回路100を作製した。実施例1と同様にして熱衝撃試験を行い、同試験の前後におけるジャンパの抵抗値変化を測定した。全てのアンテナ回路100のジャンパ部12の抵抗値の変化は誤差の範囲であり、実質的な抵抗値の変化は認められなかった。結果を表1に記載した。
また、実施例1と同様にして、ICインレット及びICタグを作製した。
両接続部4、8に凹部を形成しない以外は、実施例1と同様に操作して、アンテナ回路を作製した。実施例1と同様にして熱衝撃試験を行い、同試験の前後におけるジャンパの抵抗値変化を測定した。6枚(27%)のアンテナ回路のジャンパ部12の抵抗値は明らかに増加していた。残りの16枚のアンテナ回路の抵抗値は変化が認められなかった。結果を表1に記載した。抵抗値は平均値を示した。
2A 一面
4 外部接続部
6 平面コイル回路部
8 内部接続部
10 絶縁層
12 ジャンパ
14 一方のリード部
16 一方の対向電極
18 他方の対向電極
22 ICチップ
24、26 凹部
28 導電材料
d 深さ
D 接続部の厚さ
52 接着剤層
54 剥離材
78 表面保護層
92、94 表面基材
100 アンテナ回路
110、120 ICインレット
130、200、210 ICタグ
204 樹脂層
Claims (10)
- 絶縁基材表面に渦巻状に形成された導体パターンと、前記絶縁基材表面上で前記渦巻状の導体パターンの内側に形成され、前記導体パターンの一端と接続される内部接続部と、前記渦巻状の導体パターンの外側に形成される外部接続部と、前記内部接続部と前記外部接続部との間において前記導電パターンの上面を覆って形成される絶縁層と、前記絶縁層の上面を通り、前記内部接続部と前記外部接続部とを電気的に接続する導電材料からなるジャンパとを少なくとも備え、
前記内部接続部と前記外部接続部とは、その表面に1以上の凹部を有し、前記凹部の深さは10〜100μmであり、各凹部の開口面積は0.03〜5mm 2 であって、
前記導電材料は、前記内部接続部及び前記外部接続部の凹部内を満たすと共に前記各接続部に接着されて、前記ジャンパの一部として機能するアンテナ回路。 - 前記絶縁基材の一方の表面のみに、前記導体パターン、内部接続部、外部接続部、絶縁層、及びジャンパを配置した請求項1に記載のアンテナ回路。
- 前記凹部の開口形状が、円形、楕円形、三角形、四角形、又は任意の多角形である請求項1または請求項2に記載のアンテナ回路。
- 前記凹部の深さが10〜50μmである請求項1ないし3のいずれかに記載のアンテナ回路。
- 前記凹部の深さが10〜35μmである請求項1ないし4のいずれかに記載のアンテナ回路。
- 前記凹部の深さが、該凹部が形成される内部接続部または外部接続部の厚さに等しい請求項1ないし5のいずれかに記載のアンテナ回路。
- 前記凹部の形成数が、一の接続部あたり10個以内である請求項1ないし6のいずれかに記載のアンテナ回路。
- 導体金属を積層した絶縁基材表面にレジストパターンを印刷後、エッチングを行って、絶縁基材表面に内部接続部と外部接続部とを有するアンテナ回路を形成すると同時に、内部接続部と外部接続部との表面に凹部を形成する、請求項1ないし7のいずれかに記載のアンテナ回路の製造方法。
- 請求項1ないし7のいずれかに記載のアンテナ回路と、ICチップとを有するICインレット。
- 請求項9に記載のICインレットを有するICタグ。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006255069A JP4855880B2 (ja) | 2006-09-20 | 2006-09-20 | アンテナ回路、アンテナ回路の製造方法、icインレット、icタグ |
TW096133887A TWI492160B (zh) | 2006-09-20 | 2007-09-11 | 導體圖案的連接部及其連接構造 |
US11/857,660 US7616171B2 (en) | 2006-09-20 | 2007-09-19 | Connecting part of conductor pattern and conductor patterns-connected structure |
KR1020070095369A KR20080026515A (ko) | 2006-09-20 | 2007-09-19 | 도체패턴의 접속부 및 그 접속구조 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006255069A JP4855880B2 (ja) | 2006-09-20 | 2006-09-20 | アンテナ回路、アンテナ回路の製造方法、icインレット、icタグ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008078337A JP2008078337A (ja) | 2008-04-03 |
JP4855880B2 true JP4855880B2 (ja) | 2012-01-18 |
Family
ID=39188040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006255069A Active JP4855880B2 (ja) | 2006-09-20 | 2006-09-20 | アンテナ回路、アンテナ回路の製造方法、icインレット、icタグ |
Country Status (4)
Country | Link |
---|---|
US (1) | US7616171B2 (ja) |
JP (1) | JP4855880B2 (ja) |
KR (1) | KR20080026515A (ja) |
TW (1) | TWI492160B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2192530B1 (en) * | 2007-09-14 | 2013-03-27 | Toppan Printing Co., Ltd. | Antenna sheet, transponder and booklet |
KR102257892B1 (ko) * | 2014-11-26 | 2021-05-28 | 삼성전자주식회사 | 개선된 nfc 안테나 및 그 안테나를 갖는 전자 장치 |
JP6776868B2 (ja) * | 2016-12-15 | 2020-10-28 | Tdk株式会社 | 平面コイルの製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63301593A (ja) * | 1987-06-01 | 1988-12-08 | Furukawa Electric Co Ltd:The | クロスオ−バ−回路付プリント回路板 |
JPH02150091A (ja) * | 1988-11-30 | 1990-06-08 | Cmk Corp | プリント配線板 |
JPH09266364A (ja) * | 1996-03-28 | 1997-10-07 | Sumitomo Bakelite Co Ltd | プリント回路基板 |
JP2831970B2 (ja) * | 1996-04-12 | 1998-12-02 | 山一電機株式会社 | 回路基板における層間接続方法 |
US6353420B1 (en) * | 1999-04-28 | 2002-03-05 | Amerasia International Technology, Inc. | Wireless article including a plural-turn loop antenna |
US6421013B1 (en) * | 1999-10-04 | 2002-07-16 | Amerasia International Technology, Inc. | Tamper-resistant wireless article including an antenna |
US7268740B2 (en) * | 2000-03-13 | 2007-09-11 | Rcd Technology Inc. | Method for forming radio frequency antenna |
US6476775B1 (en) * | 2000-03-13 | 2002-11-05 | Rcd Technology Corporation | Method for forming radio frequency antenna |
JP4089555B2 (ja) | 2003-08-27 | 2008-05-28 | 株式会社デンソー | 回路基板の層厚測定方法 |
JP4599185B2 (ja) * | 2005-02-02 | 2010-12-15 | リンテック株式会社 | アンテナ回路、及び非接触型icインレットの周波数調整方法 |
TWM297501U (en) * | 2006-03-27 | 2006-09-11 | Taiwan Name Plate Co Ltd | Access control card with printing antenna |
-
2006
- 2006-09-20 JP JP2006255069A patent/JP4855880B2/ja active Active
-
2007
- 2007-09-11 TW TW096133887A patent/TWI492160B/zh active
- 2007-09-19 KR KR1020070095369A patent/KR20080026515A/ko not_active Application Discontinuation
- 2007-09-19 US US11/857,660 patent/US7616171B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TWI492160B (zh) | 2015-07-11 |
JP2008078337A (ja) | 2008-04-03 |
KR20080026515A (ko) | 2008-03-25 |
US7616171B2 (en) | 2009-11-10 |
TW200823763A (en) | 2008-06-01 |
US20080068272A1 (en) | 2008-03-20 |
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