JP4850905B2 - 巻取式真空蒸着装置 - Google Patents
巻取式真空蒸着装置 Download PDFInfo
- Publication number
- JP4850905B2 JP4850905B2 JP2008522381A JP2008522381A JP4850905B2 JP 4850905 B2 JP4850905 B2 JP 4850905B2 JP 2008522381 A JP2008522381 A JP 2008522381A JP 2008522381 A JP2008522381 A JP 2008522381A JP 4850905 B2 JP4850905 B2 JP 4850905B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- roller
- electron beam
- direct current
- filament
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5826—Treatment with charged particles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Description
11 真空チャンバ
12 フィルム
13 巻出しローラ
14 キャンローラ(冷却用ローラ)
15 巻取りローラ
16 蒸発源
18 補助ローラ
21 電子ビーム照射器
22 直流バイアス電源
23 除電ユニット
31 フィラメント
32 直流電源
33 引出し電源
36 整流素子
37,39 キャパシタ
38 ダイオードブリッジ
Claims (3)
- 真空チャンバと、この真空チャンバの内部に配置され絶縁性のフィルムを連続的に繰り出す巻出しローラと、この巻出しローラから繰り出されたフィルムを巻き取る巻取りローラと、前記巻出しローラと前記巻取りローラとの間に配置され前記フィルムと密着して当該フィルムを冷却する冷却用ローラと、前記冷却用ローラに対向配置され前記フィルムに蒸着材料を蒸着させる蒸発源と、前記巻出しローラと前記蒸発源との間に配置され、走行する前記フィルムに電子ビームを照射する電子ビーム照射器とを備えた巻取式真空蒸着装置において、
前記電子ビーム照射器は、通電加熱によって電子を放出するフィラメントと、前記フィラメントへ直流電流を供給する直流発生手段とを有する
ことを特徴とする巻取式真空蒸着装置。 - 前記直流発生手段は、直流電源である請求の範囲第1項に記載の巻取式真空蒸着装置。
- 前記直流発生手段は、交流電源と、整流素子を含む直流化回路とからなる請求の範囲第1項に記載の巻取式真空蒸着装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008522381A JP4850905B2 (ja) | 2006-06-23 | 2007-06-07 | 巻取式真空蒸着装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006173435 | 2006-06-23 | ||
JP2006173435 | 2006-06-23 | ||
PCT/JP2007/061509 WO2007148539A1 (ja) | 2006-06-23 | 2007-06-07 | 巻取式真空蒸着装置 |
JP2008522381A JP4850905B2 (ja) | 2006-06-23 | 2007-06-07 | 巻取式真空蒸着装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2007148539A1 JPWO2007148539A1 (ja) | 2009-11-19 |
JP4850905B2 true JP4850905B2 (ja) | 2012-01-11 |
Family
ID=38833281
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008522381A Active JP4850905B2 (ja) | 2006-06-23 | 2007-06-07 | 巻取式真空蒸着装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20100006030A1 (ja) |
EP (1) | EP2037001B1 (ja) |
JP (1) | JP4850905B2 (ja) |
KR (1) | KR101027495B1 (ja) |
CN (1) | CN101484608B (ja) |
TW (1) | TW200808987A (ja) |
WO (1) | WO2007148539A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109536885A (zh) * | 2018-12-27 | 2019-03-29 | 广州海鸥住宅工业股份有限公司 | 一种电子束蒸发镀钛的方法 |
CN112111707A (zh) * | 2019-06-21 | 2020-12-22 | 合肥欣奕华智能机器有限公司 | 一种蒸发源及卷对卷蒸镀装置 |
CN112725740B (zh) * | 2020-12-17 | 2023-06-06 | 浙江虹舞科技有限公司 | 线簇阵列蒸发源蒸镀装置及蒸镀方法 |
CN113684464B (zh) * | 2021-08-27 | 2023-06-02 | 辽宁分子流科技有限公司 | 一种用于石墨烯复合薄膜制备的卷绕式设备 |
CN113930727B (zh) * | 2021-09-18 | 2023-12-15 | 铜陵市超越电子有限公司 | 一种全方位翻边金属化薄膜的蒸镀装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5864381A (ja) * | 1981-10-09 | 1983-04-16 | Matsushita Electric Ind Co Ltd | 真空蒸着装置 |
JPS6252837A (ja) * | 1985-08-30 | 1987-03-07 | Sony Corp | 電子銃装置 |
JPH01219097A (ja) * | 1988-02-26 | 1989-09-01 | Shimadzu Corp | 薄膜製造装置 |
JPH02175871A (ja) * | 1988-12-27 | 1990-07-09 | Matsushita Electric Ind Co Ltd | 蒸着装置 |
JPH02247383A (ja) * | 1989-03-17 | 1990-10-03 | Matsushita Electric Ind Co Ltd | 薄膜の製造方法 |
JP2005146401A (ja) * | 2003-11-20 | 2005-06-09 | Ulvac Japan Ltd | 巻取式真空蒸着方法及び巻取式真空蒸着装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4936960A (en) * | 1989-01-03 | 1990-06-26 | Advanced Energy Industries, Inc. | Method and apparatus for recovery from low impedance condition during cathodic arc processes |
WO1996031899A1 (en) * | 1995-04-07 | 1996-10-10 | Advanced Energy Industries, Inc. | Adjustable energy quantum thin film plasma processing system |
KR19980033213A (ko) * | 1996-10-31 | 1998-07-25 | 조셉제이.스위니 | 스퍼터링 챔버내의 미립자 물질 발생 감소 방법 |
US6072163A (en) * | 1998-03-05 | 2000-06-06 | Fsi International Inc. | Combination bake/chill apparatus incorporating low thermal mass, thermally conductive bakeplate |
CN100562602C (zh) * | 2005-02-16 | 2009-11-25 | 株式会社爱发科 | 卷取式真空成膜装置 |
-
2007
- 2007-06-07 KR KR1020087030579A patent/KR101027495B1/ko active IP Right Grant
- 2007-06-07 JP JP2008522381A patent/JP4850905B2/ja active Active
- 2007-06-07 CN CN2007800235471A patent/CN101484608B/zh active Active
- 2007-06-07 EP EP07744842A patent/EP2037001B1/en active Active
- 2007-06-07 WO PCT/JP2007/061509 patent/WO2007148539A1/ja active Application Filing
- 2007-06-07 US US12/305,387 patent/US20100006030A1/en not_active Abandoned
- 2007-06-22 TW TW096122429A patent/TW200808987A/zh unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5864381A (ja) * | 1981-10-09 | 1983-04-16 | Matsushita Electric Ind Co Ltd | 真空蒸着装置 |
JPS6252837A (ja) * | 1985-08-30 | 1987-03-07 | Sony Corp | 電子銃装置 |
JPH01219097A (ja) * | 1988-02-26 | 1989-09-01 | Shimadzu Corp | 薄膜製造装置 |
JPH02175871A (ja) * | 1988-12-27 | 1990-07-09 | Matsushita Electric Ind Co Ltd | 蒸着装置 |
JPH02247383A (ja) * | 1989-03-17 | 1990-10-03 | Matsushita Electric Ind Co Ltd | 薄膜の製造方法 |
JP2005146401A (ja) * | 2003-11-20 | 2005-06-09 | Ulvac Japan Ltd | 巻取式真空蒸着方法及び巻取式真空蒸着装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2007148539A1 (ja) | 2007-12-27 |
KR101027495B1 (ko) | 2011-04-06 |
EP2037001A1 (en) | 2009-03-18 |
TW200808987A (en) | 2008-02-16 |
KR20090020617A (ko) | 2009-02-26 |
EP2037001A4 (en) | 2010-05-05 |
US20100006030A1 (en) | 2010-01-14 |
TWI351440B (ja) | 2011-11-01 |
CN101484608B (zh) | 2011-07-20 |
CN101484608A (zh) | 2009-07-15 |
JPWO2007148539A1 (ja) | 2009-11-19 |
EP2037001B1 (en) | 2011-09-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4516304B2 (ja) | 巻取式真空蒸着方法及び巻取式真空蒸着装置 | |
JP5059597B2 (ja) | 巻取式真空成膜装置 | |
JP6724967B2 (ja) | プラズマを使った前処理装置を有した蒸着装置 | |
JP3795518B2 (ja) | 巻取式真空蒸着装置及び巻取式真空蒸着方法 | |
JP4850905B2 (ja) | 巻取式真空蒸着装置 | |
CN101946022B (zh) | 卷绕式真空成膜装置 | |
JP5056114B2 (ja) | シートの薄膜形成装置および薄膜付きシートの製造方法 | |
KR20140050649A (ko) | 가요성 기판을 프로세싱하기 위한 방법 | |
JP2010163693A (ja) | 巻取式真空蒸着方法 | |
JP4803742B2 (ja) | 巻取式真空成膜装置 | |
JP4516444B2 (ja) | 巻取式真空成膜装置 | |
JP4613056B2 (ja) | 圧力勾配型イオンプレーティング式成膜装置および成膜方法 | |
JP2010185124A (ja) | 蒸着方法及び蒸着装置 | |
RU2449050C1 (ru) | Установка вакуумного осаждения намоточного типа | |
JP2679260B2 (ja) | 薄膜の製造方法 | |
JP2017160529A (ja) | 真空成膜装置および真空成膜方法 | |
JPS63310959A (ja) | 金属薄膜の製造方法 | |
JPH04358067A (ja) | 薄膜製造方法及び薄膜製造装置 | |
JP2000313953A (ja) | 巻取式真空蒸着方法及び装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20111018 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20111019 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4850905 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20141028 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |