JP4841158B2 - 導電性ペースト組成物およびプリント配線板 - Google Patents

導電性ペースト組成物およびプリント配線板 Download PDF

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Publication number
JP4841158B2
JP4841158B2 JP2005103932A JP2005103932A JP4841158B2 JP 4841158 B2 JP4841158 B2 JP 4841158B2 JP 2005103932 A JP2005103932 A JP 2005103932A JP 2005103932 A JP2005103932 A JP 2005103932A JP 4841158 B2 JP4841158 B2 JP 4841158B2
Authority
JP
Japan
Prior art keywords
paste composition
conductive paste
conductive
ether bond
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005103932A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006286367A (ja
Inventor
海 勉 内
島 正 幸 長
林 勝 小
金 弘 之 白
雅 行 森
杵 直 美 臼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
DNP Fine Chemicals Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
DNP Fine Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd, DNP Fine Chemicals Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP2005103932A priority Critical patent/JP4841158B2/ja
Priority to PCT/JP2006/306709 priority patent/WO2006106849A1/ja
Priority to KR1020077025031A priority patent/KR100995607B1/ko
Priority to CN2006800109671A priority patent/CN101156218B/zh
Priority to TW095111582A priority patent/TW200701259A/zh
Publication of JP2006286367A publication Critical patent/JP2006286367A/ja
Application granted granted Critical
Publication of JP4841158B2 publication Critical patent/JP4841158B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2005103932A 2005-03-31 2005-03-31 導電性ペースト組成物およびプリント配線板 Expired - Fee Related JP4841158B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005103932A JP4841158B2 (ja) 2005-03-31 2005-03-31 導電性ペースト組成物およびプリント配線板
PCT/JP2006/306709 WO2006106849A1 (ja) 2005-03-31 2006-03-30 導電性ペースト組成物およびプリント配線板
KR1020077025031A KR100995607B1 (ko) 2005-03-31 2006-03-30 도전성 페이스트 조성물 및 프린트 배선판
CN2006800109671A CN101156218B (zh) 2005-03-31 2006-03-30 导电性膏组合物和印刷线路板
TW095111582A TW200701259A (en) 2005-03-31 2006-03-31 Conductive paste composition and printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005103932A JP4841158B2 (ja) 2005-03-31 2005-03-31 導電性ペースト組成物およびプリント配線板

Publications (2)

Publication Number Publication Date
JP2006286367A JP2006286367A (ja) 2006-10-19
JP4841158B2 true JP4841158B2 (ja) 2011-12-21

Family

ID=37073405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005103932A Expired - Fee Related JP4841158B2 (ja) 2005-03-31 2005-03-31 導電性ペースト組成物およびプリント配線板

Country Status (5)

Country Link
JP (1) JP4841158B2 (enExample)
KR (1) KR100995607B1 (enExample)
CN (1) CN101156218B (enExample)
TW (1) TW200701259A (enExample)
WO (1) WO2006106849A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011046076A1 (ja) * 2009-10-15 2011-04-21 東洋紡績株式会社 導電性ペースト、導電性膜、タッチパネル、及び導電性薄膜の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10312712A (ja) 1997-05-14 1998-11-24 Asahi Chem Ind Co Ltd はんだ付け可能な導電性ペースト
JP4572023B2 (ja) * 2000-07-11 2010-10-27 株式会社槌屋 着色導電ペーストおよびそれを用いる導電積層体とその製造方法
JP4365053B2 (ja) * 2001-09-04 2009-11-18 大日本印刷株式会社 導電性ペースト組成物及びプリント配線板
JP3659348B2 (ja) * 2002-03-05 2005-06-15 三井化学株式会社 バンプの形成方法
JP2004315871A (ja) * 2003-04-15 2004-11-11 Asahi Kasei Corp 金属超微粒子の製造方法およびその製造装置

Also Published As

Publication number Publication date
CN101156218A (zh) 2008-04-02
TW200701259A (en) 2007-01-01
JP2006286367A (ja) 2006-10-19
CN101156218B (zh) 2010-12-08
TWI342571B (enExample) 2011-05-21
KR100995607B1 (ko) 2010-11-22
KR20070116673A (ko) 2007-12-10
WO2006106849A1 (ja) 2006-10-12

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