TW200701259A - Conductive paste composition and printed wiring board - Google Patents

Conductive paste composition and printed wiring board

Info

Publication number
TW200701259A
TW200701259A TW095111582A TW95111582A TW200701259A TW 200701259 A TW200701259 A TW 200701259A TW 095111582 A TW095111582 A TW 095111582A TW 95111582 A TW95111582 A TW 95111582A TW 200701259 A TW200701259 A TW 200701259A
Authority
TW
Taiwan
Prior art keywords
conductive paste
paste composition
wiring board
printed wiring
disclosed
Prior art date
Application number
TW095111582A
Other languages
English (en)
Chinese (zh)
Other versions
TWI342571B (enExample
Inventor
Tsutomu Uchimi
Masayuki Nagashima
Masaru Kobayashi
Hiroyuki Shirogane
Masayuki Mori
Naomi Usuki
Original Assignee
Dainippon Printing Co Ltd
Inctec Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Printing Co Ltd, Inctec Inc filed Critical Dainippon Printing Co Ltd
Publication of TW200701259A publication Critical patent/TW200701259A/zh
Application granted granted Critical
Publication of TWI342571B publication Critical patent/TWI342571B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW095111582A 2005-03-31 2006-03-31 Conductive paste composition and printed wiring board TW200701259A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005103932A JP4841158B2 (ja) 2005-03-31 2005-03-31 導電性ペースト組成物およびプリント配線板

Publications (2)

Publication Number Publication Date
TW200701259A true TW200701259A (en) 2007-01-01
TWI342571B TWI342571B (enExample) 2011-05-21

Family

ID=37073405

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095111582A TW200701259A (en) 2005-03-31 2006-03-31 Conductive paste composition and printed wiring board

Country Status (5)

Country Link
JP (1) JP4841158B2 (enExample)
KR (1) KR100995607B1 (enExample)
CN (1) CN101156218B (enExample)
TW (1) TW200701259A (enExample)
WO (1) WO2006106849A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011046076A1 (ja) * 2009-10-15 2011-04-21 東洋紡績株式会社 導電性ペースト、導電性膜、タッチパネル、及び導電性薄膜の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10312712A (ja) 1997-05-14 1998-11-24 Asahi Chem Ind Co Ltd はんだ付け可能な導電性ペースト
JP4572023B2 (ja) * 2000-07-11 2010-10-27 株式会社槌屋 着色導電ペーストおよびそれを用いる導電積層体とその製造方法
JP4365053B2 (ja) * 2001-09-04 2009-11-18 大日本印刷株式会社 導電性ペースト組成物及びプリント配線板
JP3659348B2 (ja) * 2002-03-05 2005-06-15 三井化学株式会社 バンプの形成方法
JP2004315871A (ja) * 2003-04-15 2004-11-11 Asahi Kasei Corp 金属超微粒子の製造方法およびその製造装置

Also Published As

Publication number Publication date
CN101156218A (zh) 2008-04-02
JP4841158B2 (ja) 2011-12-21
JP2006286367A (ja) 2006-10-19
CN101156218B (zh) 2010-12-08
TWI342571B (enExample) 2011-05-21
KR100995607B1 (ko) 2010-11-22
KR20070116673A (ko) 2007-12-10
WO2006106849A1 (ja) 2006-10-12

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees