TW200701259A - Conductive paste composition and printed wiring board - Google Patents
Conductive paste composition and printed wiring boardInfo
- Publication number
- TW200701259A TW200701259A TW095111582A TW95111582A TW200701259A TW 200701259 A TW200701259 A TW 200701259A TW 095111582 A TW095111582 A TW 095111582A TW 95111582 A TW95111582 A TW 95111582A TW 200701259 A TW200701259 A TW 200701259A
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive paste
- paste composition
- wiring board
- printed wiring
- disclosed
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005103932A JP4841158B2 (ja) | 2005-03-31 | 2005-03-31 | 導電性ペースト組成物およびプリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200701259A true TW200701259A (en) | 2007-01-01 |
TWI342571B TWI342571B (zh) | 2011-05-21 |
Family
ID=37073405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095111582A TW200701259A (en) | 2005-03-31 | 2006-03-31 | Conductive paste composition and printed wiring board |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4841158B2 (zh) |
KR (1) | KR100995607B1 (zh) |
CN (1) | CN101156218B (zh) |
TW (1) | TW200701259A (zh) |
WO (1) | WO2006106849A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101223408B1 (ko) * | 2009-10-15 | 2013-01-16 | 도요보 가부시키가이샤 | 도전성 페이스트, 도전성 막, 터치 패널 및 도전성 박막의 제조 방법 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10312712A (ja) | 1997-05-14 | 1998-11-24 | Asahi Chem Ind Co Ltd | はんだ付け可能な導電性ペースト |
JP4572023B2 (ja) * | 2000-07-11 | 2010-10-27 | 株式会社槌屋 | 着色導電ペーストおよびそれを用いる導電積層体とその製造方法 |
JP4365053B2 (ja) * | 2001-09-04 | 2009-11-18 | 大日本印刷株式会社 | 導電性ペースト組成物及びプリント配線板 |
JP3659348B2 (ja) * | 2002-03-05 | 2005-06-15 | 三井化学株式会社 | バンプの形成方法 |
JP2004315871A (ja) * | 2003-04-15 | 2004-11-11 | Asahi Kasei Corp | 金属超微粒子の製造方法およびその製造装置 |
-
2005
- 2005-03-31 JP JP2005103932A patent/JP4841158B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-30 CN CN2006800109671A patent/CN101156218B/zh not_active Expired - Fee Related
- 2006-03-30 WO PCT/JP2006/306709 patent/WO2006106849A1/ja active Application Filing
- 2006-03-30 KR KR1020077025031A patent/KR100995607B1/ko not_active IP Right Cessation
- 2006-03-31 TW TW095111582A patent/TW200701259A/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP4841158B2 (ja) | 2011-12-21 |
KR20070116673A (ko) | 2007-12-10 |
CN101156218B (zh) | 2010-12-08 |
WO2006106849A1 (ja) | 2006-10-12 |
JP2006286367A (ja) | 2006-10-19 |
CN101156218A (zh) | 2008-04-02 |
TWI342571B (zh) | 2011-05-21 |
KR100995607B1 (ko) | 2010-11-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200745260A (en) | Thermosetting resin composition and uses thereof | |
MY150635A (en) | Resin composition and resin coated copper foil obtained by using the resin composition | |
TW200604226A (en) | Radiation-sensitive composition, multilayer body and method for producing same, and electronic component | |
WO2009005042A1 (ja) | 金属材料、その製造方法、及びそれを用いた電気電子部品 | |
TW200641034A (en) | Composition | |
WO2010144792A9 (en) | Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith | |
MY161045A (en) | Resin composition for forming adhesive layer of multilayer flexible printed wiring board, resin varnish, resin coated copper foil, method for manufacturing resin coated copper foil for manufacturing multilayer flexible printed wiring board, and multilayer flexible printed wiring board | |
MY143372A (en) | Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin | |
WO2007120203A3 (en) | Flame retardant compositions with a phosphorated compound | |
TW200734377A (en) | Phenol resin and resin composition | |
WO2013032739A3 (en) | Epoxybenzyl-terminated poly(arylene ether)s, method for preparation thereof, and curable compositions comprising same | |
WO2009038166A1 (ja) | エポキシ樹脂組成物 | |
MY169238A (en) | Resin composition, metal foil provided with resin layer, metal clad laminate, and printed wiring board | |
TW200619257A (en) | Epoxyresin compositions and articles | |
TW200746935A (en) | Heat-radiating insulating resin composition and printed wiring board using the same | |
MY149267A (en) | Conductive paste | |
EP2528066A4 (en) | ELECTRON BEAM CURABLE ELECTROCONDUCTIVE PASTE AND METHOD FOR MANUFACTURING CIRCUIT BOARD USING THE SAME | |
WO2009075079A1 (ja) | 回路板、回路板の製造方法およびカバーレイフィルム | |
WO2008111309A1 (ja) | 認識マークおよび回路基板の製造方法 | |
CN105538387A (zh) | 一种pcb钻孔用盖板 | |
TW200701259A (en) | Conductive paste composition and printed wiring board | |
CN103483900A (zh) | 一种金属漆填料 | |
TW200703372A (en) | Conductive paste composition and printed wiring board | |
CN102166878A (zh) | 一种覆厚铜层压板的制备方法 | |
TW200642096A (en) | Flexible package structure and applications thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |