KR100995607B1 - 도전성 페이스트 조성물 및 프린트 배선판 - Google Patents
도전성 페이스트 조성물 및 프린트 배선판 Download PDFInfo
- Publication number
- KR100995607B1 KR100995607B1 KR1020077025031A KR20077025031A KR100995607B1 KR 100995607 B1 KR100995607 B1 KR 100995607B1 KR 1020077025031 A KR1020077025031 A KR 1020077025031A KR 20077025031 A KR20077025031 A KR 20077025031A KR 100995607 B1 KR100995607 B1 KR 100995607B1
- Authority
- KR
- South Korea
- Prior art keywords
- conductive paste
- paste composition
- ether bond
- resin
- wiring board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005103932A JP4841158B2 (ja) | 2005-03-31 | 2005-03-31 | 導電性ペースト組成物およびプリント配線板 |
JPJP-P-2005-00103932 | 2005-03-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070116673A KR20070116673A (ko) | 2007-12-10 |
KR100995607B1 true KR100995607B1 (ko) | 2010-11-22 |
Family
ID=37073405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020077025031A KR100995607B1 (ko) | 2005-03-31 | 2006-03-30 | 도전성 페이스트 조성물 및 프린트 배선판 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4841158B2 (zh) |
KR (1) | KR100995607B1 (zh) |
CN (1) | CN101156218B (zh) |
TW (1) | TW200701259A (zh) |
WO (1) | WO2006106849A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101223408B1 (ko) * | 2009-10-15 | 2013-01-16 | 도요보 가부시키가이샤 | 도전성 페이스트, 도전성 막, 터치 패널 및 도전성 박막의 제조 방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10312712A (ja) | 1997-05-14 | 1998-11-24 | Asahi Chem Ind Co Ltd | はんだ付け可能な導電性ペースト |
JP2004315871A (ja) | 2003-04-15 | 2004-11-11 | Asahi Kasei Corp | 金属超微粒子の製造方法およびその製造装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4572023B2 (ja) * | 2000-07-11 | 2010-10-27 | 株式会社槌屋 | 着色導電ペーストおよびそれを用いる導電積層体とその製造方法 |
JP4365053B2 (ja) * | 2001-09-04 | 2009-11-18 | 大日本印刷株式会社 | 導電性ペースト組成物及びプリント配線板 |
JP3659348B2 (ja) * | 2002-03-05 | 2005-06-15 | 三井化学株式会社 | バンプの形成方法 |
-
2005
- 2005-03-31 JP JP2005103932A patent/JP4841158B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-30 CN CN2006800109671A patent/CN101156218B/zh not_active Expired - Fee Related
- 2006-03-30 WO PCT/JP2006/306709 patent/WO2006106849A1/ja active Application Filing
- 2006-03-30 KR KR1020077025031A patent/KR100995607B1/ko not_active IP Right Cessation
- 2006-03-31 TW TW095111582A patent/TW200701259A/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10312712A (ja) | 1997-05-14 | 1998-11-24 | Asahi Chem Ind Co Ltd | はんだ付け可能な導電性ペースト |
JP2004315871A (ja) | 2003-04-15 | 2004-11-11 | Asahi Kasei Corp | 金属超微粒子の製造方法およびその製造装置 |
Also Published As
Publication number | Publication date |
---|---|
JP4841158B2 (ja) | 2011-12-21 |
KR20070116673A (ko) | 2007-12-10 |
CN101156218B (zh) | 2010-12-08 |
WO2006106849A1 (ja) | 2006-10-12 |
JP2006286367A (ja) | 2006-10-19 |
CN101156218A (zh) | 2008-04-02 |
TW200701259A (en) | 2007-01-01 |
TWI342571B (zh) | 2011-05-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100894663B1 (ko) | 도전성 페이스트 조성물 및 프린트 배선판 | |
KR100476285B1 (ko) | 관통 구멍 배선판 | |
KR101225497B1 (ko) | 도전성 접착제와 그 제조 방법 및 이를 포함하는 전자 장치 | |
EP0955795A2 (en) | Conductive paste for filing via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same | |
JPH0467509A (ja) | 導電性ペースト及び導電性塗膜 | |
JPH0412595A (ja) | 導電性ペースト組成物 | |
JP4365053B2 (ja) | 導電性ペースト組成物及びプリント配線板 | |
JP2008047487A (ja) | 導電性ペースト組成物およびプリント配線板 | |
JP4173241B2 (ja) | プリント配線板層間接続バンプ用硬化性導電ペースト | |
KR100995607B1 (ko) | 도전성 페이스트 조성물 및 프린트 배선판 | |
JP2009205899A (ja) | 導電性ペースト組成物およびプリント配線板 | |
KR100985141B1 (ko) | 도전성 페이스트 조성물 및 프린트 배선판 | |
JP2009205908A (ja) | 導電性ペースト組成物およびプリント配線板 | |
JP4589785B2 (ja) | 導電性ペースト組成物およびプリント配線板 | |
JP4841159B2 (ja) | 導電性ペースト組成物およびプリント配線板 | |
JP3876679B2 (ja) | 樹脂組成物とその利用 | |
JP4841157B2 (ja) | 導電性ペースト組成物およびプリント配線板 | |
JP4841160B2 (ja) | 導電性ペースト組成物およびプリント配線板 | |
JPH10247419A (ja) | 導電ペースト及びこれを用いた印刷アンテナ回路を有する非接触icカード | |
JP3659348B2 (ja) | バンプの形成方法 | |
JP5691450B2 (ja) | バンプ形成用導電性樹脂組成物 | |
JP2021143226A (ja) | 金属ペースト及び端面形成用電極ペースト | |
JP2012164696A (ja) | バンプ形成用導電性ペースト | |
JPH10334734A (ja) | 導電性銅ペースト組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20131105 Year of fee payment: 4 |
|
FPAY | Annual fee payment |
Payment date: 20141010 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20151106 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20161104 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20171103 Year of fee payment: 8 |
|
LAPS | Lapse due to unpaid annual fee |