JP4837608B2 - カメラモジュール及びその製造方法並びにカメラモジュール用プリント回路基板 - Google Patents
カメラモジュール及びその製造方法並びにカメラモジュール用プリント回路基板 Download PDFInfo
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- JP4837608B2 JP4837608B2 JP2007077880A JP2007077880A JP4837608B2 JP 4837608 B2 JP4837608 B2 JP 4837608B2 JP 2007077880 A JP2007077880 A JP 2007077880A JP 2007077880 A JP2007077880 A JP 2007077880A JP 4837608 B2 JP4837608 B2 JP 4837608B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 238000000034 method Methods 0.000 title claims description 13
- 238000007747 plating Methods 0.000 claims description 112
- 239000000758 substrate Substances 0.000 claims description 79
- 239000010410 layer Substances 0.000 claims description 71
- 239000011229 interlayer Substances 0.000 claims description 11
- 238000009713 electroplating Methods 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910002711 AuNi Inorganic materials 0.000 claims description 3
- 229910007116 SnPb Inorganic materials 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 239000002313 adhesive film Substances 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 claims description 2
- 239000011241 protective layer Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
- H03K17/962—Capacitive touch switches
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
- H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
- H03K2217/96—Touch switches
- H03K2217/9607—Capacitive touch switches
- H03K2217/960735—Capacitive touch switches characterised by circuit details
- H03K2217/96074—Switched capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/0949—Pad close to a hole, not surrounding the hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Studio Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
電解メッキ工程は、プリント回路基板110をメッキ槽に挿入し、前記下部基板115に形成されたメッキライン116を介して陰極の電流を流す。これにより、陰極の電流は、メッキライン116及びビア孔118を介して上部基板111のメッキパターン113に流れるようになることによって、陰極電流が流れるメッキパターン113の表面に所定厚のメッキ層114が形成され得る。メッキパターン113にメッキ層114が形成されて、電極端子112として機能する。
Claims (16)
- 上面に電極端子が形成されたプリント回路基板と、
前記プリント回路基板上に搭載されたイメージセンサと、
前記プリント回路基板上に結合されたハウジングと、
前記ハウジングに結合されたレンズ部と、を含み、
前記プリント回路基板は、
下部基板と、
前記下部基板上に配置された上部基板と、
前記上部基板と前記下部基板の間に付着されたボンディングシートと、
前記上部基板と前記下部基板の間に配置されたメッキラインと、
前記下部基板、前記ボンディングシート及び上部基板を貫通し、前記メッキラインと前記電極端子を相互連結させる層間接続部と、を含み、
前記メッキラインは、前記ボンディングシートに付着され、一側面が前記プリント回路基板の側面に突出しないように露出されるカメラモジュール。 - 前記ボンディングシートは、プリプレグ又は接着フィルムを含む請求項1に記載のカメラモジュール。
- 前記電極端子は、前記上部基板上に形成されたメッキパターンと、前記メッキパターンの一部の上に形成されたメッキ層を含み、
前記メッキパターンは、前記層間接続部の一端部が貫通されて電気的に連結される請求項1に記載のカメラモジュール。 - 前記層間接続部は、ビア又はビア孔からなる請求項1に記載のカメラモジュール。
- 前記メッキ層の厚さは、少なくとも5000Åである請求項3に記載のカメラモジュール。
- 前記メッキ層は、Au、Sn、Ag、SnPb合金、Ni、AuNi合金の少なくとも一つを含む請求項5に記載のカメラモジュール。
- 前記レンズ部は、1つ以上のレンズ及びフィルタを備えたレンズバレルを含む請求項1に記載のカメラモジュール。
- 前記上部基板又は前記下部基板の下面に配線パターンを含む請求項1に記載のカメラモジュール。
- カメラモジュール用プリント回路基板において、
前記プリント回路基板は、
下部基板と、
上面に電極端子を有し、前記下部基板上に配置された上部基板と、
前記上部基板と前記下部基板の間に付着されたボンディングシートと、
前記上部基板と前記下部基板の間に配置されたメッキラインと、
前記下部基板、前記ボンディングシート及び上部基板を貫通し、前記メッキラインと前記電極端子を相互連結させる層間接続部と、を含み、
前記メッキラインは、前記ボンディングシートに付着され、一側面が前記プリント回路基板の側面に突出しないように露出されるカメラモジュール用プリント回路基板。 - 前記メッキラインは、前記ボンディングシートと前記下部基板の間に複数個配置され、
前記メッキラインの一側面は、前記プリント回路基板の側面にそれぞれ露出される請求項9に記載のカメラモジュール用プリント回路基板。 - 下部基板と上部基板の間にボンディングシートを配置し、前記ボンディングシートと前記下部基板の間にメッキラインを形成し、少なくともトップ層に配線パターンが形成されたプリント回路基板を形成するステップと、
前記メッキラインとトップ層パターンとを層間接続部で接続するステップと、
前記トップ層の配線パターンのうち、メッキパターンを除いた領域にパターン保護層を形成するステップと、
前記メッキラインに電極を接続して、前記メッキパターンの表面にメッキ層を形成するステップと、
前記プリント回路基板にイメージセンサを搭載するステップと、
前記プリント回路基板の上にレンズを備えたハウジングを結合するステップと、
前記プリント回路基板を、予め決められた大きさにカットするステップと、を含み、
前記ボンディングシートと前記下部基板の間に配置された前記メッキラインは、カットされた側面が前記プリント回路基板の側面に突出しないように露出されるカメラモジュールの製造方法。 - 前記層間接続部は、1つ以上のビア孔又は/及びビアを含む請求項11に記載のカメラモジュールの製造方法。
- 前記メッキラインは、1つ以上形成されている請求項11に記載のカメラモジュールの製造方法。
- 前記メッキ層は、電解又は電気メッキ工程により形成されている請求項11に記載のカメラモジュールの製造方法。
- 前記イメージセンサの搭載ステップは、イメージセンサをプリント回路基板のトップ層に接着するステップと、前記イメージセンサの電極パッドとメッキ層が形成されたメッキパターンにワイヤーにより接続するステップと、を含む請求項11に記載のカメラモジュールの製造方法。
- 前記メッキ層は、Au、Sn、Ag、SnPb合金、Ni、AuNi合金のうちの何れか1つの材質で形成されている請求項11に記載のカメラモジュールの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060026478A KR20070096303A (ko) | 2006-03-23 | 2006-03-23 | 카메라 모듈용 인쇄회로기판 및 그 제조 방법 |
KR10-2006-0026478 | 2006-03-23 |
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Publication Number | Publication Date |
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JP2007259459A JP2007259459A (ja) | 2007-10-04 |
JP4837608B2 true JP4837608B2 (ja) | 2011-12-14 |
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JP2007077880A Active JP4837608B2 (ja) | 2006-03-23 | 2007-03-23 | カメラモジュール及びその製造方法並びにカメラモジュール用プリント回路基板 |
Country Status (3)
Country | Link |
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US (1) | US7665915B2 (ja) |
JP (1) | JP4837608B2 (ja) |
KR (1) | KR20070096303A (ja) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100816844B1 (ko) * | 2006-12-14 | 2008-03-26 | 삼성전기주식회사 | 이미지센서 모듈과 그 제조 방법 및 이를 포함하는 카메라모듈 |
CN100576555C (zh) * | 2007-08-09 | 2009-12-30 | 佛山普立华科技有限公司 | 影像装置 |
CN100592131C (zh) * | 2007-10-24 | 2010-02-24 | 鸿富锦精密工业(深圳)有限公司 | 摄像模组 |
KR100955464B1 (ko) * | 2007-11-15 | 2010-04-29 | 삼성전기주식회사 | 인쇄회로기판 |
US9350976B2 (en) * | 2007-11-26 | 2016-05-24 | First Sensor Mobility Gmbh | Imaging unit of a camera for recording the surroundings with optics uncoupled from a circuit board |
KR100928011B1 (ko) * | 2007-12-20 | 2009-11-24 | 삼성전기주식회사 | 이미지센서 모듈과 그 제조방법, 그리고 이를 포함하는카메라 모듈 |
US8482664B2 (en) | 2008-10-16 | 2013-07-09 | Magna Electronics Inc. | Compact camera and cable system for vehicular applications |
KR101067038B1 (ko) * | 2008-11-27 | 2011-09-22 | 삼성전기주식회사 | 측면 컨택홀 패드를 갖는 인쇄회로기판 및 그 제조방법 |
EP2394426A4 (en) | 2009-02-06 | 2013-02-20 | Magna Electronics Inc | IMPROVED CAMERA FOR A VEHICLE |
US8355628B2 (en) * | 2009-03-06 | 2013-01-15 | Visera Technologies Company Limited | Compact camera module |
KR101589499B1 (ko) * | 2009-05-08 | 2016-01-28 | 삼성전자주식회사 | 촬상 소자 위치 세팅 방법 |
GB0912126D0 (en) * | 2009-07-13 | 2009-08-26 | St Microelectronics Res & Dev | Lens assembly and method of assembling lens elements in a lens mounting |
KR101737478B1 (ko) * | 2009-12-14 | 2017-05-19 | 엘지이노텍 주식회사 | 카메라 모듈 및 그 제조 방법 |
KR101139368B1 (ko) * | 2010-07-15 | 2012-04-26 | 엘지이노텍 주식회사 | 카메라 모듈 |
CN102375297B (zh) * | 2010-08-12 | 2014-12-03 | 鸿富锦精密工业(深圳)有限公司 | 相机模组 |
TWI463207B (zh) * | 2010-08-19 | 2014-12-01 | Hon Hai Prec Ind Co Ltd | 相機模組 |
CN102572229A (zh) * | 2010-12-29 | 2012-07-11 | 鸿富锦精密工业(深圳)有限公司 | 摄像模组 |
JP2013130657A (ja) * | 2011-12-20 | 2013-07-04 | Fujitsu Component Ltd | カメラモジュール及びその製造方法 |
US8806743B2 (en) * | 2012-08-07 | 2014-08-19 | Excelitas Technologies Singapore Pte. Ltd | Panelized process for SMT sensor devices |
CN103687368B (zh) * | 2012-08-30 | 2017-12-22 | 深圳富泰宏精密工业有限公司 | 防护结构及具有该防护结构的电子装置 |
KR20160000293A (ko) | 2014-06-24 | 2016-01-04 | 삼성전자주식회사 | 탭 핀에 타이바가 없는 반도체 모듈 |
DE102014220229A1 (de) * | 2014-10-07 | 2016-04-07 | Robert Bosch Gmbh | Optische Detektorvorrichtung und entsprechendes Herstellungsverfahren |
KR102435127B1 (ko) * | 2015-07-06 | 2022-08-24 | 삼성전기주식회사 | 인쇄회로기판 및 이를 포함하는 카메라 모듈 |
KR102406627B1 (ko) * | 2015-10-21 | 2022-06-08 | 엘지이노텍 주식회사 | 카메라 모듈 |
US10560613B2 (en) | 2015-11-05 | 2020-02-11 | Magna Electronics Inc. | Vehicle camera with modular construction |
US10351072B2 (en) | 2015-11-05 | 2019-07-16 | Magna Electronics Inc. | Vehicle camera with modular construction |
US10230875B2 (en) | 2016-04-14 | 2019-03-12 | Magna Electronics Inc. | Camera for vehicle vision system |
US10250004B2 (en) | 2015-11-05 | 2019-04-02 | Magna Electronics Inc. | Method of forming a connector for an electrical cable for electrically connecting to a camera of a vehicle |
US10142532B2 (en) | 2016-04-08 | 2018-11-27 | Magna Electronics Inc. | Camera for vehicle vision system |
US10237456B2 (en) | 2016-08-22 | 2019-03-19 | Magna Electronics Inc. | Vehicle camera assembly process |
CN108134898B (zh) * | 2018-01-30 | 2020-04-10 | 维沃移动通信有限公司 | 一种摄像头模组、摄像头模组的组装方法及移动终端 |
KR102058865B1 (ko) * | 2018-04-12 | 2019-12-24 | (주)아이엠 | 초가속 열소재를 이용한 발열 디바이스 및 이의 제조방법 |
CN109862245B (zh) * | 2019-02-21 | 2021-04-30 | 信利光电股份有限公司 | 一种防pcb漏光的摄像模组 |
KR20210023195A (ko) * | 2019-08-22 | 2021-03-04 | 삼성전자주식회사 | 인쇄 회로 기판을 포함하는 카메라 모듈 및 이를 포함하는 전자 장치 |
US11936968B2 (en) * | 2021-04-21 | 2024-03-19 | Lg Innotek Co., Ltd. | Circuit board, an image sensor module, a lens driving device, and a camera module including the same |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0335594A (ja) * | 1989-07-03 | 1991-02-15 | Matsushita Electric Works Ltd | 多層プリント配線板の加工方法 |
JPH0675414B2 (ja) | 1991-01-23 | 1994-09-21 | 山一電機株式会社 | 電源安定化用ic内蔵コネクタ |
JPH1079567A (ja) * | 1996-09-03 | 1998-03-24 | Fujitsu Ten Ltd | プリント基板の構造 |
JPH11135953A (ja) * | 1997-10-30 | 1999-05-21 | Matsushita Electric Works Ltd | 多層プリント配線板およびその製造方法 |
KR100491179B1 (ko) * | 2001-11-21 | 2005-05-24 | 마츠시타 덴끼 산교 가부시키가이샤 | 박형 회로기판 및 박형 회로기판의 제조방법 |
JP2003243564A (ja) * | 2002-02-08 | 2003-08-29 | Samsung Electro Mech Co Ltd | プリント回路基板ストリップのメッキのための設計方法及びこれを用いた半導体チップパッケージの製造方法 |
TWI236754B (en) * | 2003-04-18 | 2005-07-21 | Phoenix Prec Technology Corp | Method for plating metal layer over isolated pads on substrate for semiconductor package substrate |
JP4354321B2 (ja) * | 2004-03-29 | 2009-10-28 | シャープ株式会社 | 固体撮像素子パッケージ、半導体パッケージ、カメラモジュール、及び固体撮像素子パッケージの製造方法 |
JP2005322682A (ja) * | 2004-05-06 | 2005-11-17 | Nippon Steel Chem Co Ltd | 積層体及びこれを用いたフレキシブル回路基板 |
JP4091593B2 (ja) * | 2004-11-05 | 2008-05-28 | Smk株式会社 | オートフォーカス機能付カメラモジュールとモジュール用コネクタの接続構造 |
KR100704980B1 (ko) * | 2005-11-28 | 2007-04-09 | 삼성전기주식회사 | 카메라 모듈 패키지 |
US7539412B2 (en) * | 2006-05-17 | 2009-05-26 | Terrasem Co. Ltd. | Camera module with first and second image sensor chips, holders and lens |
US7679167B2 (en) * | 2007-01-08 | 2010-03-16 | Visera Technologies Company, Limited | Electronic assembly for image sensor device and fabrication method thereof |
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US20070223913A1 (en) | 2007-09-27 |
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