CN100576555C - 影像装置 - Google Patents

影像装置 Download PDF

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CN100576555C
CN100576555C CN200710201326A CN200710201326A CN100576555C CN 100576555 C CN100576555 C CN 100576555C CN 200710201326 A CN200710201326 A CN 200710201326A CN 200710201326 A CN200710201326 A CN 200710201326A CN 100576555 C CN100576555 C CN 100576555C
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CN101364605A (zh
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林文华
叶陈光
黄翔
谢万成
莫绍光
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Premier Image Technology China Ltd
Hon Hai Precision Industry Co Ltd
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Hon Hai Precision Industry Co Ltd
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Abstract

一种影像装置，其包括一个电路基板、一个影像感测器，所述影像感测器包括设有感测区的顶面及与顶面相对的底面，该影像装置进一步包括一个定位片，该定位片有一承载面，所述定位片的承载面沿垂直承载面方向凸设有至少一凸起。所述电路基板对应所述至少一凸起开设有至少一贯穿开口。该电路基板固设于定位片的承载面上。所述凸起由所述电路基板的贯穿开口处穿出，所述影像感测器通过其底面固设在所述定位片的凸起上。本发明的影像装置可提高影像感测器的平面度。

Description

影像装置
技术领域
本发明涉及一种影像装置，尤其涉及一种影像感测器定位平面度高的影像装置。
背景技术
如图1所示，为现有的影像摄取模块，其是在电路基板90上设有一影像感测器91，相关的电子电路92。影像感测器91设置在电路基板90上，并由接线93实现电路基板90和影像感测器91的电性连接的目的。然而，使用影像感测器91作为数码相机或数码摄相机的影像摄取元件时，经常会因为电路基板90与影像感测器91的电性连接制程中，例如，表面贴装技术(SMT)时，影像感测器91以若干锡球电性连接电路基板90的接合厚度并非均一或者整个电路基板90的高度也可能存在高度不均一的状况。致使影像感测器91无法与电路基板90完全贴装而易产生影像感测器91平面度不高同时发生倾斜现象。影像感测器91定位精度不高，装上镜头座后，会使镜筒内的镜头光学轴心与影像感测器91光学中心产生角度偏差，导致影像感测器91呈现的影像产生慧形像差，造成影像模糊失真，从而影像数码相机或数码摄相机的质量。
发明内容
有鉴于此，有必要提供一种影像感测器定位平面度高的影像装置。
一种影像装置，其包括一个电路基板，一个影像感测器，所述影像感测器包括设有感测区的顶面及与顶面相对的底面。该影像装置进一步包括一个定位片，该定位片有一承载面。所述定位片的承载面沿垂直承载面方向凸设有至少一凸起。所述电路基板对应所述至少一凸起开设有至少一贯穿开口。该电路基板固设于定位片的承载面上。所述凸起由所述电路基板的贯穿开口处穿出，所述影像感测器通过其底面固设在所述定位片的凸起上。
相对于现有技术，本发明的影像装置的影像感测器定位于所述定位片的凸起上，而不是直接定位于电路基板上，所述影像感测器与所述电路基板之间不接触，不受电路基板平整度的影响，如此可提高影像感测器的定位平面度。
附图说明
图1是现有的成像装置的立体图；
图2是本发明第一实施例的成像装置的立体分解图；
图3是图2的第一实施例的成像装置的立体图；
图4是图3中成像装置沿IV-IV线的剖视图；
图5是本发明第二实施例的成像装置的立体分解图。
具体实施方式
以下将结合附图对本发明作进一步的详细说明。
请一并参阅图2至图4为本发明第一实施例的影像装置100，其包括一个影像感测器10、一个定位片30、一个电路基板20。
所述影像感测器10可为CCD(Charge Coupled Device，电荷耦合组件传感器)或CMOS(Complementary Metal Oxide Semiconductor，互补性金属氧化物传感器)，其用以摄取光信号并将其转变成电信号。所述影像感测器10包括一顶面13及与所述顶部相对的底面12。该影像感测器10的顶面设有感测区11。
所述定位片30可以为金属或塑料等材质做成，其具有一承载面34，所述定位片30沿垂直所述承载面34方向凸设有一表面平面度高的凸起。本实施例中，所述凸起为一个凸台31，该凸台31用于支撑所述影像感测器10。该凸台31的尺寸小於或等于所述影像感测器10的底面12的尺寸，该凸台31的尺寸大小需保证所述影像感测器10可以通过所述凸台31平稳的固设在所述定位片30的凸台31上为准。
所述电路基板20包括一基板承载面21，所述基板承载面21对应所述定位片30的凸台31位置开设有一贯穿开口22。所述贯穿开口22的尺寸与所述定位片30的凸台31的尺寸相对应。该电路基板20固设于承载面34上使定位片30的凸台31可从所述电路基板20的贯穿开口22中穿出。所述凸台31的高度大于所述电路基板20的厚度。即，所述电路基板20固设于所述定位片30的承载面34上后，所述定位片30的凸台31的一部分略穿出于所述电路基板20。所述电路基板20与影像感测器10之间通过打线的方式或表面贴装技术相互电性连接。
实际应用中，所述凸台31的面积也可大于所述影像感测器10的底面12的面积，所述电路基板20与影像感测器10之间通过打线的方式相互电性连接，并不限于本实施例。优选地，所述凸台31的面积与所述影像感测器10的底面12的面积相当。
所述影像装置100进一步包括一胶体40。所述胶体40为黑胶，UV胶、热固胶或其他形式的胶体中的一种或几种，用于涂布于凸台31上。所述影像感测器10通过所述胶体40固设于所述凸台31上。因为定位片30的凸台31的一部分略穿出于所述电路基板20，所述电路基板20夹设于影像感测器10与所述定位片30之间，即，所述影像感测器10与电路基板20之间间隔一定距离。
请参阅图5，为本发明第二实施例的成像装置200。所述成像装置200与第一实施的成像装置100的结构基本相同，主要区别在于，定位片60的承载面64沿垂直承载面64方向凸设有二个凸起，该二个凸起为二个相对设置的凸条61，该二个凸条61的高度相等，其高度略大于所述电路基板50的厚度，所述二个凸条61之间的距离需保证所述影像感测器10可以通过所述二个凸条61平稳的固设在所述定位片60的凸条61上为准。本实施例中，所述电路基板50对应所述二个凸条61开设有二个贯穿开口52，该贯穿开口52的尺寸与定位片60的凸条61的尺寸对应，该贯穿开口52用于套接所述定位片60的凸条61。该电路基板50固设于定位片60承载面64上，定位片60的二个凸条61可分别从所述电路基板50的二个贯穿开口52中穿出。实际应用中，所述电路基板20也可对应所述二个凸条61只开设一个贯穿开口52，所述贯穿开口52的尺寸能同时容置所述二个凸条61，定位片60的二个凸条61都从该一个贯穿开口52中穿出，并不限于本实施例。
相同地，所述电路基板50固设于所述定位片60的承载面64上后，所述定位片60的凸条61的一部分略穿出于所述电路基板50。所述影像感测器10通过涂布于凸条61上的胶体40固设在所述定位片60的二个凸条61上。所述电路基板50夹设于影像感测器10与所述定位片60之间且所述影像感测器10与电路基板50之间间隔一定距离。所述电路基板50与影像感测器10之间通过打线的方式或表面贴装技术相互电性连接。
实际应用中，所述定位片60的承载面64也可沿垂直承载面64方向凸设三个或三个以上高度一致的凸条61，此时，至少有一个凸条61和其他凸条不在同一线上。对应地，所述电路基板50对应所述至少三个凸条61开设有至少三个贯穿开口52，该至少三个贯穿开口52用于套接所述定位片60的凸条61。所述电路基板50也可只开设一个贯穿开口52，该贯穿开口52可同时容置所述至少三个凸条61，该至少三个凸条61从该一个贯穿开口52中穿出，并不限于本实施例。
相对于现有技术，本发明的影像装置的影像感测器定位于所述定位片的凸起上，而不是直接定位于电路基板上。所述影像感测器与所述电路基板之间不接触，不受电路基板平整度的影响，如此可提高影像感测器的定位平面度。
另外，本领域技术人员还可在本发明精神内做其它变化，当然，这些依据本发明精神所做的变化，都应包含在本发明所要求保护的范围之内。

Claims (10)

1.一种影像装置，其包括一个电路基板、一个影像感测器，所述影像感测器包括设有感测区的顶面及与顶面相对的底面，其特征在于：所述影像装置进一步包括一个定位片、该定位片有一承载面、所述定位片的承载面沿垂直承载面方向凸设有至少一凸起，所述电路基板对应所述至少一凸起开设有至少一贯穿开口，所述电路基板固设于定位片的承载面上，所述凸起由所述电路基板的贯穿开口处穿出，所述影像感测器通过其底面固设在所述定位片的凸起上。
2.如权利要求1所述的影像装置，其特征在于：所述电路基板夹设于影像感测器与所述定位片之间，该定位片的凸起高度大于所述电路基板的厚度。
3.如权利要求1所述的影像装置，其特征在于：所述至少一凸起为一个凸台，所述凸台的尺寸小于或等于所述影像感测器的尺寸，所述影像感测器与电路基板之间通过打线方式或表面贴装技术相互电性连接。
4.如权利要求1所述的影像装置，其特征在于：所述至少一凸起为一个凸台，所述凸台的尺寸大于所述影像感测器的尺寸，所述影像感测器与电路基板之间通过打线方式相互电性连接。
5.如权利要求1所述的影像装置，其特征在于：所述至少一凸起为二个凸条，该二个凸条相对设置且高度相等。
6.如权利要求1所述的影像装置，其特征在于：所述至少一凸起为至少三个高度一致的凸条，该至少三个凸条中至少有一凸条和其他凸条不在同一线上。
7.如权利要求5或6所述的影像装置，其特征在于：所述电路基板开设的至少一贯穿开口，每个贯穿开口的尺寸与所述凸起的尺寸对应，所述定位片的凸条分别从所述至少一个贯穿开口中穿出。
8.如权利要求5或6所述的影像装置，其特征在于：所述电路基板开设的至少一个贯穿开口为一个贯穿开口，所述凸条都容置于所述贯穿开口内，从该一个贯穿开口中穿出。
9.如权利要求5或6所述的影像装置，其特征在于：所述影像感测器与所述电路基板之间通过打线方式或表面贴装技术相互电性连接。
10.如权利要求1所述的影像装置，其特征在于：所述影像装置还包括一胶体，该胶体为黑胶、UV胶、热固胶中的一种或几种，所述影像感测器通过所述胶体固设在所述定位片的凸起上。
CN200710201326A 2007-08-09 2007-08-09 影像装置 Expired - Fee Related CN100576555C (zh)

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