JP4805450B2 - 静電チャック及び真空チャンバ内の基板処理方法 - Google Patents

静電チャック及び真空チャンバ内の基板処理方法 Download PDF

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Publication number
JP4805450B2
JP4805450B2 JP2000391452A JP2000391452A JP4805450B2 JP 4805450 B2 JP4805450 B2 JP 4805450B2 JP 2000391452 A JP2000391452 A JP 2000391452A JP 2000391452 A JP2000391452 A JP 2000391452A JP 4805450 B2 JP4805450 B2 JP 4805450B2
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Prior art keywords
chuck body
chuck
heat transfer
substrate
plenum
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Expired - Fee Related
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JP2000391452A
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Japanese (ja)
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JP2001250816A (ja
JP2001250816A5 (https=
Inventor
グレッグ セクストン，
マーク アレン ケンナード，
アラン ショエップ，
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Lam Research Corp
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Lam Research Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
JP2000391452A 1999-12-22 2000-12-22 静電チャック及び真空チャンバ内の基板処理方法 Expired - Fee Related JP4805450B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/469287 1999-12-22
US09/469,287 US6377437B1 (en) 1999-12-22 1999-12-22 High temperature electrostatic chuck

Publications (3)

Publication Number Publication Date
JP2001250816A JP2001250816A (ja) 2001-09-14
JP2001250816A5 JP2001250816A5 (https=) 2009-01-08
JP4805450B2 true JP4805450B2 (ja) 2011-11-02

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JP2000391452A Expired - Fee Related JP4805450B2 (ja) 1999-12-22 2000-12-22 静電チャック及び真空チャンバ内の基板処理方法

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US (2) US6377437B1 (https=)
EP (1) EP1111661B1 (https=)
JP (1) JP4805450B2 (https=)
AT (1) ATE362650T1 (https=)
DE (1) DE60034862T2 (https=)
TW (1) TW487951B (https=)

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CN105431924B (zh) * 2014-04-09 2020-11-17 应用材料公司 用于解决具有改良的流动均匀性/气体传导性的可变的处理容积的对称腔室主体设计架构
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CN107636197B (zh) * 2015-06-05 2020-01-07 应用材料公司 赋予掺杂硼的碳膜静电夹持及极佳颗粒性能的渐变原位电荷捕捉层
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JP6873178B2 (ja) * 2019-03-26 2021-05-19 日本碍子株式会社 半導体製造装置用部材、その製法及び成形型
KR102917087B1 (ko) * 2019-05-24 2026-01-22 어플라이드 머티어리얼스, 인코포레이티드 기판 프로세싱 챔버
KR102615216B1 (ko) * 2020-05-15 2023-12-15 세메스 주식회사 정전 척, 기판 처리 장치 및 기판 처리 방법

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Also Published As

Publication number Publication date
TW487951B (en) 2002-05-21
DE60034862D1 (de) 2007-06-28
EP1111661B1 (en) 2007-05-16
EP1111661A3 (en) 2004-02-04
US6567258B2 (en) 2003-05-20
US20020075625A1 (en) 2002-06-20
ATE362650T1 (de) 2007-06-15
JP2001250816A (ja) 2001-09-14
DE60034862T2 (de) 2008-01-24
EP1111661A2 (en) 2001-06-27
US6377437B1 (en) 2002-04-23

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