JP4802520B2 - 固体撮像装置及びその製造方法 - Google Patents

固体撮像装置及びその製造方法 Download PDF

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Publication number
JP4802520B2
JP4802520B2 JP2005062714A JP2005062714A JP4802520B2 JP 4802520 B2 JP4802520 B2 JP 4802520B2 JP 2005062714 A JP2005062714 A JP 2005062714A JP 2005062714 A JP2005062714 A JP 2005062714A JP 4802520 B2 JP4802520 B2 JP 4802520B2
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JP
Japan
Prior art keywords
region
photoelectric conversion
imaging device
state imaging
solid
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Expired - Fee Related
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JP2005062714A
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English (en)
Japanese (ja)
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JP2006245499A (ja
JP2006245499A5 (enExample
Inventor
信 岩淵
一秀 横田
剛志 柳田
康 丸山
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Sony Corp
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Sony Corp
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Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2005062714A priority Critical patent/JP4802520B2/ja
Priority to US11/368,756 priority patent/US8049293B2/en
Priority to TW95107659A priority patent/TWI306663B/zh
Priority to CN2006100793691A priority patent/CN1838423B/zh
Priority to KR20060021336A priority patent/KR101222761B1/ko
Publication of JP2006245499A publication Critical patent/JP2006245499A/ja
Publication of JP2006245499A5 publication Critical patent/JP2006245499A5/ja
Priority to US12/262,805 priority patent/US7947528B2/en
Priority to US12/263,085 priority patent/US8440499B2/en
Priority to US12/829,114 priority patent/US9117710B2/en
Priority to US12/829,173 priority patent/US8309392B2/en
Priority to US12/929,985 priority patent/US8841743B2/en
Application granted granted Critical
Publication of JP4802520B2 publication Critical patent/JP4802520B2/ja
Priority to US14/803,561 priority patent/US9673249B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2005062714A 2005-03-07 2005-03-07 固体撮像装置及びその製造方法 Expired - Fee Related JP4802520B2 (ja)

Priority Applications (11)

Application Number Priority Date Filing Date Title
JP2005062714A JP4802520B2 (ja) 2005-03-07 2005-03-07 固体撮像装置及びその製造方法
US11/368,756 US8049293B2 (en) 2005-03-07 2006-03-06 Solid-state image pickup device, electronic apparatus using such solid-state image pickup device and method of manufacturing solid-state image pickup device
TW95107659A TWI306663B (en) 2005-03-07 2006-03-07 Solid-state image pickup device, electronic apparatus using such solid-state image pickup device and method of manufacturing solid-state image pickup device
CN2006100793691A CN1838423B (zh) 2005-03-07 2006-03-07 固态图像拾取器件和使用其的电子装置及制造其的方法
KR20060021336A KR101222761B1 (ko) 2005-03-07 2006-03-07 후면 조사형 고체 촬상 장치, 후면 조사형 고체 촬상 장치의 제조 방법, 카메라 및 카메라의 제조 방법
US12/263,085 US8440499B2 (en) 2005-03-07 2008-10-31 Solid-state image pickup device, electronic apparatus using such solid-state image pickup device and method of manufacturing solid-state image pickup device
US12/262,805 US7947528B2 (en) 2005-03-07 2008-10-31 Solid-state image pickup device, electronic apparatus using such solid-state image pickup device and method of manufacturing solid-state image pickup device
US12/829,114 US9117710B2 (en) 2005-03-07 2010-07-01 Solid-state image pickup device, electronic apparatus using such solid-state image pickup device and method of manufacturing solid-state image pickup device
US12/829,173 US8309392B2 (en) 2005-03-07 2010-07-01 Solid-state image pickup device, electronic apparatus using such solid-state image pickup device and method of manufacturing solid-state image pickup device
US12/929,985 US8841743B2 (en) 2005-03-07 2011-03-01 Solid-state image pickup device, electronic apparatus using such solid-state image pickup device and method of manufacturing solid-state image pickup device
US14/803,561 US9673249B2 (en) 2005-03-07 2015-07-20 Solid-state image pickup device, electronic apparatus using such solid-state image pickup device and method of manufacturing solid-state image pickup device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005062714A JP4802520B2 (ja) 2005-03-07 2005-03-07 固体撮像装置及びその製造方法

Publications (3)

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JP2006245499A JP2006245499A (ja) 2006-09-14
JP2006245499A5 JP2006245499A5 (enExample) 2007-11-08
JP4802520B2 true JP4802520B2 (ja) 2011-10-26

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JP2005062714A Expired - Fee Related JP4802520B2 (ja) 2005-03-07 2005-03-07 固体撮像装置及びその製造方法

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JP (1) JP4802520B2 (enExample)
CN (1) CN1838423B (enExample)

Families Citing this family (36)

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US8436443B2 (en) 2006-09-29 2013-05-07 Taiwan Semiconductor Manufacturing Company, Ltd. Backside depletion for backside illuminated image sensors
US20080079108A1 (en) * 2006-09-29 2008-04-03 Taiwan Semiconductor Manufacturing Company, Ltd. Method for Improving Sensitivity of Backside Illuminated Image Sensors
JP5104036B2 (ja) 2007-05-24 2012-12-19 ソニー株式会社 固体撮像素子とその製造方法及び撮像装置
JP4621719B2 (ja) * 2007-09-27 2011-01-26 富士フイルム株式会社 裏面照射型撮像素子
JP5151375B2 (ja) * 2007-10-03 2013-02-27 ソニー株式会社 固体撮像装置およびその製造方法および撮像装置
CN102983167B (zh) * 2008-03-13 2015-06-17 Soitec公司 半导体结构
KR20100004174A (ko) * 2008-07-03 2010-01-13 삼성전자주식회사 이미지 센서 및 그 제조 방법, 상기 이미지 센서를포함하는 장치 및 그 제조 방법, 이미지 센서 제조용 기판및 그 제조 방법
KR101038889B1 (ko) * 2008-11-05 2011-06-02 주식회사 동부하이텍 이미지 센서 및 그 제조 방법
KR20100076525A (ko) * 2008-12-26 2010-07-06 주식회사 동부하이텍 후면 수광 이미지센서의 제조방법
KR101545630B1 (ko) * 2008-12-26 2015-08-19 주식회사 동부하이텍 후면 수광 이미지센서의 제조방법
US20100327390A1 (en) * 2009-06-26 2010-12-30 Mccarten John P Back-illuminated image sensor with electrically biased conductive material and backside well
US20100327391A1 (en) * 2009-06-26 2010-12-30 Mccarten John P Back-illuminated image sensor with electrically biased frontside and backside
JP5552768B2 (ja) * 2009-07-27 2014-07-16 ソニー株式会社 固体撮像装置とその製造方法、及び電子機器
JP2011040536A (ja) * 2009-08-10 2011-02-24 Panasonic Corp 固体撮像素子およびその駆動方法
JP5471174B2 (ja) * 2009-08-28 2014-04-16 ソニー株式会社 固体撮像装置とその製造方法、及び電子機器
JP5442394B2 (ja) * 2009-10-29 2014-03-12 ソニー株式会社 固体撮像装置とその製造方法、及び電子機器
JP5509846B2 (ja) * 2009-12-28 2014-06-04 ソニー株式会社 固体撮像装置とその製造方法、及び電子機器
JP5621266B2 (ja) * 2010-01-27 2014-11-12 ソニー株式会社 固体撮像装置とその製造方法、並びに電子機器
JP2011204797A (ja) 2010-03-24 2011-10-13 Sony Corp 固体撮像装置とその製造方法、及び電子機器
TWI513301B (zh) * 2010-06-02 2015-12-11 新力股份有限公司 半導體裝置，固態成像裝置及相機系統
JP5577965B2 (ja) * 2010-09-02 2014-08-27 ソニー株式会社 半導体装置、および、その製造方法、電子機器
JP2012064709A (ja) 2010-09-15 2012-03-29 Sony Corp 固体撮像装置及び電子機器
JP5358747B2 (ja) 2011-03-25 2013-12-04 富士フイルム株式会社 裏面照射型固体撮像素子及びその製造方法並びに撮像装置
JP5862126B2 (ja) * 2011-09-06 2016-02-16 ソニー株式会社 撮像素子および方法、並びに、撮像装置
US8748828B2 (en) * 2011-09-21 2014-06-10 Kla-Tencor Corporation Interposer based imaging sensor for high-speed image acquisition and inspection systems
JP2014022561A (ja) 2012-07-18 2014-02-03 Sony Corp 固体撮像装置、及び、電子機器
WO2017169220A1 (ja) * 2016-03-30 2017-10-05 ソニー株式会社 受光装置、撮像装置および電子機器
CN110870071B (zh) * 2017-07-18 2024-03-22 索尼半导体解决方案公司 成像装置以及成像装置的制造方法
CN107424917A (zh) * 2017-08-07 2017-12-01 上海华力微电子有限公司 一种优化cis‑uts器件白色像素的工艺方法
JP2020080363A (ja) 2018-11-12 2020-05-28 ソニーセミコンダクタソリューションズ株式会社 撮像装置および電子機器
JP2020088063A (ja) 2018-11-20 2020-06-04 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置及び電子機器
JP2020153778A (ja) 2019-03-19 2020-09-24 ソニーセミコンダクタソリューションズ株式会社 電位測定装置
CN110518032B (zh) * 2019-09-02 2022-12-23 电子科技大学 多晶硅soi基板型光电耦合器、其集成电路及制备方法
US12356752B2 (en) 2020-01-06 2025-07-08 Sony Semiconductor Solutions Corporation Light-receiving device
WO2025134576A1 (ja) * 2023-12-20 2025-06-26 ソニーセミコンダクタソリューションズ株式会社 光検出装置及び光検出装置の製造方法並びに電子機器
CN119486295B (zh) * 2025-01-10 2025-05-06 同源微（北京）半导体技术有限公司 X射线成像检测模块及其制造方法

Family Cites Families (4)

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Publication number Priority date Publication date Assignee Title
JP3361378B2 (ja) * 1994-03-02 2003-01-07 浜松ホトニクス株式会社 半導体デバイスの製造方法
JP2871640B2 (ja) * 1996-12-18 1999-03-17 日本電気株式会社 固体撮像素子の駆動方法
JP4487369B2 (ja) * 2000-03-13 2010-06-23 ソニー株式会社 固体撮像素子及びその製造方法、並びに固体撮像素子の露光時間制御方法
JP3759435B2 (ja) * 2001-07-11 2006-03-22 ソニー株式会社 Ｘ−ｙアドレス型固体撮像素子

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CN1838423A (zh) 2006-09-27
CN1838423B (zh) 2010-11-17

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