JP4800017B2 - 半導体記憶装置 - Google Patents
半導体記憶装置 Download PDFInfo
- Publication number
- JP4800017B2 JP4800017B2 JP2005339735A JP2005339735A JP4800017B2 JP 4800017 B2 JP4800017 B2 JP 4800017B2 JP 2005339735 A JP2005339735 A JP 2005339735A JP 2005339735 A JP2005339735 A JP 2005339735A JP 4800017 B2 JP4800017 B2 JP 4800017B2
- Authority
- JP
- Japan
- Prior art keywords
- region
- source
- drain region
- regions
- drain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims description 47
- 230000015654 memory Effects 0.000 claims description 52
- 239000012782 phase change material Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 10
- 238000002955 isolation Methods 0.000 claims description 9
- 239000011159 matrix material Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 27
- 239000000463 material Substances 0.000 description 16
- 150000004770 chalcogenides Chemical class 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 150000004767 nitrides Chemical class 0.000 description 5
- 229910021332 silicide Inorganic materials 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000003870 refractory metal Substances 0.000 description 2
- 239000011669 selenium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 229910000763 AgInSbTe Inorganic materials 0.000 description 1
- 229910005542 GaSb Inorganic materials 0.000 description 1
- 229910005537 GaSeTe Inorganic materials 0.000 description 1
- 229910005872 GeSb Inorganic materials 0.000 description 1
- 229910005898 GeSn Inorganic materials 0.000 description 1
- 229910005900 GeTe Inorganic materials 0.000 description 1
- 241000255777 Lepidoptera Species 0.000 description 1
- 229910018321 SbTe Inorganic materials 0.000 description 1
- 229910018219 SeTe Inorganic materials 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910006913 SnSb Inorganic materials 0.000 description 1
- 229910004284 Te81Ge15Sb2S2 Inorganic materials 0.000 description 1
- 229910010037 TiAlN Inorganic materials 0.000 description 1
- 229910008482 TiSiN Inorganic materials 0.000 description 1
- 229910008807 WSiN Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- QRXWMOHMRWLFEY-UHFFFAOYSA-N isoniazide Chemical compound NNC(=O)C1=CC=NC=C1 QRXWMOHMRWLFEY-UHFFFAOYSA-N 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- FESBVLZDDCQLFY-UHFFFAOYSA-N sete Chemical compound [Te]=[Se] FESBVLZDDCQLFY-UHFFFAOYSA-N 0.000 description 1
- -1 silicide nitride Chemical class 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/003—Cell access
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5678—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using amorphous/crystalline phase transition storage elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0004—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/30—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/80—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/74—Array wherein each memory cell has more than one access device
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/79—Array wherein the access device being a transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8825—Selenides, e.g. GeSe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8828—Tellurides, e.g. GeSbTe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/884—Switching materials based on at least one element of group IIIA, IVA or VA, e.g. elemental or compound semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
Description
11 ソース領域
12 ドレイン領域
19 素子分離領域
20 ゲート電極
21 ゲート電極の第1の部分
22 ゲート電極の第2の部分
31 ソース線
41,42 コンタクトプラグ
51〜53 層間絶縁膜
60 不揮発性メモリ素子
61 下部電極
62 上部電極
63 記録層
71 コンタクトプラグ
72 ビット線
101 ロウデコーダ
102 カラムデコーダ
103 セルトランジスタ
W1〜Wn ワード線
B1〜Bm ビット線
MC メモリセル
P 相変化領域
Claims (6)
- 複数のソース領域及び複数のドレイン領域がマトリクス状に設けられており、複数のドレイン領域に対応してそれぞれ設けられた複数のビット線と、前記複数のソース領域に対して共通に設けられた少なくとも一つのソース線と、前記ドレイン領域と前記ビット線との間にそれぞれ接続された複数のメモリ素子とを備える半導体記憶装置であって、
第1のドレイン領域と、前記第1のドレイン領域からみて第1の方向に位置する第1のソース領域と、前記第1のドレイン領域からみて前記第1の方向と交差する第2の方向に位置する第2のソース領域と、前記第1のドレイン領域からみて前記第1の方向とは反対の第3の方向に位置する第3のソース領域と、前記第1のドレイン領域と前記第1乃至第3のソース領域との間における半導体基板上に設けられた第1のゲート電極と、前記第1のドレイン領域に接続された第1のメモリ素子とを備え、
前記第1乃至第3のソース領域には、少なくとも1つのソース線により同電位が与えられることを特徴とする半導体記憶装置。 - 前記第1のメモリ素子が相変化材料を含んでいることを特徴とする請求項1に記載の半導体記憶装置。
- 前記第2のソース領域からみて前記第1の方向に位置する第2のドレイン領域と、前記第2のソース領域からみて前記第3の方向に位置する第3のドレイン領域とを備え、前記第1のゲート電極は、前記第2のソース領域と前記第2及び第3のドレイン領域との間における前記半導体基板上にも設けられていることを特徴とする請求項1又は2に記載の半導体記憶装置。
- 前記第2のソース領域並びに前記第2及び第3のドレイン領域は其々の領域からみて前記第2の方向に位置する第1の素子分離領域と隣接し、前記第1のドレイン領域並びに前記第1及び第3のソース領域は其々の領域からみて前記第2の方向とは反対の第4の方向に位置する第2の素子分離領域と隣接することを特徴とする請求項3に記載の半導体記憶装置。
- 第4のドレイン領域と、前記第4のドレイン領域からみて前記第1の方向に位置する第4のソース領域と、前記第4のドレイン領域からみて前記第2の方向に位置する第5のソース領域と、前記第4のドレイン領域からみて前記第3の方向に位置する第6のソース領域と、前記第4のドレイン領域と前記第4乃至第6のソース領域との間における半導体基板上に設けられた第2のゲート電極と、前記第4のドレイン領域に接続された第2のメモリ素子とを更に備え、前記第4のドレイン領域並びに前記第4及び第6のソース領域は其々の領域からみて前記第4の方向に位置する前記第1の素子分離領域と隣接することを特徴とする請求項4に記載の半導体記憶装置。
- 前記第1及び第4のドレイン領域は其々前記第1及び第2のメモリ素子を介して共通のビット線に接続されることを特徴とする請求項5に記載の半導体記憶装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005339735A JP4800017B2 (ja) | 2005-11-25 | 2005-11-25 | 半導体記憶装置 |
US11/602,947 US7492033B2 (en) | 2005-11-25 | 2006-11-22 | Semiconductor memory device |
CN200610163036.7A CN1971932B (zh) | 2005-11-25 | 2006-11-27 | 半导体存储装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005339735A JP4800017B2 (ja) | 2005-11-25 | 2005-11-25 | 半導体記憶装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007149800A JP2007149800A (ja) | 2007-06-14 |
JP4800017B2 true JP4800017B2 (ja) | 2011-10-26 |
Family
ID=38086583
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005339735A Active JP4800017B2 (ja) | 2005-11-25 | 2005-11-25 | 半導体記憶装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7492033B2 (ja) |
JP (1) | JP4800017B2 (ja) |
CN (1) | CN1971932B (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7817454B2 (en) | 2007-04-03 | 2010-10-19 | Micron Technology, Inc. | Variable resistance memory with lattice array using enclosing transistors |
US7974114B2 (en) * | 2009-04-28 | 2011-07-05 | Infineon Technologies Ag | Memory cell arrangements |
JP2011192333A (ja) * | 2010-03-12 | 2011-09-29 | Elpida Memory Inc | 半導体装置 |
EP2498291B1 (en) | 2011-03-09 | 2014-12-24 | Imec | Resistive memory element and related control method |
JP5677187B2 (ja) * | 2011-05-09 | 2015-02-25 | 株式会社東芝 | 半導体記憶装置 |
WO2013018842A1 (ja) * | 2011-08-02 | 2013-02-07 | 日本電気株式会社 | 半導体装置及びその製造方法 |
JP2013077780A (ja) * | 2011-09-30 | 2013-04-25 | Seiko Instruments Inc | 半導体記憶装置及び半導体記憶素子 |
JP6296054B2 (ja) * | 2013-05-09 | 2018-03-20 | 日本電気株式会社 | 半導体装置およびその製造方法 |
CN104659204B (zh) * | 2013-11-21 | 2017-07-04 | 华邦电子股份有限公司 | 电阻式存储元件及其操作方法 |
JP6717192B2 (ja) * | 2014-06-25 | 2020-07-01 | 日本電気株式会社 | 半導体装置、および半導体装置の製造方法 |
US10818729B2 (en) * | 2018-05-17 | 2020-10-27 | Macronix International Co., Ltd. | Bit cost scalable 3D phase change cross-point memory |
JP7235865B2 (ja) | 2019-02-27 | 2023-03-08 | 長江存儲科技有限責任公司 | ビット線ドライバ装置 |
CN110635030B (zh) * | 2019-09-24 | 2021-10-01 | 华中科技大学 | 用于纳米级相变存储器单元的垂直电极配置结构 |
CN110767801B (zh) * | 2019-09-24 | 2021-09-14 | 华中科技大学 | 纳米级相变存储器单元的垂直电极配置结构的加工方法 |
KR20220145829A (ko) * | 2020-03-03 | 2022-10-31 | 소니 세미컨덕터 솔루션즈 가부시키가이샤 | 메모리 셀 및 메모리 셀 어레이 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07112064B2 (ja) * | 1986-02-10 | 1995-11-29 | 株式会社東芝 | 絶縁ゲート電界効果型トランジスタ |
US4860070A (en) * | 1987-01-09 | 1989-08-22 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor memory device comprising trench memory cells |
KR100224673B1 (ko) * | 1996-12-13 | 1999-10-15 | 윤종용 | 불휘발성 강유전체 메모리장치 및 그의 구동방법 |
JP2004079632A (ja) * | 2002-08-12 | 2004-03-11 | Toshiba Corp | 半導体集積回路装置 |
JP2004111665A (ja) * | 2002-09-19 | 2004-04-08 | Hitachi Ltd | 電子装置 |
JP4355136B2 (ja) * | 2002-12-05 | 2009-10-28 | シャープ株式会社 | 不揮発性半導体記憶装置及びその読み出し方法 |
KR100480644B1 (ko) * | 2003-02-28 | 2005-03-31 | 삼성전자주식회사 | 셀 구동 전류가 증가된 상 변화 메모리 |
JP4350459B2 (ja) | 2003-08-26 | 2009-10-21 | 株式会社ルネサステクノロジ | 不揮発性半導体記憶装置 |
KR100541816B1 (ko) * | 2003-09-19 | 2006-01-10 | 삼성전자주식회사 | 반도체 메모리에서의 데이터 리드 회로 및 데이터 리드 방법 |
-
2005
- 2005-11-25 JP JP2005339735A patent/JP4800017B2/ja active Active
-
2006
- 2006-11-22 US US11/602,947 patent/US7492033B2/en active Active
- 2006-11-27 CN CN200610163036.7A patent/CN1971932B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN1971932B (zh) | 2011-05-04 |
JP2007149800A (ja) | 2007-06-14 |
US20070120128A1 (en) | 2007-05-31 |
US7492033B2 (en) | 2009-02-17 |
CN1971932A (zh) | 2007-05-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4800017B2 (ja) | 半導体記憶装置 | |
JP4577693B2 (ja) | 不揮発性メモリ素子及びその製造方法 | |
JP4554991B2 (ja) | 相変換メモリ装置 | |
JP4847743B2 (ja) | 不揮発性メモリ素子 | |
JP4577694B2 (ja) | 不揮発性メモリ素子及びその製造方法 | |
JP4628935B2 (ja) | 不揮発性半導体記憶装置 | |
JP4577692B2 (ja) | 不揮発性メモリ素子及びその製造方法 | |
US9025369B2 (en) | Resistance change nonvolatile semiconductor memory device | |
US7821865B2 (en) | Nonvolatile memory device using variable resistive elements | |
JP2007073779A (ja) | 不揮発性メモリ素子及びその製造方法 | |
JP2007129198A (ja) | 不揮発性メモリ素子及びその製造方法 | |
US20070141786A1 (en) | Method of manufacturing non-volatile memory element | |
JP2006269062A (ja) | ビットライン及び/またはワードラインの駆動能力を向上させた不揮発性メモリ装置 | |
JP5634002B2 (ja) | 相変化型不揮発性メモリ及び半導体装置 | |
US7977661B2 (en) | Memory having shared storage material | |
US20080303015A1 (en) | Memory having shared storage material | |
JP2010282989A (ja) | 半導体記憶装置及びその製造方法、並びに、データ処理システム及びデータ処理装置 | |
KR20230137145A (ko) | 가변 저항 메모리 소자 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080919 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20101108 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101116 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110111 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110802 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110803 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140812 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 4800017 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |