JP4798754B2 - エネルギー線照射装置とその方法 - Google Patents
エネルギー線照射装置とその方法 Download PDFInfo
- Publication number
- JP4798754B2 JP4798754B2 JP2005151091A JP2005151091A JP4798754B2 JP 4798754 B2 JP4798754 B2 JP 4798754B2 JP 2005151091 A JP2005151091 A JP 2005151091A JP 2005151091 A JP2005151091 A JP 2005151091A JP 4798754 B2 JP4798754 B2 JP 4798754B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- energy beam
- beam irradiation
- gas
- energy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 24
- 239000000853 adhesive Substances 0.000 claims description 49
- 230000001070 adhesive effect Effects 0.000 claims description 49
- 238000001179 sorption measurement Methods 0.000 claims description 17
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 230000001678 irradiating effect Effects 0.000 claims description 8
- 239000007789 gas Substances 0.000 description 37
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical group N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 26
- 229910001873 dinitrogen Inorganic materials 0.000 description 26
- 230000001681 protective effect Effects 0.000 description 19
- 239000004065 semiconductor Substances 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 12
- 206010040844 Skin exfoliation Diseases 0.000 description 6
- 239000011261 inert gas Substances 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 208000001840 Dandruff Diseases 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
- Y10T156/1158—Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
- Y10T156/1917—Electromagnetic radiation delaminating means [e.g., microwave, uv, ir, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Description
3 支持部材
GA ガス吐出領域
SA ウエハ吸着保持領域
A 接着剤
T 保護シート(接着シート)
W ウエハ(被着体)
Claims (6)
- 被着体に貼り付けられたエネルギー線硬化型の接着剤を有する接着シートを剥離するにあたり、前記接着剤にエネルギー線を照射し、前記接着剤を硬化させ、接着力を低下させるためのエネルギー線照射装置であって、
前記エネルギー線照射装置は、
前記被着体を吸着保持する支持部材と、
前記接着シートにエネルギー線を照射するエネルギー線照射手段とを有し、
前記支持部材は、
前記被着体の吸着保持領域と、
前記被着体の吸着保持領域の外周側に位置するガス吐出領域を有すること
を特徴とするエネルギー線照射装置。 - 前記ガス吐出領域からのガスの噴出は、密閉された空間で行なわれることを特徴とする請求項1に記載のエネルギー線照射装置。
- 前記ガス吐出領域は、吸着保持領域の外周を囲むように設けられていて、
前記ガス吐出領域からのガスの噴出は、前記吸着保持領域の吸引力により、強制的に前記吸着保持領域の外周側から当該吸着保持領域の内部方向に向けられていることを特徴とする請求項1又は2に記載のエネルギー線照射装置。 - 被着体に貼り付けられたエネルギー線硬化型の接着剤を有する接着シートを剥離するにあたり、前記接着剤にエネルギー線を照射し、前記接着剤を硬化させ、接着力を低下させるためのエネルギー線照射方法であって、
前記エネルギー線照射方法は、
支持部材が前記被着体を吸着保持した状態でエネルギー線照射手段が前記接着剤にエネルギー線を照射する際に、その被着体の吸着保持領域の外周側に位置するガス吐出領域からガスを噴出させるようにしたこと
を特徴とするエネルギー線照射方法。 - 前記ガス吐出領域からのガスの噴出は、密閉された空間で行なわれることを特徴とする請求項4に記載のエネルギー線照射方法。
- 前記ガス吐出領域からのガスの噴出は、前記吸着保持領域の吸引力により、強制的に前記吸着保持領域の外周側から当該吸着保持領域の内部方向に向けられていることを特徴とする請求項4又は5に記載のエネルギー線照射方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005151091A JP4798754B2 (ja) | 2005-05-24 | 2005-05-24 | エネルギー線照射装置とその方法 |
US11/914,713 US7858954B2 (en) | 2005-05-24 | 2006-05-10 | Apparatus and method for irradiating energy beam |
MYPI20062157A MY142278A (en) | 2005-05-24 | 2006-05-10 | Apparatus ad method for irradiating energy beam |
PCT/JP2006/309367 WO2006126390A1 (ja) | 2005-05-24 | 2006-05-10 | エネルギー線照射装置とその方法 |
KR1020077029497A KR101087292B1 (ko) | 2005-05-24 | 2006-05-10 | 에너지선 조사 장치와 그 방법 |
DE112006001346T DE112006001346T5 (de) | 2005-05-24 | 2006-05-10 | Vorrichtung und Verfahren zum Bestrahlen mit einem Energiestrahl |
TW095117321A TW200701399A (en) | 2005-05-24 | 2006-05-16 | Energy beam irradiator and irradiating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005151091A JP4798754B2 (ja) | 2005-05-24 | 2005-05-24 | エネルギー線照射装置とその方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006328151A JP2006328151A (ja) | 2006-12-07 |
JP4798754B2 true JP4798754B2 (ja) | 2011-10-19 |
Family
ID=37451816
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005151091A Expired - Fee Related JP4798754B2 (ja) | 2005-05-24 | 2005-05-24 | エネルギー線照射装置とその方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7858954B2 (ja) |
JP (1) | JP4798754B2 (ja) |
KR (1) | KR101087292B1 (ja) |
DE (1) | DE112006001346T5 (ja) |
MY (1) | MY142278A (ja) |
TW (1) | TW200701399A (ja) |
WO (1) | WO2006126390A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4637084B2 (ja) * | 2006-12-12 | 2011-02-23 | リンテック株式会社 | エネルギー線照射装置及び照射方法 |
JP2008251934A (ja) * | 2007-03-30 | 2008-10-16 | Lintec Corp | 半導体チップの製造方法 |
KR20120108229A (ko) * | 2011-03-23 | 2012-10-05 | 삼성디스플레이 주식회사 | 레이저 가공용 워크 테이블 |
JP5728265B2 (ja) * | 2011-03-29 | 2015-06-03 | リンテック株式会社 | 光照射装置および光照射方法 |
US9956755B2 (en) * | 2011-04-12 | 2018-05-01 | Tokyo Electron Limited | Separation method, separation apparatus, and separation system |
US9827756B2 (en) | 2011-04-12 | 2017-11-28 | Tokyo Electron Limited | Separation apparatus, separation system, and separation method |
JP2013141651A (ja) * | 2012-01-11 | 2013-07-22 | Lintec Corp | エネルギー線照射装置 |
JP6184717B2 (ja) * | 2013-03-28 | 2017-08-23 | 株式会社ディスコ | ウェーハ貼着装置 |
KR102516339B1 (ko) | 2018-04-06 | 2023-03-31 | 삼성전자주식회사 | 광 조사기용 덮개 구조물과 이를 구비하는 광 조사장치 및 이를 이용한 다이 접착 방법 |
CN111693368A (zh) * | 2020-06-15 | 2020-09-22 | 苏州高泰电子技术股份有限公司 | 用于晶圆切割胶带微观表征性能的测试方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4347300A (en) * | 1977-06-02 | 1982-08-31 | Polychrome Corporation | Imaging peel apart element employing two photohardenable layers |
JPH0635567B2 (ja) * | 1985-07-15 | 1994-05-11 | シチズン時計株式会社 | 紫外線照射接着装置 |
JPH0314049Y2 (ja) * | 1987-09-25 | 1991-03-28 | ||
JP2880264B2 (ja) * | 1990-07-12 | 1999-04-05 | キヤノン株式会社 | 基板保持装置 |
JP2002170866A (ja) * | 2000-12-04 | 2002-06-14 | Sony Corp | 紫外線硬化装置 |
JP4488686B2 (ja) | 2003-03-12 | 2010-06-23 | 日東電工株式会社 | 紫外線照射方法およびそれを用いた装置 |
TWI358426B (en) | 2004-03-08 | 2012-02-21 | Nitto Denko Corp | Pressure-sensitive adhesive composition, pressure- |
JP2006173450A (ja) * | 2004-12-17 | 2006-06-29 | Ihito Takahira | 紫外線照射装置 |
-
2005
- 2005-05-24 JP JP2005151091A patent/JP4798754B2/ja not_active Expired - Fee Related
-
2006
- 2006-05-10 WO PCT/JP2006/309367 patent/WO2006126390A1/ja active Application Filing
- 2006-05-10 MY MYPI20062157A patent/MY142278A/en unknown
- 2006-05-10 US US11/914,713 patent/US7858954B2/en not_active Expired - Fee Related
- 2006-05-10 DE DE112006001346T patent/DE112006001346T5/de not_active Withdrawn
- 2006-05-10 KR KR1020077029497A patent/KR101087292B1/ko not_active IP Right Cessation
- 2006-05-16 TW TW095117321A patent/TW200701399A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US7858954B2 (en) | 2010-12-28 |
KR20080021671A (ko) | 2008-03-07 |
KR101087292B1 (ko) | 2011-11-29 |
WO2006126390A1 (ja) | 2006-11-30 |
MY142278A (en) | 2010-11-15 |
DE112006001346T5 (de) | 2008-04-17 |
US20090302238A1 (en) | 2009-12-10 |
JP2006328151A (ja) | 2006-12-07 |
TW200701399A (en) | 2007-01-01 |
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